Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2009
12/17/2009US20090311865 Method for double patterning lithography
12/17/2009US20090311864 Polishing slurry
12/17/2009US20090311863 Method for producing semiconductor wafer
12/17/2009US20090311862 Method for manufacturing a semiconductor wafer
12/17/2009US20090311861 Methods of forming fine patterns in the fabrication of semiconductor devices
12/17/2009US20090311860 Blocking contacts for n-type cadmium zinc telluride
12/17/2009US20090311859 Method for enabling hard mask free integration of ultra low-k materials and structures produced thereby
12/17/2009US20090311858 Programmable via structure and method of fabricating same
12/17/2009US20090311857 Method to form ultra high quality silicon-containing compound layers
12/17/2009US20090311856 Flash memory device having recessed floating gate and method for fabricating the same
12/17/2009US20090311855 Method of fabricating a gate structure
12/17/2009US20090311854 Method for forming gate of semiconductor device
12/17/2009US20090311853 Controlling warping in integrated circuit devices
12/17/2009US20090311852 Boron-doped diamond semiconductor
12/17/2009US20090311851 Nonvolatile memory device using semiconductor nanocrystals and method forming same
12/17/2009US20090311850 Method for surface treatment of semiconductor substrates
12/17/2009US20090311849 Methods of separating integrated circuit chips fabricated on a wafer
12/17/2009US20090311848 Optical device wafer dividing method
12/17/2009US20090311847 Method for producing a semiconductor component
12/17/2009US20090311846 Method of forming shallow trench isolation regions in devices with nmos and pmos regions
12/17/2009US20090311845 One Transistor Memory Cell with Bias Gate
12/17/2009US20090311844 Alignment mark and method for fabricating the same and alignment method of semiconductor
12/17/2009US20090311843 Container capacitor structure and method of formation thereof
12/17/2009US20090311842 Method for fabricating a semiconductor memory device
12/17/2009US20090311841 Method of Manufacturing a Through-Silicon-Via On-Chip Passive MMW Bandpass Filter
12/17/2009US20090311840 Method of manufacturing semiconductor device
12/17/2009US20090311839 Method for manufacturing silicon carbide semicondutor device having trench gate structure
12/17/2009US20090311838 Method of manufacturing semiconductor device
12/17/2009US20090311837 Integrated Circuit Using Complementary Junction Field Effect Transistor and MOS Transistor in Silicon and Silicon Alloys
12/17/2009US20090311836 Extremely-thin silicon-on-insulator transistor with raised source/drain
12/17/2009US20090311835 Nanowire mosfet with doped epitaxial contacts for source and drain
12/17/2009US20090311834 Soi transistor with self-aligned ground plane and gate and buried oxide of variable thickness
12/17/2009US20090311833 Manufacturing method of semiconductor device
12/17/2009US20090311832 Flex Chip Connector For Semiconductor Device
12/17/2009US20090311831 Method for manufacturing a semiconductor device
12/17/2009US20090311830 Semiconductor package and manufacturing method thereof
12/17/2009US20090311829 Performing Die-to-Wafer Stacking by Filling Gaps Between Dies
12/17/2009US20090311828 Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers
12/17/2009US20090311827 Adhesive for electronic components, method and for manufacturing semiconductor chip laminate, and semiconductor device
12/17/2009US20090311826 Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
12/17/2009US20090311824 Method for fabricating organic light emitting display device
12/17/2009US20090311823 Solid-state image pickup device and manufacturing method thereof
12/17/2009US20090311822 Pixel sensor cell, methods and design structure including optically transparent gate
12/17/2009US20090311820 Solid-state imaging device and method for manufacturing the same
12/17/2009US20090311819 Method for Making Micro-Electromechanical System Devices
12/17/2009US20090311818 Anodic bonding method and method of producing acceleration sensor
12/17/2009US20090311816 Ac light emitting device having photonic crystal structure and method of fabricating the same
12/17/2009US20090311815 Multi-wavelength integrated semiconductor laser device and method for manufacturing same
12/17/2009US20090311814 Thin film transistor array panel for a display device and a method of manufacturing the same
12/17/2009US20090311813 Method of fabricating planar light source
12/17/2009US20090311812 Surface emitting laser and manufacturing method thereof
12/17/2009US20090311811 High power light emitting diode package and method of producing the same
12/17/2009US20090311810 Method of manufacturing bendable solid state lighting
12/17/2009US20090311809 Thin film transistor and manufacturing method thereof, and display device and manufacturing method thereof
12/17/2009US20090311808 Method for producing semiconductor wafer
12/17/2009US20090311807 Thermal processing apparatus and thermal processing method for object to be processed
12/17/2009US20090311625 Method for forming photoresist pattern and photoresist laminate
12/17/2009US20090311612 Photomask
12/17/2009US20090311522 Wafer polishing method and wafer produced thereby
12/17/2009US20090311477 Compliant Substrate In Particular For Hetero-Epitaxial Depositing
12/17/2009US20090311429 Plating method and apparatus
12/17/2009US20090311087 Apparatus for picking up semiconductor package
12/17/2009US20090310640 MOCVD GROWTH TECHNIQUE FOR PLANAR SEMIPOLAR (Al, In, Ga, B)N BASED LIGHT EMITTING DIODES
12/17/2009US20090310425 Memory devices including vertical pillars and methods of manufacturing and operating the same
12/17/2009US20090310415 Non-volatile memory devices including vertical nand strings and methods of forming the same
12/17/2009US20090310322 Semiconductor Package
12/17/2009US20090310274 Electrostatic chuck and substrate temperature control fixing apparatus
12/17/2009US20090310076 Thin Film Transistor Array For A Liquid Crystal Display Device And Related Manufacturing And Operation Methods
12/17/2009US20090310073 Array substrate for in-plane switching mode liquid crystal display device and fabricating method of the same
12/17/2009US20090310048 Array substrate for liquid crystal display device and method of manufacturing the same
12/17/2009US20090309624 Method and Device of Measuring Interface Trap Density in Semiconductor Device
12/17/2009US20090309590 Magnetic sensor and method of manufacturing thereof
12/17/2009US20090309514 Light emitting elements, light emitting devices including light emitting elements and methods for manufacturing such light emitting elements and/or devices
12/17/2009US20090309459 Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric device
12/17/2009US20090309241 Ultra thin die electronic package
12/17/2009US20090309239 Semiconductor device and manufacturing method of the semiconductor device
12/17/2009US20090309238 Molded flip chip package with enhanced mold-die adhesion
12/17/2009US20090309237 Semiconductor package system with substrate having different bondable heights at lead finger tips
12/17/2009US20090309235 Method and Apparatus for Wafer Level Integration Using Tapered Vias
12/17/2009US20090309231 Semiconductor device and method of manufacturing the same
12/17/2009US20090309230 Air gap formation and integration using a patterning cap
12/17/2009US20090309229 Silicon single electron device
12/17/2009US20090309228 Method for forming self-aligned metal silicide contacts
12/17/2009US20090309227 Fabrication of interconnects in low-k interlayer dielectrics
12/17/2009US20090309226 Interconnect Structure for Electromigration Enhancement
12/17/2009US20090309225 Top layers of metal for high performance IC's
12/17/2009US20090309222 Method and semiconductor device having copper interconnect for bonding
12/17/2009US20090309221 Semiconductor device and manufacturing method therefor
12/17/2009US20090309219 Injection molded solder ball method
12/17/2009US20090309218 Semiconductor device and method of manufacturing the same
12/17/2009US20090309217 Flip-chip interconnection with a small passivation layer opening
12/17/2009US20090309216 Wafer level package and manufacturing method thereof
12/17/2009US20090309215 Semiconductor module and method for fabricating semiconductor module
12/17/2009US20090309214 Circuit Module Turbulence Enhancement
12/17/2009US20090309213 Semiconductor device and manufacturing method of the same
12/17/2009US20090309212 Semiconductor Device and Method of Forming Stress Relief Layer Between Die and Interconnect Structure
12/17/2009US20090309211 Compliant Wirebond Pedestal
12/17/2009US20090309210 Semiconductor device and manufacturing method thereof
12/17/2009US20090309208 Semiconductor device and method of manufacturing the same
12/17/2009US20090309207 Integrated circuit package system with die and package combination
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