Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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12/17/2009 | DE102009021244A1 Mikroelektromechanische System-Bauelemente Microelectromechanical system components |
12/17/2009 | DE102009021083A1 Halbleiter-Bauelement und Verfahren Semiconductor device and method |
12/17/2009 | DE102008042151A1 Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device |
12/17/2009 | DE102008038852A1 Method for manufacturing of LED utilized as projection light source in e.g. automotive area, involves joining metallic layers so that extensive covalent or metallic bond is formed between layers, and removing developing substrate |
12/17/2009 | DE102008035055B3 Verfahren zur Ausrichtung einer elektronischen CMOS-Struktur bezogen auf eine vergrabene Struktur bei gebondeten und rückgedünnten Stapeln von Halbleiterscheiben A method of aligning an electronic CMOS structure based on a buried structure and bonded at rückgedünnten stacks of semiconductor wafers |
12/17/2009 | DE102008028136A1 Vorrichtung und Verfahren zum Behandeln von Halbleitersubstraten Apparatus and method for processing semiconductor substrates |
12/17/2009 | DE102008027861A1 Vorrichtung zum Halten von scheibenförmigen Objekten Apparatus for holding disc-shaped objects |
12/17/2009 | DE102008027558A1 Composition, useful for contacting contact surfaces of chip with contacts of substrate in the flip-chip assembly, comprises monomer formed by polymerization of reactive resin-matrix, lead-line body and flux compatible with matrix |
12/17/2009 | DE102008027521A1 Verfahren zum Herstellen einer Halbleiterschicht A method of manufacturing a semiconductor layer |
12/17/2009 | DE102008026636A1 Circuit support for use in integrated switching circuit to mechanically fix e.g. semiconductor component on printed circuit board, has substrate with opening adjacent to another opening and including surface not coated with metal or alloy |
12/17/2009 | DE102008026134A1 Mikrostrukturbauelement mit einer Metallisierungsstruktur mit selbstjustierten Luftspalten zwischen dichtliegenden Metallleitungen Microstructure device with a metallization with self-aligned air gaps between closely spaced metal lines |
12/17/2009 | DE102008025833A1 Verfahren und Vorrichtung zum stoffschlüssigen Fügen metallischer Anschlussstrukturen Method and apparatus for securely joining metallic connection structures |
12/17/2009 | DE102008025246A1 Method for contacting mechanical or thermal or electrical conducting connection at electrical contact surface of electronic component, involves producing contact layer between connection and contact surface |
12/17/2009 | DE102008024000A1 Method for holding flat transporting goods, particularly substrates such as silicon wafer and solar cells at transporting surface of flat belt of conveyor, involves arranging electrical field with electrical potential difference |
12/17/2009 | DE102008002832A1 Verfahren und Vorrichtung zur zerstörungsfreien Detektion von Defekten im Inneren von Halbleitermaterial Method and apparatus for non-destructive detection of defects in the interior of semiconductor material |
12/17/2009 | DE102008002391A1 Gehäuse zur Verpackung eines Bauelements und Herstellungsverfahren für ein Gehäuse Casing for packaging a device, and manufacturing method of a housing |
12/17/2009 | DE102008002324A1 Method for manufacturing micromechanical or electronic component, involves attaching substrate material and covering material with each other and relatively positioning to each other by molding tool |
12/17/2009 | DE102008002321A1 Ceroxid und partikuläres Additiv enthaltende Dispersion Cerium oxide and particulate additive dispersion containing |
12/17/2009 | DE102007019552B4 Verfahren zur Herstellung eines Substrats mit Durchführung sowie Substrat und Halbleitermodul mit Durchführung A method for producing a substrate with execution, and the substrate and the semiconductor module with conducting |
12/17/2009 | DE102004040429B4 Doppelseiten-Poliermaschine Double-side polishing machine |
12/17/2009 | DE102004029846B4 Integrierte Speicherschaltung An integrated memory circuit |
12/17/2009 | DE102004002723B4 Halbleiterbauelement mit einem SOI-Aufbau A semiconductor device with a SOI structure |
12/17/2009 | DE10132455B4 Elektrische Anordnung mit einem Kühlkörper und Verfahren zu deren Herstellung An electrical assembly with a heat sink and method for the preparation thereof |
12/17/2009 | DE10013255B4 Harzgekapselte elektronische Vorrichtung zur Verwendung in Brennkraftmaschinen Resin-encapsulated electronic device for use in internal combustion engines |
12/16/2009 | EP2133992A1 Semiconductor chip and high frequency circuit |
12/16/2009 | EP2133919A1 SOI transistor with ground plane and gate being self-aligned and with a buried oxide of varying thickness |
12/16/2009 | EP2133915A1 Semiconductor assembly with specially formed bonds and method for manufacturing the same |
12/16/2009 | EP2133911A1 Capacitor cell, integrated circuit, integrated circuit designing method, and integrated circuit manufacturing method |
12/16/2009 | EP2133910A1 Passivation method of non-radiative recombination centres of ZnO samples and passivated ZnO samples prepared by the same method. |
12/16/2009 | EP2133909A1 Semiconductor device, and its manufacturing method |
12/16/2009 | EP2133908A1 Method for manufacturing deformation silicon substrate |
12/16/2009 | EP2133907A1 Polycrystalline silicon thin layers produced by titanium-supported metal-induced layer exchange |
12/16/2009 | EP2133906A1 Semiconductor device and method for manufacturing the same |
12/16/2009 | EP2133747A1 Resin composition for micropattern formation and method of micropattern formation |
12/16/2009 | EP2133744A1 Photosensitive resin composition |
12/16/2009 | EP2133743A1 Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part |
12/16/2009 | EP2133742A1 Exposure method using pattern dependant dose control |
12/16/2009 | EP2133450A1 Substrate for epitaxial growth and method for producing nitride compound semiconductor single crystal |
12/16/2009 | EP2133445A1 Coating System and Method for Coating a Substrate |
12/16/2009 | EP2133399A1 Adhesive material, adhesive sheet, and use of the adhesive sheet |
12/16/2009 | EP2133394A1 Coating solution for surface flat insulating formation, surface flat insulating film covering base material, and process for producing surface flat insulating film covering base material |
12/16/2009 | EP2133393A2 The Surface Treatment Of Nanoparticles To Control Interfacial Properties And Method Of Manufacture |
12/16/2009 | EP2133170A1 Pressure-sensitive adhesive sheet for UV laser processing and UV laser processing method |
12/16/2009 | EP2132771A1 Method for the production of a ceramic multi-layer circuit arrangement, and multi-layer circuit arrangement produced using said method |
12/16/2009 | EP2132770A1 Method of depositing localized coatings |
12/16/2009 | EP2132769A1 Method of making a solar grade silicon wafer |
12/16/2009 | EP2132768A2 Deposition of layers of porous materials, layers thus obtained and devices containing them. |
12/16/2009 | EP2132767A1 Proximity head with angled vacuum conduit system, apparatus and method |
12/16/2009 | EP2132763A2 High throughput sem tool |
12/16/2009 | EP2132600A1 Split axes stage design for semiconductor applications |
12/16/2009 | EP2132272A1 Conformal coating comprising binder and non-conductive particulate |
12/16/2009 | EP2132253A1 Process for making siloxane polymers |
12/16/2009 | EP2131994A1 Method for producing a component using asymmetrical energy input along the parting or predetermined breaking line |
12/16/2009 | EP1756817B1 Method for producing a multilayer storage media |
12/16/2009 | EP1693614B1 Indicator lamp |
12/16/2009 | EP1632994B1 Plasma processing apparatus and plasma processing method |
12/16/2009 | EP1628363B1 Circuit member connecting structure and method of producing the same |
12/16/2009 | EP1557872B1 Plasma chemical vapor deposition method |
12/16/2009 | EP1323183B1 Method for producing a microelectronic circuit |
12/16/2009 | EP1320881B1 Method of securing solder balls and any components fixed to one and the same side of a substrate |
12/16/2009 | EP1306893B1 Plasma processing apparatus |
12/16/2009 | EP1293588B1 Plasma cvd apparatus and method |
12/16/2009 | EP0993688B1 Power semiconductor device with semi-insulating subtrate |
12/16/2009 | EP0915506B1 Silicon wafer carrier |
12/16/2009 | CN201365378Y Material box for electronic packing production |
12/16/2009 | CN201365054Y Chip carrier socket |
12/16/2009 | CN201364909Y Crystal grain fixing device |
12/16/2009 | CN201364892Y Tray turnover labeling error prevention device |
12/16/2009 | CN201364891Y Position calibration tool |
12/16/2009 | CN201364890Y Portable suction pen for semiconductor electronic industry |
12/16/2009 | CN201364889Y Wafer conveying device |
12/16/2009 | CN201364888Y Wafer conveying device |
12/16/2009 | CN201364887Y Scratchproof track |
12/16/2009 | CN201364886Y Binding force monitoring and detecting device |
12/16/2009 | CN201364885Y Identifying tool |
12/16/2009 | CN201364884Y Semiconductor encapsulation mould |
12/16/2009 | CN201364883Y Solution recovery device |
12/16/2009 | CN201364882Y Exhaust device |
12/16/2009 | CN201364881Y Heating device mounting structure |
12/16/2009 | CN201364880Y Single silicon wafer cleaning process cavity structure |
12/16/2009 | CN201361820Y Planetary grinding machine |
12/16/2009 | CN201361819Y Planetary grinding disc |
12/16/2009 | CN201361816Y Wafer grinding positioning ring |
12/16/2009 | CN101606319A Semiconductor integrated circuit device and power supply voltage control system |
12/16/2009 | CN101606241A Methods of fabricating shield plates for reduced field coupling in nonvolatile memory |
12/16/2009 | CN101606240A CMOS device with dual-epi channels and self-aligned contacts |
12/16/2009 | CN101606239A Silicon wafer evaluation method |
12/16/2009 | CN101606238A Method and apparatus for applying liquid material, and program |
12/16/2009 | CN101606237A Semiconductor device comprising circuit substrate with inspection connection pads and manufacturing method thereof |
12/16/2009 | CN101606236A Integration of non-volatile charge trap memory devices and logic CMOS devices |
12/16/2009 | CN101606235A Modifier for low dielectric constant film, and method for production thereof |
12/16/2009 | CN101606234A Etching method and recording medium |
12/16/2009 | CN101606233A Bevel clean device |
12/16/2009 | CN101606232A Pulsed ultra-high aspect ratio dielectric etch |
12/16/2009 | CN101606231A Ultra-high aspect ratio dielectric etch |
12/16/2009 | CN101606230A Method and apparatus for contained chemical surface treatment |
12/16/2009 | CN101606229A Dicing tape and semiconductor device manufacturing method |
12/16/2009 | CN101606228A Film forming method, substrate processing apparatus, and semiconductor device |
12/16/2009 | CN101606227A Placing bed structure, treating apparatus using the structure, and method for using the apparatus |
12/16/2009 | CN101606226A Advanced mixing system for integrated tool having site-isolated reactors |