Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2010
08/12/2010US20100203688 Semiconductor device and method for manufacturing same
08/12/2010US20100203687 Method of manufacturing an array substrate for lcd device having double-layered metal structure
08/12/2010US20100203686 Flat Display Active Plate
08/12/2010US20100203685 Semiconductor chips with reduced stress from underfill at edge of chip
08/12/2010US20100203684 Semiconductor package formed within an encapsulation
08/12/2010US20100203683 Semiconductor system with fine pitch lead fingers and method of manufacture thereof
08/12/2010US20100203682 Semiconductor device and method for manufacturing same
08/12/2010US20100203681 Method of manufacturing semiconductor device, and wire bonder
08/12/2010US20100203680 Method for manufacturing semiconductor
08/12/2010US20100203679 Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post
08/12/2010US20100203678 Semiconductor substrate cutting method
08/12/2010US20100203677 Method for fabricating semiconductor packages with discrete components
08/12/2010US20100203676 Chip assembly
08/12/2010US20100203675 Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus
08/12/2010US20100203674 METHODS OF FABRICATING NANOSTRUCTURED ZnO ELECTRODES FOR EFFICIENT DYE SENSITIZED SOLAR CELLS
08/12/2010US20100203673 Method for manufacturing field-effect transistor
08/12/2010US20100203672 Methods of manufacturing phase change memory devices
08/12/2010US20100203671 Solid-state imaging device and method for making the same
08/12/2010US20100203670 Semiconductor device fabrication method
08/12/2010US20100203668 Method and apparatus for thermally converting metallic precursor layers into semiconducting layers, and also solar module
08/12/2010US20100203667 Manufacturing method for a solid-state image sensor
08/12/2010US20100203664 Silicon Undercut Prevention in Sacrificial Oxide Release Process and Resulting MEMS Structures
08/12/2010US20100203659 Method for manufacturing light emitting device
08/12/2010US20100203655 Gap capacitors for monitoring stress in solder balls in flip chip technology
08/12/2010US20100203654 Method of Testing an Integrated Circuit Die, and an Integrated Circuit Die
08/12/2010US20100203457 Patterning process
08/12/2010US20100203456 Method of forming resist pattern and method of manufacturing semiconductor device
08/12/2010US20100203432 Exposure mask and method for manufacturing same and method for manufacturing semiconductor device
08/12/2010US20100203253 Plasma system and method of producing a functional coating
08/12/2010US20100202867 Substrate processing apparatus
08/12/2010US20100202860 Method and apparatus for minimizing contamination in semiconductor processing chamber
08/12/2010US20100202485 Semiconductor laser and method of manufacturing the same
08/12/2010US20100202186 Semiconductor memory device, method of manufacturing the same, and method of screening the same
08/12/2010US20100202122 Carrier assembly for an integrated circuit
08/12/2010US20100202093 Transfer chamber and method for preventing adhesion of particle
08/12/2010US20100201861 Charge detection device and charge detection method, solid-state imaging device and driving method thereof, and imaging device
08/12/2010US20100201860 Method and apparatus providing cmos imager device pixel with transistor having lower threshold voltage than other imager device transistors
08/12/2010US20100201854 Solid-state image pick-up device and manufacturing method thereof, image-pickup apparatus, semiconductor device and manufacturing method thereof, and semiconductor substrate
08/12/2010US20100201735 Bonding method of silicon base members, droplet ejection head, droplet ejection apparatus, and electronic device
08/12/2010US20100201662 Light emitting apparatus and method for manufacturing the same
08/12/2010US20100201658 Method of manufacturing display device and display device
08/12/2010US20100201655 Display device and manufacturing method thereof
08/12/2010US20100201440 Soi radio frequency switch with reduced signal distortion
08/12/2010US20100201356 Sensor
08/12/2010US20100201055 Substrate treating apparatus and method for manufacturing semiconductor device
08/12/2010US20100201005 Microfluidic component and method for manufacturing same
08/12/2010US20100201003 Packaging Systems Incorporating Thin Film Liquid Crystal Polymer (LCP) and Methods of Manufacture
08/12/2010US20100201002 Semiconductor device and process for producing same
08/12/2010US20100201001 Semiconductor device and method for manufacturing semiconductor device
08/12/2010US20100200999 Semiconductor device and method of fabricating same
08/12/2010US20100200997 Semiconductor device having decreased contact resistance and method for manufacturing the same
08/12/2010US20100200994 Semiconductor Device and Method of Manufacturing the Same
08/12/2010US20100200993 Dielectric barrier layer for increasing electromigration lifetimes in copper interconnect structures
08/12/2010US20100200992 Lock and Key Through-Via Method for Wafer Level 3D Integration and Structures Produced
08/12/2010US20100200991 Dopant Enhanced Interconnect
08/12/2010US20100200990 Manufacturing method of semiconductor device and semiconductor device produced therewith
08/12/2010US20100200989 Liner materials and related processes for 3-d integration
08/12/2010US20100200988 GRAIN REFINEMENT BY PRECIPITATE FORMATION IN Pb-FREE ALLOYS OF TIN
08/12/2010US20100200986 Grooving Bumped Wafer Pre-Underfill System
08/12/2010US20100200982 Semiconductor device and manufacturing method thereof
08/12/2010US20100200981 Semiconductor package and method of manufacturing the same
08/12/2010US20100200977 Layered chip package and method of manufacturing same
08/12/2010US20100200975 Semiconductor device and method of manufacturing the same, and electronic apparatus
08/12/2010US20100200970 Semiconductor Assembly With One Metal Layer After Base Metal Removal
08/12/2010US20100200969 Semiconductor package and method of manufacturing the same
08/12/2010US20100200966 Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages
08/12/2010US20100200963 Protein repelling silicon and germanium surfaces
08/12/2010US20100200961 Thru silicon enabled die stacking scheme
08/12/2010US20100200960 Deep trench crackstops under contacts
08/12/2010US20100200959 Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same
08/12/2010US20100200958 Pedestal guard ring having continuous m1 metal barrier connected to crack stop
08/12/2010US20100200957 Scribe-Line Through Silicon Vias
08/12/2010US20100200956 Compound semiconductor substrate, process for producing compound semiconductor substrate, and semiconductor device
08/12/2010US20100200954 Ion implanted substrate having capping layer and method
08/12/2010US20100200953 On-chip heater and methods for fabrication thereof and use thereof
08/12/2010US20100200949 Method for tuning the threshold voltage of a metal gate and high-k device
08/12/2010US20100200948 Semiconductor device and fabrication method thereof
08/12/2010US20100200946 Method for forming trench isolation using a gas cluster ion beam growth process
08/12/2010US20100200938 Methods for forming layers within a mems device using liftoff processes
08/12/2010US20100200937 METHOD AND STRUCTURE FOR PMOS DEVICES WITH HIGH K METAL GATE INTEGRATION AND SiGe CHANNEL ENGINEERING
08/12/2010US20100200934 Field effect device includng recessed and aligned germanium containing channel
08/12/2010US20100200933 Semiconductor device and method of fabricating the same
08/12/2010US20100200931 Mosfet devices and methods of making
08/12/2010US20100200930 Manufacturing method of semiconductor device and semiconductor device
08/12/2010US20100200928 Semiconductor device, and manufacturing method thereof
08/12/2010US20100200927 Semiconductor-on-insulator substrate and structure including multiple order radio ferquency harmonic supressing region
08/12/2010US20100200926 Memory Cells Having Contact Structures and Related Intermediate Structures
08/12/2010US20100200925 Semiconductor device and method of manufacturing the same
08/12/2010US20100200923 Multiple-gate transistor structure and method for fabricating
08/12/2010US20100200922 Electrostatic Discharge Protection Device and Method
08/12/2010US20100200920 Configuration of gate to drain (GD) clamp and ESD protection circuit for power device breakdown protection
08/12/2010US20100200917 Nonplanar device with stress incorporation layer and method of fabrication
08/12/2010US20100200915 Lateral trench mosfet having a field plate
08/12/2010US20100200914 Semiconductor device and method of manufacturing the same
08/12/2010US20100200912 Mosfets with terrace irench gate and improved source-body contact
08/12/2010US20100200911 Electrostatic discharge failure protective element, electrostatic discharge failure protective circuit, semiconductor device and semiconductor device manufacturing method
08/12/2010US20100200910 Semiconductor Devices with Stable and Controlled Avalanche Characteristics and Methods of Fabricating the Same
08/12/2010US20100200909 Semiconductor device and method of manufacturing same
08/12/2010US20100200908 Nonvolatile memory device and method of fabricating the same
08/12/2010US20100200907 Semiconductor Integrated Circuit Device and Method of Fabricating the Same
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