Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2010
06/09/2010CN101727016A Robot gripper for the reticle transfer of the exposure equipment
06/09/2010CN101727014A Photoetching method for controlling characteristic dimension and photoetching system thereof
06/09/2010CN101727009A Liquid processing apparatus and liquid processing method
06/09/2010CN101727008A Hierarchical control and cross-operation structure of working arm of gel coating developing unit
06/09/2010CN101726993A Bi-layer, tri-layer mask CD control
06/09/2010CN101726992A Exposure mask for forming a photodiode and method of manufacturing the image sensor using the exposure mask
06/09/2010CN101726989A Method for manufacturing base plate with recognized mark
06/09/2010CN101726988A Design and layout of phase shifting photolithographic masks
06/09/2010CN101726948A Method of manufacturing liquid crystal display device
06/09/2010CN101726947A Array substrate for liquid crystal display device and manufacturing method thereof, liquid crystal display device having the same
06/09/2010CN101726946A Wide visual angle LCD array substrate and manufacturing method thereof
06/09/2010CN101726945A Wide visual angle LCD array substrate and manufacturing method thereof
06/09/2010CN101726943A Active component array substrate, liquid-crystal display panel and detection method for both
06/09/2010CN101726942A Pixel unit, method for making same and touch control type liquid crystal display panel
06/09/2010CN101726888A Fabricating method of touch circuit two-sided graph structure
06/09/2010CN101726695A Method for testing service life of NMOS hot carrier injection
06/09/2010CN101726496A Optical system for representing interfacial characteristics of silicon and silicon dioxide and method
06/09/2010CN101724910A Method for eliminating surface defects of GaN thick film material
06/09/2010CN101724896A Method for growing germanium-silicon epitaxies in nonselective way
06/09/2010CN101724877A Electroplating method
06/09/2010CN101724875A Methods and apparatus for monitoring deposition quality during conformable contact mask plating operations
06/09/2010CN101724361A Aeolotropic conductive adhesive and conductive film and electric connection method thereof
06/09/2010CN101724354A Resin composition and semiconductor devices made by using the same
06/09/2010CN101723674A Aluminum-nitride-based composite material, method for manufacturing the same, and member for a semiconductor manufacturing apparatus
06/09/2010CN101722738A Marking method of material strips and compact type full-automatic IC (integrated circuit) material strip laser marking machine
06/09/2010CN101722728A Method for discharging liquid body, method for manufacturing color filter, and method for manufacturing organic el device
06/09/2010CN101722582A Revolving binding platform special for cutting silicon chip
06/09/2010CN101722581A Method of scribing laminated substrate
06/09/2010CN101722476A Chemically mechanical polishing and cleaning machine
06/09/2010CN101722475A CMP pad dressers with hybridized abrasive surface and related methods
06/09/2010CN101722469A Chemical mechanical polish process control for improvement in within-wafer thickness uniformity
06/09/2010CN101722468A Chemical mechanical polishing method, grinding fluid nozzle and chemical mechanical polishing device
06/09/2010CN101722464A Chemical mechanical polishing pad having sealed window
06/09/2010CN101722463A A chemical mechanical polishing pad having integral identification feature
06/09/2010CN101722462A Method for polishing both sides of a semiconductor wafer
06/09/2010CN101722447A Device for the double-sided processing of flat workpieces and method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers
06/09/2010CN101721821A Radiofrequency receiving chip and method for manufacturing same
06/09/2010CN101527264B Gate dielectric taking TiO2 as MOS structure and preparation method thereof
06/09/2010CN101478005B Metal oxide thin-film transistor and manufacturing process thereof
06/09/2010CN101477967B Process for preparing vertical structure phase-change memory
06/09/2010CN101465337B Electrical test key and test method
06/09/2010CN101459121B Through hole and through hole forming method
06/09/2010CN101459116B Shallow groove isolation construction manufacturing method
06/09/2010CN101459088B Redistribution metal layer and manufacturing method for redistribution convex point
06/09/2010CN101459073B Method for etching bottom layer anti-reflection layer
06/09/2010CN101459072B Method for etching bottom layer anti-reflection layer and manufacturing wire laying slot
06/09/2010CN101459048B Method for obtaining etching process test chip wire width and etching method
06/09/2010CN101459044B Dishing phenomenon detection unit in chemical mechanical polishing, manufacturing method and detection method
06/09/2010CN101452912B Device for forming alignment mark on back surface, and method for forming alignment mark
06/09/2010CN101447530B Process for cleaning sizing agent used for etching silicon dioxide mask
06/09/2010CN101443896B Apparatus for adhering adhesive tape
06/09/2010CN101441379B Multiple-domain vertical orientating type liquid crystal display device and its manufacture method
06/09/2010CN101432863B System for specifying equipment causing failure
06/09/2010CN101416282B Surface-protection tape for semiconductor wafers in back grinding process and substrate film for the surface-protection tape
06/09/2010CN101414556B Method for removing oxidate-nitride-oxide layer
06/09/2010CN101409318B Manufacturing method of LED chip
06/09/2010CN101409262B Pixel structure manufacturing method
06/09/2010CN101399235B FFS reversing-permeation type array substrate and method for manufacturing same
06/09/2010CN101399166B Etching substrates mounted with gas wall
06/09/2010CN101398579B Method for making micro reflector layer and silicon based LCD
06/09/2010CN101395698B Device and method for liquid treating disc-like articles
06/09/2010CN101393892B Method for manufacturing semiconductor device
06/09/2010CN101393878B Wire bonding system utilizing multiple positioning tables
06/09/2010CN101393843B Cleaning method after ion injection
06/09/2010CN101393364B TFT LCD pixel structure and method for manufacturing same
06/09/2010CN101393363B FFS type TFT-LCD array substrate structure and method for manufacturing same
06/09/2010CN101391258B Precleaning method of reaction system
06/09/2010CN101388324B Preparation of germanium quantum point
06/09/2010CN101383480B Method for preparing P type electrode of gallium nitride based semiconductor laser device
06/09/2010CN101383355B Pixel construction, display panel, photovoltaic device and production process thereof
06/09/2010CN101383270B Method of forming a micro pattern of a semiconductor device
06/09/2010CN101382708B 液晶显示装置 The liquid crystal display device
06/09/2010CN101378001B Substrate processing device
06/09/2010CN101373807B Preparation of conductive metallic layer on semiconductor device
06/09/2010CN101373723B Electronic device handler for a bonding apparatus
06/09/2010CN101369571B Semiconductor device, wafer coarse alignment mark and coarse alignment method
06/09/2010CN101369077B LCD array substrates and manufacturing method thereof
06/09/2010CN101366111B Substrate-replacing apparatus, substrate-processing apparatus, and substrate-inspecting apparatus
06/09/2010CN101366109B Test sorter
06/09/2010CN101359631B Method for preparing polycrystal SiGe gate nano CMOS integrated circuit by micro process
06/09/2010CN101359629B Polycrystal SiGe gate nano CMOS integrated circuit preparation based on SiO2 masking technique
06/09/2010CN101359627B Method for preparing polycrystal SiGe gate nano CMOS integrated circuit by SiN masking technique
06/09/2010CN101359602B Assembly method for single chip foldable surface adhesive semi-conductor component
06/09/2010CN101359598B Strained-channel semiconductor structure fabricating method
06/09/2010CN101359580B Substrate processing apparatus having a sensing unit
06/09/2010CN101355045B Substrate detection apparatus and substrate processing apparatus
06/09/2010CN101355040B Stacking structure for multiple chips and manufacturing method thereof
06/09/2010CN101355026B Manufacturing method of silicon carbide semiconductor apparatus
06/09/2010CN101351878B Substrate transfer device, substrate processing apparatus and substrate transfer method
06/09/2010CN101345197B Forming method of contact hole, and manufacturing method of semicondutor device, liquid crystal display device and EL display device
06/09/2010CN101335211B Lateral DMOS device and method for fabricating the same
06/09/2010CN101335204B Surface processing method of p type gallium nitride
06/09/2010CN101330107B Time-after-time programmable memory and manufacturing method thereof
06/09/2010CN101330078B High on-state voltage LED integrated chip with electrostatic protection and manufacturing method thereof
06/09/2010CN101330067B Self-aligning wafer or chip structure and self-aligning stacking structure and manufacturing method thereof
06/09/2010CN101330039B Method for eliminating load effect using through-hole plug
06/09/2010CN101326627B Electrode sheet for electrostatic chuck, and electrostatic chuck
06/09/2010CN101326620B Method of substrate treatment, substrate treating apparatus and substrate treating system
06/09/2010CN101325183B Ultra-thin cavity type power module and encapsulation method thereof
06/09/2010CN101325181B Thin-film transistor array substrate and preparation method thereof
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