Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2009
12/17/2009DE102009021244A1 Mikroelektromechanische System-Bauelemente Microelectromechanical system components
12/17/2009DE102009021083A1 Halbleiter-Bauelement und Verfahren Semiconductor device and method
12/17/2009DE102008042151A1 Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device
12/17/2009DE102008038852A1 Method for manufacturing of LED utilized as projection light source in e.g. automotive area, involves joining metallic layers so that extensive covalent or metallic bond is formed between layers, and removing developing substrate
12/17/2009DE102008035055B3 Verfahren zur Ausrichtung einer elektronischen CMOS-Struktur bezogen auf eine vergrabene Struktur bei gebondeten und rückgedünnten Stapeln von Halbleiterscheiben A method of aligning an electronic CMOS structure based on a buried structure and bonded at rückgedünnten stacks of semiconductor wafers
12/17/2009DE102008028136A1 Vorrichtung und Verfahren zum Behandeln von Halbleitersubstraten Apparatus and method for processing semiconductor substrates
12/17/2009DE102008027861A1 Vorrichtung zum Halten von scheibenförmigen Objekten Apparatus for holding disc-shaped objects
12/17/2009DE102008027558A1 Composition, useful for contacting contact surfaces of chip with contacts of substrate in the flip-chip assembly, comprises monomer formed by polymerization of reactive resin-matrix, lead-line body and flux compatible with matrix
12/17/2009DE102008027521A1 Verfahren zum Herstellen einer Halbleiterschicht A method of manufacturing a semiconductor layer
12/17/2009DE102008026636A1 Circuit support for use in integrated switching circuit to mechanically fix e.g. semiconductor component on printed circuit board, has substrate with opening adjacent to another opening and including surface not coated with metal or alloy
12/17/2009DE102008026134A1 Mikrostrukturbauelement mit einer Metallisierungsstruktur mit selbstjustierten Luftspalten zwischen dichtliegenden Metallleitungen Microstructure device with a metallization with self-aligned air gaps between closely spaced metal lines
12/17/2009DE102008025833A1 Verfahren und Vorrichtung zum stoffschlüssigen Fügen metallischer Anschlussstrukturen Method and apparatus for securely joining metallic connection structures
12/17/2009DE102008025246A1 Method for contacting mechanical or thermal or electrical conducting connection at electrical contact surface of electronic component, involves producing contact layer between connection and contact surface
12/17/2009DE102008024000A1 Method for holding flat transporting goods, particularly substrates such as silicon wafer and solar cells at transporting surface of flat belt of conveyor, involves arranging electrical field with electrical potential difference
12/17/2009DE102008002832A1 Verfahren und Vorrichtung zur zerstörungsfreien Detektion von Defekten im Inneren von Halbleitermaterial Method and apparatus for non-destructive detection of defects in the interior of semiconductor material
12/17/2009DE102008002391A1 Gehäuse zur Verpackung eines Bauelements und Herstellungsverfahren für ein Gehäuse Casing for packaging a device, and manufacturing method of a housing
12/17/2009DE102008002324A1 Method for manufacturing micromechanical or electronic component, involves attaching substrate material and covering material with each other and relatively positioning to each other by molding tool
12/17/2009DE102008002321A1 Ceroxid und partikuläres Additiv enthaltende Dispersion Cerium oxide and particulate additive dispersion containing
12/17/2009DE102007019552B4 Verfahren zur Herstellung eines Substrats mit Durchführung sowie Substrat und Halbleitermodul mit Durchführung A method for producing a substrate with execution, and the substrate and the semiconductor module with conducting
12/17/2009DE102004040429B4 Doppelseiten-Poliermaschine Double-side polishing machine
12/17/2009DE102004029846B4 Integrierte Speicherschaltung An integrated memory circuit
12/17/2009DE102004002723B4 Halbleiterbauelement mit einem SOI-Aufbau A semiconductor device with a SOI structure
12/17/2009DE10132455B4 Elektrische Anordnung mit einem Kühlkörper und Verfahren zu deren Herstellung An electrical assembly with a heat sink and method for the preparation thereof
12/17/2009DE10013255B4 Harzgekapselte elektronische Vorrichtung zur Verwendung in Brennkraftmaschinen Resin-encapsulated electronic device for use in internal combustion engines
12/16/2009EP2133992A1 Semiconductor chip and high frequency circuit
12/16/2009EP2133919A1 SOI transistor with ground plane and gate being self-aligned and with a buried oxide of varying thickness
12/16/2009EP2133915A1 Semiconductor assembly with specially formed bonds and method for manufacturing the same
12/16/2009EP2133911A1 Capacitor cell, integrated circuit, integrated circuit designing method, and integrated circuit manufacturing method
12/16/2009EP2133910A1 Passivation method of non-radiative recombination centres of ZnO samples and passivated ZnO samples prepared by the same method.
12/16/2009EP2133909A1 Semiconductor device, and its manufacturing method
12/16/2009EP2133908A1 Method for manufacturing deformation silicon substrate
12/16/2009EP2133907A1 Polycrystalline silicon thin layers produced by titanium-supported metal-induced layer exchange
12/16/2009EP2133906A1 Semiconductor device and method for manufacturing the same
12/16/2009EP2133747A1 Resin composition for micropattern formation and method of micropattern formation
12/16/2009EP2133744A1 Photosensitive resin composition
12/16/2009EP2133743A1 Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part
12/16/2009EP2133742A1 Exposure method using pattern dependant dose control
12/16/2009EP2133450A1 Substrate for epitaxial growth and method for producing nitride compound semiconductor single crystal
12/16/2009EP2133445A1 Coating System and Method for Coating a Substrate
12/16/2009EP2133399A1 Adhesive material, adhesive sheet, and use of the adhesive sheet
12/16/2009EP2133394A1 Coating solution for surface flat insulating formation, surface flat insulating film covering base material, and process for producing surface flat insulating film covering base material
12/16/2009EP2133393A2 The Surface Treatment Of Nanoparticles To Control Interfacial Properties And Method Of Manufacture
12/16/2009EP2133170A1 Pressure-sensitive adhesive sheet for UV laser processing and UV laser processing method
12/16/2009EP2132771A1 Method for the production of a ceramic multi-layer circuit arrangement, and multi-layer circuit arrangement produced using said method
12/16/2009EP2132770A1 Method of depositing localized coatings
12/16/2009EP2132769A1 Method of making a solar grade silicon wafer
12/16/2009EP2132768A2 Deposition of layers of porous materials, layers thus obtained and devices containing them.
12/16/2009EP2132767A1 Proximity head with angled vacuum conduit system, apparatus and method
12/16/2009EP2132763A2 High throughput sem tool
12/16/2009EP2132600A1 Split axes stage design for semiconductor applications
12/16/2009EP2132272A1 Conformal coating comprising binder and non-conductive particulate
12/16/2009EP2132253A1 Process for making siloxane polymers
12/16/2009EP2131994A1 Method for producing a component using asymmetrical energy input along the parting or predetermined breaking line
12/16/2009EP1756817B1 Method for producing a multilayer storage media
12/16/2009EP1693614B1 Indicator lamp
12/16/2009EP1632994B1 Plasma processing apparatus and plasma processing method
12/16/2009EP1628363B1 Circuit member connecting structure and method of producing the same
12/16/2009EP1557872B1 Plasma chemical vapor deposition method
12/16/2009EP1323183B1 Method for producing a microelectronic circuit
12/16/2009EP1320881B1 Method of securing solder balls and any components fixed to one and the same side of a substrate
12/16/2009EP1306893B1 Plasma processing apparatus
12/16/2009EP1293588B1 Plasma cvd apparatus and method
12/16/2009EP0993688B1 Power semiconductor device with semi-insulating subtrate
12/16/2009EP0915506B1 Silicon wafer carrier
12/16/2009CN201365378Y Material box for electronic packing production
12/16/2009CN201365054Y Chip carrier socket
12/16/2009CN201364909Y Crystal grain fixing device
12/16/2009CN201364892Y Tray turnover labeling error prevention device
12/16/2009CN201364891Y Position calibration tool
12/16/2009CN201364890Y Portable suction pen for semiconductor electronic industry
12/16/2009CN201364889Y Wafer conveying device
12/16/2009CN201364888Y Wafer conveying device
12/16/2009CN201364887Y Scratchproof track
12/16/2009CN201364886Y Binding force monitoring and detecting device
12/16/2009CN201364885Y Identifying tool
12/16/2009CN201364884Y Semiconductor encapsulation mould
12/16/2009CN201364883Y Solution recovery device
12/16/2009CN201364882Y Exhaust device
12/16/2009CN201364881Y Heating device mounting structure
12/16/2009CN201364880Y Single silicon wafer cleaning process cavity structure
12/16/2009CN201361820Y Planetary grinding machine
12/16/2009CN201361819Y Planetary grinding disc
12/16/2009CN201361816Y Wafer grinding positioning ring
12/16/2009CN101606319A Semiconductor integrated circuit device and power supply voltage control system
12/16/2009CN101606241A Methods of fabricating shield plates for reduced field coupling in nonvolatile memory
12/16/2009CN101606240A CMOS device with dual-epi channels and self-aligned contacts
12/16/2009CN101606239A Silicon wafer evaluation method
12/16/2009CN101606238A Method and apparatus for applying liquid material, and program
12/16/2009CN101606237A Semiconductor device comprising circuit substrate with inspection connection pads and manufacturing method thereof
12/16/2009CN101606236A Integration of non-volatile charge trap memory devices and logic CMOS devices
12/16/2009CN101606235A Modifier for low dielectric constant film, and method for production thereof
12/16/2009CN101606234A Etching method and recording medium
12/16/2009CN101606233A Bevel clean device
12/16/2009CN101606232A Pulsed ultra-high aspect ratio dielectric etch
12/16/2009CN101606231A Ultra-high aspect ratio dielectric etch
12/16/2009CN101606230A Method and apparatus for contained chemical surface treatment
12/16/2009CN101606229A Dicing tape and semiconductor device manufacturing method
12/16/2009CN101606228A Film forming method, substrate processing apparatus, and semiconductor device
12/16/2009CN101606227A Placing bed structure, treating apparatus using the structure, and method for using the apparatus
12/16/2009CN101606226A Advanced mixing system for integrated tool having site-isolated reactors