Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2010
08/25/2010CN101814505A Multi-layer floating gate nonvolatile memory structure and production method thereof
08/25/2010CN101814504A Metal structure for memory device
08/25/2010CN101814503A Complementary grid-controlled PNPN field effect transistor and preparation method thereof
08/25/2010CN101814502A Semiconductor device having dual metal gates and method of manufacture
08/25/2010CN101814500A Mesa thyristor surge suppressor chip and manufacturing method thereof
08/25/2010CN101814496A Weather-proof micro-trigger controlled silicon and manufacturing method thereof
08/25/2010CN101814493A Semiconductor device with buried gate and method for fabricating the same
08/25/2010CN101814492A Integrated circuit having metal gate stacks and manufacture method thereof
08/25/2010CN101814485A Packaging and fabricating method for mini power semiconductor with stacked inductance IC chip
08/25/2010CN101814484A Chip package and manufacturing method thereof
08/25/2010CN101814483A Packaging structure of sensing element and method thereof
08/25/2010CN101814482A Base island lead frame structure and production method thereof
08/25/2010CN101814481A No-pad lead frame structure and production method thereof
08/25/2010CN101814480A Chip package structure and packaging method thereof
08/25/2010CN101814479A Electrode contact structure and method for fabricating the same
08/25/2010CN101814478A An Image sensing device and a making method with the same
08/25/2010CN101814477A A Silicon through holes after the interlinked structure being passivated.
08/25/2010CN101814476A 半导体装置 Semiconductor device
08/25/2010CN101814475A Barrier structures and methods for through substrate vias
08/25/2010CN101814466A Thermally enhanced semiconductor package
08/25/2010CN101814463A Semiconductor package and manufacturing method thereof
08/25/2010CN101814462A Semiconductor package element and a fabricating method thereof together with a sealing method
08/25/2010CN101814461A Packaging substrate structure and chip packaging structure, as well as manufacturing method thereof
08/25/2010CN101814460A Active element array substrate and manufacturing method thereof
08/25/2010CN101814457A High mobility channel device on the dislocation barrier layer
08/25/2010CN101814456A IC circuit device and a fabricating method thereof
08/25/2010CN101814455A Method of fabricating array substrate
08/25/2010CN101814454A Wafer structure and manufacturing method thereof
08/25/2010CN101814453A Silicon slice alignment method for silicon through hole interconnection
08/25/2010CN101814452A Vacuum cavity positioning mechanism
08/25/2010CN101814451A Synchronous transmission device, straight line transmission system with same and control method
08/25/2010CN101814450A Method for detecting adhesive force of metal layer on back of wafer
08/25/2010CN101814449A Method for identifying an incorrect position of a semiconductor wafer during a thermal treatment
08/25/2010CN101814448A Sensing chip
08/25/2010CN101814447A Method for fabricating a bond
08/25/2010CN101814446A Island expose and multi-salient-point island expose lead frame structure and carving and plating method thereof
08/25/2010CN101814445A Packaging process of photoreceptive chip and structure thereof
08/25/2010CN101814444A Low-stress bottom filling method of laminating device
08/25/2010CN101814443A Chip design method for multi-chip module of high-performance processor with optical interface
08/25/2010CN101814442A Manufacturing method of glass-sealed package, and glass substrate
08/25/2010CN101814441A Method for manufacturing a semiconductor component and structure therefor
08/25/2010CN101814440A Semiconductor packaging structure and cooling fin arrangement method thereof
08/25/2010CN101814439A Process for preparing low thermal resistance ceramic copper-clad plate used for IGBT (Insulated Gate Bipolar Transistor) module
08/25/2010CN101814438A Preparation method of thin film transistor based on induced longitudinal crystallization polycrystalline silicon
08/25/2010CN101814437A Semiconductor device and method of manufacturing the same
08/25/2010CN101814436A Method for preparing longitudinal high-pressure deep-slot transistor
08/25/2010CN101814435A Method for preparing suspended ZnO nanowire field effect transistor
08/25/2010CN101814434A Method for manufacturing nitrogen face polar AlN/AlInN composite back barrier gallium nitride field effect transistor
08/25/2010CN101814433A Lateral bipolar junction transistor and method for manufacturing the same
08/25/2010CN101814432A Film for machining wafer
08/25/2010CN101814431A Method for using apparatus configured to form germanium-containing film
08/25/2010CN101814430A Method for preparing composite trapping layer of floating gate type nonvolatile memory
08/25/2010CN101814429A Macrolattice mismatch epitaxial material buffer layer structure containing superlattice isolated layer and preparation thereof
08/25/2010CN101814428A Method for producing epitaxially coated silicon wafers
08/25/2010CN101814427A Method for preparing GaN-based pattern substrate template
08/25/2010CN101814426A Production method for sapphire pattern substrate
08/25/2010CN101814425A Absorption spectrometric apparatus for semiconductor production process
08/25/2010CN101814424A Substrate disposing device and method thereof
08/25/2010CN101814423A Substrate processing apparatus
08/25/2010CN101814422A Apparatus and method for treating substrate
08/25/2010CN101814421A Method of forming fine patterns of a semiconductor device
08/25/2010CN101814420A substrate processing apparatus
08/25/2010CN101814156A Manufacture method of wireless radio frequency identification mark
08/25/2010CN101814100A Method for carrying out image force compensation amendment on height of schottky barrier
08/25/2010CN101813892A Environmental system including a transport region for an immersion lithography apparatus
08/25/2010CN101813883A Mask blank substrate, mask blank, exposure mask, method for manufacturing semiconductor device and method for manufacturing mask blank substrate
08/25/2010CN101813859A Liquid crystal display device and manufacture method thereof
08/25/2010CN101813744A Parallel test system and parallel test method
08/25/2010CN101813663A Design and manufacture process of molecular recognition sensor based on chemical polarization field effect
08/25/2010CN101813628A Ultraviolet biological chip integrated sensor
08/25/2010CN101812725A Growth method of phase-change nucleation in epitaxy of gallium nitride
08/25/2010CN101812724A Silicon film formation apparatus and method for using same
08/25/2010CN101812711A Plating apparatus
08/25/2010CN101812677A Plasma-reinforced chemical vapor deposition process cavity
08/25/2010CN101812675A Vacuum processing apparatus
08/25/2010CN101811273A Machining method for workpieces and a machining device thereof
08/25/2010CN101552192B Method for manufacturing Sic MOS capacitor
08/25/2010CN101515587B Thin film transistor array substrate and method for producing same
08/25/2010CN101515577B Connection pad structure, chip joint structure and method for detecting chip joint state
08/25/2010CN101515543B Gallium nitride membrane structure grown on silicon substrate and growing method thereof
08/25/2010CN101510540B Projection structure and manufacture method, display panel and detection method for chip stitching state
08/25/2010CN101510523B Substrate overturn platform and method for substrate overturn
08/25/2010CN101494171B Silicon nitride preparation method capable of reducing leakage current
08/25/2010CN101483154B Manufacturing process for gate lateral wall of dual gate oxide device
08/25/2010CN101465281B Substrate treating apparatus and substrate treating method
08/25/2010CN101461037B Electrical components for microelectronic devices and methods of forming the same
08/25/2010CN101452163B TFT-LCD array substrate structure and method for manufacturing same
08/25/2010CN101435961B TFT-LCD color film / array substrate, liquid crystal display panel and method for producing same
08/25/2010CN101425538B Metal-gated mosfet devices having scaled gate stack thickness
08/25/2010CN101425461B Method and system for improving dielectric film quality for void free gap fill
08/25/2010CN101424846B TFT-LCD array substrate, liquid crystal display panel and method for producing same
08/25/2010CN101424837B Method for manufacturing LCD array substrate
08/25/2010CN101414637B Groove insulation cross-over gate heterojunction field effect transistor
08/25/2010CN101410942B Symmetrical mim capacitor design
08/25/2010CN101409297B Three-dimensional quantum well NMOS integrated component and preparation method thereof
08/25/2010CN101409224B Brush assembly and substrate cleaning device having the same
08/25/2010CN101405858B Method to produce transistor having reduced gate height
08/25/2010CN101399288B LDMOS chip light doped drift region structure and forming method
08/25/2010CN101399274B Electronic device, manufacturing method of the same and electronic apparatus
08/25/2010CN101399266B Modified capacitor and method for manufacturing same
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