Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2010
08/26/2010WO2010095635A1 Circuit design assistance device, circuit design assistance method, and computer readable recording medium
08/26/2010WO2010095614A1 Photo imprinting member and photo imprinting apparatus
08/26/2010WO2010095589A1 Magnetoresistive effect element and magnetic random access memory
08/26/2010WO2010095550A1 Method for forming epitaxial wafer and method for manufacturing semiconductor element
08/26/2010WO2010095544A1 Method for manufacturing semiconductor device, and semiconductor device
08/26/2010WO2010095540A1 Wafer conveying tray and method of securing wafer on tray
08/26/2010WO2010095538A1 Silicon carbide substrate and method for production thereof
08/26/2010WO2010095526A1 Method for controlling threshold voltage in organic field-effect transistor
08/26/2010WO2010095525A1 Magnetoresistive element and method for manufacturing magnetoresistive element
08/26/2010WO2010095521A1 Probe guard
08/26/2010WO2010095512A1 Method and apparatus for decomposing nitrogen trifluoride
08/26/2010WO2010095504A1 Method of producing thin-film transistor
08/26/2010WO2010095498A1 Method for forming cu film and storage medium
08/26/2010WO2010095497A1 Method for forming cu film and storage medium
08/26/2010WO2010095490A1 Method for manufacturing semiconductor device, and bonding apparatus
08/26/2010WO2010095420A1 Surface examining device and surface examining method
08/26/2010WO2010095401A1 Semiconductor device and display device
08/26/2010WO2010095392A1 Sample observing method and scanning electron microscope
08/26/2010WO2010095383A1 Semiconductor device and method for manufacturing semiconductor device
08/26/2010WO2010095369A1 Method for manufacturing silicon carbide semiconductor device
08/26/2010WO2010095368A1 Reception circuit and signal reception method
08/26/2010WO2010095362A1 Resin coating apparatus and resin coating data creation apparatus
08/26/2010WO2010095355A1 Method for dicing semiconductor wafer
08/26/2010WO2010095346A1 Semiconductor device, basic cell and semiconductor integrated circuit device
08/26/2010WO2010095330A1 Method for forming silicon oxide film and method for manufacturing semiconductor device
08/26/2010WO2010095311A1 Pressure-bonding method and pressure-bonding apparatus
08/26/2010WO2010095299A1 Substrate support table of plasma processing device
08/26/2010WO2010095215A1 Work transfer apparatus and vacuum bonding method
08/26/2010WO2010095201A1 Semiconductor device and method for manufacturing semiconductor device
08/26/2010WO2010095196A1 Plasma treatment method and plasma treatment device
08/26/2010WO2010095188A1 Transistor and transistor control system
08/26/2010WO2010095186A1 Semiconductor device and method for manufacturing same
08/26/2010WO2010095021A1 Production method of n-type sic single crystal, n-type sic single crystal obtained thereby and application of same
08/26/2010WO2010094998A1 Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv)
08/26/2010WO2010094920A1 Formation of thin layers of semiconductor materials
08/26/2010WO2010094804A1 Lithography machine and substrate handling arrangement
08/26/2010WO2010094802A1 Preparation unit for lithogrpahy machine
08/26/2010WO2010094801A1 A method and arrangement for realizing a vacuum in a vacuum chamber
08/26/2010WO2010094800A1 Substrate support structure, clamp preparation unit, and lithography system
08/26/2010WO2010094748A1 Method of clamping a substrate and clamp preparation unit
08/26/2010WO2010094724A1 Charged particle lithography apparatus and method of generating vacuum in a vacuum chamber
08/26/2010WO2010094562A1 Insulation material for integrated circuits and use of said integrated circuits
08/26/2010WO2010094541A1 Asymmetric junction field effect transistor and method of manufacturing the same
08/26/2010WO2010094502A1 Device for separating disc-shaped elements
08/26/2010WO2010094371A2 Relaxation and transfer of strained material layers
08/26/2010WO2010094360A1 Nanowire mesh device and method of fabricating same
08/26/2010WO2010094346A1 Substrate inverting system
08/26/2010WO2010094345A1 Autotuned screen printing process
08/26/2010WO2010094344A1 Method and apparatus for screen printing a multiple layer pattern
08/26/2010WO2010094343A1 Bernoulli gripper
08/26/2010WO2010094315A1 Flip-chip soldering method, and circuit comprising a soldered semiconductor chip which is contacted using flip-chip technology
08/26/2010WO2010094278A1 Method and device for forming a packet-like back-to-back wafer batch
08/26/2010WO2010094102A1 Device for grasping and active release of micro and nano objects
08/26/2010WO2010081003A3 Systems, apparatus and methods for moving substrates
08/26/2010WO2010080983A3 Robot systems, apparatus and methods for transporting substrates in electronic device manufacturing
08/26/2010WO2010080421A3 Controlling ion energy distribution in plasma processing systems
08/26/2010WO2010080358A3 Edge film removal process for thin film solar cell applications
08/26/2010WO2010080216A3 Precursor addition to silicon oxide cvd for improved low temperature gapfill
08/26/2010WO2010078022A3 Tape-based epitaxial lift off apparatuses and methods
08/26/2010WO2010077616A3 Multiple stack deposition for epitaxial lift off
08/26/2010WO2010077510A3 Trench-based power semiconductor devices with increased breakdown voltage characteristics
08/26/2010WO2010077503A3 Trench-based power semiconductor devices with increased breakdown voltage characteristics
08/26/2010WO2010077502A3 Trench-based power semiconductor devices with increased breakdown voltage characteristics
08/26/2010WO2010076187A3 Integrated electronic device with transceiving antenna and magnetic interconnection
08/26/2010WO2010074956A3 Doping of lead-free solder alloys and structures formed thereby
08/26/2010WO2010074416A3 Selecting and supplying apparatus for molding tablet
08/26/2010WO2010068825A3 Method for improving motion times of a stage
08/26/2010WO2010068624A3 Chamber shield for vacuum physical vapor deposition
08/26/2010WO2010068523A3 Dual metal interconnects for improved gap-fill, reliability, and reduced capacitance
08/26/2010WO2010064715A4 Mesoporous silica film and process for production thereof
08/26/2010WO2010062967A3 Test electronics to device under test interfaces, and methods and apparatus using same
08/26/2010WO2010062840A3 Improved load cup substrate sensing
08/26/2010WO2010062582A3 Vapor deposition method for ternary compounds
08/26/2010WO2010059645A3 Method and apparatus for linear pad conditioning
08/26/2010WO2010059580A3 Image mask assembly for photolithography
08/26/2010WO2010053878A3 Laminar flow in a precursor source canister
08/26/2010WO2010029138A3 Method of etching using a multilayer masking structure
08/26/2010US20100217430 Spectrographic monitoring of a substrate during processing using index values
08/26/2010US20100217415 Photometrically modulated delivery of reagents
08/26/2010US20100216545 Enhanced parimutuel wagering
08/26/2010US20100216317 Methods for Forming Conformal Oxide Layers on Semiconductor Devices
08/26/2010US20100216316 Transfer of high temperature wafers
08/26/2010US20100216315 Etching composition for metal material and method for manufacturing semiconductor device by using same
08/26/2010US20100216314 Substrate processing method
08/26/2010US20100216313 Plasma processing apparatus
08/26/2010US20100216312 Resist removing method, semiconductor manufacturing method, and resist removing apparatus
08/26/2010US20100216311 Trench forming method
08/26/2010US20100216310 Process for etching anti-reflective coating to improve roughness, selectivity and CD shrink
08/26/2010US20100216309 Cmp polishing liquid and method for polishing substrate using the same
08/26/2010US20100216308 Method for etching 3d structures in a semiconductor substrate, including surface preparation
08/26/2010US20100216307 Simplified pitch doubling process flow
08/26/2010US20100216306 Protection of conductors from oxidation in deposition chambers
08/26/2010US20100216305 Method for fabricating semiconductor device
08/26/2010US20100216304 Method for forming ti film and tin film, contact structure, computer readable storage medium and computer program
08/26/2010US20100216303 Semiconductor device having reinforced low-k insulating film and its manufacture method
08/26/2010US20100216302 Lead-free tin alloy electroplating compositions and methods
08/26/2010US20100216301 Fabricating a device with a diamond layer
08/26/2010US20100216300 Semiconductor device manufacturing method
08/26/2010US20100216299 Substrate preparation for enhanced thin film fabrication from group iv semiconductor nanoparticles
08/26/2010US20100216298 Method for growing Ge expitaxial layer on patterned structure with cyclic annealing
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