Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2010
08/24/2010US7781245 Method to fabricate semiconductor optical device
08/24/2010US7781244 Method of manufacturing nitride-composite semiconductor laser element, with disclocation control
08/24/2010US7781243 Method of manufacturing display substrate, method of patterning inorganic layer and method of manufacturing display device using the same
08/24/2010US7781242 Method of forming vertical structure light emitting diode with heat exhaustion structure
08/24/2010US7781241 Group III-V semiconductor device and method for producing the same
08/24/2010US7781240 Integrated circuit device
08/24/2010US7781238 Methods of making and using integrated and testable sensor array
08/24/2010US7781237 Alignment marker and lithographic apparatus and device manufacturing method using the same
08/24/2010US7781236 Optical element mounting method and optical element mounting device
08/24/2010US7781235 Chip-probing and bumping solutions for stacked dies having through-silicon vias
08/24/2010US7781234 Semiconductor process evaluation methods including variable ion implanting conditions
08/24/2010US7781233 Method of manufacturing semiconductor device
08/24/2010US7781232 Method to recover underfilled modules by selective removal of discrete components
08/24/2010US7781231 Method of forming a magnetic tunnel junction device
08/24/2010US7781156 forming a resist pattern on metal layer covering a substrate, wet etching exposed metal layer, removing resist pattern forming metal layer pattern, exposing a portion of substrate, wet etching, removing metal layer pattern to form a recessed pattern, depositing a compensation layer(SiO2); slim profile
08/24/2010US7781154 Method of forming damascene structure
08/24/2010US7781125 Lithography mask blank
08/24/2010US7781035 Container for precision substrate
08/24/2010US7780862 Device and method for etching flash memory gate stacks comprising high-k dielectric
08/24/2010US7780814 Wafer pre-clean reactor cable termination for selective suppression/reflection of source and bias frequency cross products
08/24/2010US7780813 Electric field mediated chemical reactors
08/24/2010US7780811 Dicing die-bonding film, method of fixing chipped work and semiconductor device
08/24/2010US7780791 Apparatus for an optimized plasma chamber top piece
08/24/2010US7780790 Vacuum processing apparatus
08/24/2010US7780789 Vortex chamber lids for atomic layer deposition
08/24/2010US7780788 Gas delivery apparatus for atomic layer deposition
08/24/2010US7780787 Apparatus and method for depositing a material on a substrate
08/24/2010US7780786 Internal member of a plasma processing vessel
08/24/2010US7780785 Gas delivery apparatus for atomic layer deposition
08/24/2010US7780503 Polishing apparatus and polishing method
08/24/2010US7780391 Substrate processing device
08/24/2010US7780366 Resist pattern forming method
08/24/2010US7780347 On chip temperature measuring and monitoring circuit and method
08/24/2010US7780266 Micro-fluidic device having reduced mechanical cross-talk and method for making the micro-fluidic device
08/24/2010US7779784 Apparatus and method for plasma assisted deposition
08/24/2010US7779783 Plasma processing device
08/24/2010US7779781 Lithographic apparatus and device manufacturing method
08/24/2010US7779527 Methods and apparatus for installing a scrubber brush on a mandrel
08/24/2010CA2686094A1 Manufacturing method of a semiconductor element
08/20/2010CA2671455A1 Method for producing bonded wafer
08/19/2010WO2010094030A1 Strained semiconductor materials, devices and methods therefore
08/19/2010WO2010094025A2 Use of design information and defect image information in defect classification
08/19/2010WO2010094002A2 Rf bus and rf return bus for plasma chamber electrode
08/19/2010WO2010093871A2 Techniques for improving extracted ion beam quality using high transparency electrodes
08/19/2010WO2010093781A2 Solution based non-vacuum method and apparatus for preparing oxide materials
08/19/2010WO2010093733A2 Detecting defects on a wafer
08/19/2010WO2010093643A2 Solution deposition and method with substrate masking
08/19/2010WO2010093633A2 Method and apparatus for the solution deposition of oxide material
08/19/2010WO2010093610A2 Solution deposition method and apparatus with partiphobic substrate orientation
08/19/2010WO2010093568A2 Non-contact substrate processing
08/19/2010WO2010093567A2 Method for fabricating a semiconductor device having a lanthanum-family-based oxide layer
08/19/2010WO2010093380A1 Ion source cleaning in semiconductor processing systems
08/19/2010WO2010093364A1 Crystal silicon processes and products
08/19/2010WO2010093342A1 Three-dimensional network in cmp pad
08/19/2010WO2010093050A1 Hot plate, heating/cooling device and method of manufacturing hot plate
08/19/2010WO2010093031A1 Solder bump formation on a circuit board using a transfer sheet
08/19/2010WO2010093011A1 Polishing agent for copper polishing and polishing method using same
08/19/2010WO2010092985A1 Fluid control method and fluid control device
08/19/2010WO2010092984A1 Substrate fitted with sensor and method for manufacturing substrate fitted with sensor
08/19/2010WO2010092930A1 Wafer processing apparatus, process tube, wafer holder, fastener of wafer holder, wafer processing method, and wafer production method
08/19/2010WO2010092920A1 Container for glass substrates
08/19/2010WO2010092901A1 Photomask and methods for manufacturing and correcting photomask
08/19/2010WO2010092891A1 Organic semiconductor element and method for manufacturing same
08/19/2010WO2010092878A1 Cvd device
08/19/2010WO2010092865A1 Abrading agent and abrading method
08/19/2010WO2010092863A1 Nickel alloy sputtering target and nickel silicide film
08/19/2010WO2010092853A1 Frame package manufacturing method
08/19/2010WO2010092825A1 Circuit analysis method
08/19/2010WO2010092810A1 Method for manufacturing transistor, transistor, and sputtering target
08/19/2010WO2010092804A1 Semiconductor protection film-forming film with dicing sheet, method for manufacturing semiconductor device using same, and semiconductor device
08/19/2010WO2010092768A1 Field effect transistor
08/19/2010WO2010092758A1 Thin film forming apparatus and thin film forming method
08/19/2010WO2010092757A1 Atomic layer growing apparatus and thin film forming method
08/19/2010WO2010092748A1 Semiconductor device, method for manufacturing same and plasma doping system
08/19/2010WO2010092691A1 Semiconductor device
08/19/2010WO2010092672A1 Semiconductor wafer testing apparatus
08/19/2010WO2010092653A1 Semiconductor device and method for fabricating the same
08/19/2010WO2010092652A1 Nonvolatile memory, method for manufacturing same, and display device
08/19/2010WO2010092642A1 Semiconductor device
08/19/2010WO2010092636A1 Semiconductor integrated circuit
08/19/2010WO2010092635A1 Wiring structure for a semiconductor-integrated circuit, and semiconductor device having the wiring structure
08/19/2010WO2010092617A1 Photoelectronic sensor and photoelectronic sensor system
08/19/2010WO2010092579A1 A process for electroplating of copper
08/19/2010WO2010092482A2 Migration and plasma enhanced chemical vapor deposition
08/19/2010WO2010092420A1 A hardmask process for forming a reverse tone image using polysilazane
08/19/2010WO2010091972A1 A method of producing a layer of cavities.
08/19/2010WO2010091932A1 Fin and finfet formation by angled ion implantation
08/19/2010WO2010091918A1 Method and structure for forming devices on the front side and capacitors on the back side of a wafer
08/19/2010WO2010091755A1 Soi radio frequency switch with reduced signal distortion
08/19/2010WO2010091752A1 Semiconductor-on-insulator substrate and structure including multiple order radio frequency harmonic supressing region
08/19/2010WO2010091660A2 Method for producing a connection between a semiconductor component and semiconductor module resistant to high temperatures and temperature changes by means of a temperature impinging process
08/19/2010WO2010091466A1 Photovoltaic device structure and method
08/19/2010WO2010077533A3 Thermocouple
08/19/2010WO2010076974A3 Polysilicon deposition apparatus
08/19/2010WO2010076960A3 Solder ball attaching method and soldering method using same
08/19/2010WO2010074964A3 Group iii-v mosfet having metal diffusion regions
08/19/2010WO2010068752A3 Platen and adapter assemblies for facilitating silicon electrode polishing
08/19/2010WO2010068691A3 Carrier head membrane roughness to control polishing rate
08/19/2010WO2010065718A3 Excited gas injection for ion implant control
08/19/2010WO2010065473A3 Gas distribution blocker apparatus
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