Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2010
08/26/2010US20100213547 Semiconductor switching device employing a quantum dot structure
08/26/2010US20100213545 Mos transistor with a p-field implant overlying each end of a gate thereof
08/26/2010US20100213544 High voltage device
08/26/2010US20100213543 High voltage device
08/26/2010US20100213540 Semiconductor device with a gate having a bulbous area and a flattened area underneath the bulbous area and method for manufacturing the same
08/26/2010US20100213539 Semiconductor device and production method therefor
08/26/2010US20100213538 Nonvolatile semiconductor memory device and method of manufacturing the same
08/26/2010US20100213537 Nonvolatile semiconductor memory device and method of manufacturing the same
08/26/2010US20100213535 Adjacent wordline disturb reduction using boron/indium implant
08/26/2010US20100213534 Nonvolatile semiconductor memory device and manufacturing method for the same
08/26/2010US20100213531 Nonvolatile semiconductor memory device and method for manufacturing the same
08/26/2010US20100213530 Nonvolatile Memory Device and Method of Manufacturing the Same
08/26/2010US20100213529 Semiconductor field-effect transistor, memory cell and memory device
08/26/2010US20100213526 Nonvolatile semiconductor memory device and method of manufacturing the same
08/26/2010US20100213525 Semiconductor storage device and methods of producing it
08/26/2010US20100213523 eDRAM MEMORY CELL STRUCTURE AND METHOD OF FABRICATING
08/26/2010US20100213522 Method for forming a semiconductor structure to remedy box undercut and structure formed thereby
08/26/2010US20100213520 Semiconductor integrated circuit device and method of manufacturing the same
08/26/2010US20100213518 Impurity Doped UV Protection Layer
08/26/2010US20100213517 High voltage semiconductor device
08/26/2010US20100213514 Metal structure for memory device
08/26/2010US20100213513 Hyperabrupt Diode Structure And Method For Making Same
08/26/2010US20100213512 High-Mobility Channel Devices on Dislocation-Blocking Layers
08/26/2010US20100213505 Semiconductor device and method for producing a semiconductor device
08/26/2010US20100213504 Lateral bipolar junction transistor
08/26/2010US20100213487 Side-emitting led package and manufacturing method of the same
08/26/2010US20100213486 Transparent heat spreader for leds
08/26/2010US20100213482 Top emission inverted organic light emitting diode display device and manufacturing method thereof
08/26/2010US20100213476 Group-iii nitride compound semiconductor light-emitting device, method of manufacturing group-iii nitride compound semiconductor light-emitting device, and lamp
08/26/2010US20100213470 Semiconductor device and manufacturing method of the same
08/26/2010US20100213467 Direct bandgap substrates and methods of making and using
08/26/2010US20100213465 Semiconductor component
08/26/2010US20100213463 Thin film transistor array substrate and method for manufacturing the same
08/26/2010US20100213462 Metal oxide structure and method for producing the same, and light-emitting element
08/26/2010US20100213461 Semiconductor device and manufacturing method thereof
08/26/2010US20100213460 Thin film transistor, method for manufacturing the same, and semiconductor device
08/26/2010US20100213459 Thin film transistor, manufacturing method therefor, and display apparatus using the same
08/26/2010US20100213458 Rigid semiconductor memory having amorphous metal oxide semiconductor channels
08/26/2010US20100213441 Modulation-doped halos in quantum well field-effect transistors, apparatus made therewith, and methods of using same
08/26/2010US20100213434 Method of synthesizing nanowires
08/26/2010US20100213433 Non-volatile semiconductor storage device and method of manufacturing the same
08/26/2010US20100213431 Treated Chalcogenide Layer for Semiconductor Devices
08/26/2010US20100213374 On-chip calibration system and method for infrared sensor
08/26/2010US20100213373 Infrared sensor structure and method
08/26/2010US20100213186 Semiconductor processing apparatus
08/26/2010US20100212834 Plasma processing apparatus
08/26/2010US20100212833 Apparatus for Etching Edge of Wafer
08/26/2010US20100212740 Systems and methods for improved photovoltaic module structure and encapsulation
08/26/2010US20100212738 Solar cells
08/26/2010US20100212734 Encapsulation process for thin-film solar cells
08/26/2010US20100212733 Protective layer for large-scale production of thin-film solar cells
08/26/2010US20100212732 Protective layer for large-scale production of thin-film solar cells
08/26/2010US20100212716 Solar radiation collection using dichroic surface
08/26/2010US20100212694 Wetting a workpiece surface in a fluid-processing system
08/26/2010US20100212595 Support Assembly For Substrate Holder, As Well As A Device Provided With Such A Support Assembly For Layered Deposition Of Various Semiconductor Materials On A Semiconductor Substrate
08/26/2010US20100212594 Substrate mounting mechanism and substrate processing apparatus having same
08/26/2010US20100212588 Semiconductor single crystal production apparatus
08/26/2010US20100212585 Substrate processing apparatus
08/26/2010US20100212433 Sensor in a moulded package and a method for manufacturing the same
08/26/2010US20100212403 Room Temperature Hydrogen Sensor
08/26/2010DE4401616B4 Keramische Mehrfachschichten-Verdrahtungskarte Ceramic multi-layer wiring board
08/26/2010DE112008002726T5 BAW-Struktur mit reduzierten topografischen Stufen und verwandtes Verfahren BAW structure with reduced topographic steps and related method
08/26/2010DE112008002725T5 Verfahren und Vorrichtung zum Versorgen mit elektrischem Strom Method and device for supplying electric current
08/26/2010DE112008002467T5 Verfahren für die Entnahme von Halbleiterchips von einem Wafertisch und Verfahren für die Montage von Halbleiterchips auf einem Substrat A process for the removal of semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate
08/26/2010DE112007003648T5 Verbesserte Grenzfläche zur Temperaturkontrolle Improved interface for temperature control
08/26/2010DE112005002280B4 Verfahren zur Fertigung einer Halbleiterstruktur (U-Gate-Transistor) A method of manufacturing a semiconductor structure (U-gate transistor)
08/26/2010DE10355572B4 Verfahren zum Verringern der Seitenwandrauhigkeit von trocken geätzten Strukturen A method for reducing the sidewall roughness of dry etched structures
08/26/2010DE10238578B4 Bandbreitenanpassung für Abtastaufbauten in einer integrierten Schaltung Bandwidth adjustment for Abtastaufbauten in an integrated circuit
08/26/2010DE102010009332A1 Verfahren zum Herstellen von gebondeten Wafern A process for producing bonded wafers
08/26/2010DE102010008975A1 Plate-shaped workpiece processing i.e. sharpening, method for forming ring-shaped reinforcing section in periphery region of workpiece, involves sharpening rear side of workpiece in circular recess and center region, respectively
08/26/2010DE102010005465A1 Electrical or electronic component e.g. integrated circuit, has metallic contact layer arranged on solid metallic socket and forming structure e.g. micro structure, including elevations and slots with height of specific value
08/26/2010DE102010000417A1 Elektronisches Bauelement und Verfahren zu seiner Herstellung An electronic device and method for its preparation
08/26/2010DE102010000407A1 Halbleiter-Package mit einem aus Metallschichten bestehenden Band The semiconductor package with an existing metal layers band
08/26/2010DE102010000401A1 Halbleiterbauelement Semiconductor device
08/26/2010DE102010000400A1 Array von Halbleiterbauelementen Array of semiconductor devices
08/26/2010DE102010000384A1 Verfahren zur Herstellung von Halbleiter-Bauelementen Process for the preparation of semiconductor devices
08/26/2010DE102009009813A1 Lötverfahren und Schaltung Soldering and circuit
08/26/2010DE102009009356A1 Semiconductor wafer's defect inspecting apparatus, has data processing unit comparing set of images with other set of images of surface of wafer previously acquired by sensors, and automatically detecting defect based on image comparison
08/26/2010DE102009009338A1 Indiumalkoxid-haltige Zusammensetzungen, Verfahren zu ihrer Herstellung und ihre Verwendung Indium alkoxide-containing compositions, process for their preparation and their use
08/26/2010DE102009004560B3 Verfahren zum Herstellen eines Halbleiterbauelementes, insbesondere einer Solarzelle, auf Basis einer Germaniumdünnschicht A method of manufacturing a semiconductor device, in particular a solar cell, based on a germanium thin film
08/26/2010DE102009000883A1 Substrat zur Aufnahme mindestens eines Bauelements und Verfahren zur Herstellung eines Substrats Substrate for receiving at least one device and process for the preparation of a substrate
08/26/2010DE102009000882A1 Substrat zur Aufnahme mindestens eines Bauelements und Verfahren zur Herstellung eines Substrats Substrate for receiving at least one device and process for the preparation of a substrate
08/26/2010DE102009000514A1 Verbundbauteil sowie Verfahren zum Herstellen eines Verbundbauteil The composite component as well as method for producing a composite component
08/26/2010DE102008059500B4 Verfahren zur Herstellung eines Mehr-Gatetransistors mit homogen silizidierten Stegendbereichen A process for producing a multi-gate transistor with silicided homogeneously Stegendbereichen
08/26/2010DE102007010876B4 Verfahren zur Herstellung eines Halbleitermoduls A process for producing a semiconductor module
08/26/2010DE10195157B4 Reinigungsvorrichtung zum Reinigen von für das Polieren von Halbleiterwafern verwendeten Poliertüchern Cleaning device for cleaning used for polishing semiconductor wafers polishing cloths
08/26/2010CA2750918A1 Device for grasping and active release of micro and nano objects
08/26/2010CA2748020A1 Silicon carbide substrate and method of manufacturing silicon carbide substrate
08/25/2010EP2221893A2 Nanostructures Having High Performance Thermoelectric Properties
08/25/2010EP2221866A2 Stacking apparatus and method for stacking integrated circuit elements
08/25/2010EP2221865A2 Stacking apparatus and method for stacking integrated circuit elements
08/25/2010EP2221864A2 Method for forming Cu film
08/25/2010EP2221863A1 Integrated circuit nanowires
08/25/2010EP2221862A1 Semiconductor device
08/25/2010EP2221861A1 Semiconductor device bonding wire and wire bonding method
08/25/2010EP2221859A1 Semiconductor device and semiconductor device manufacturing method
08/25/2010EP2221858A1 Semiconductor device
08/25/2010EP2221857A1 Manufacturing Method of a Semiconductor Element
08/25/2010EP2221856A1 Nitride semiconductor, nitride semiconductor crystal growth method, and nitride semiconductor light emitting element
08/25/2010EP2221855A1 Nitride semiconductor and nitride semiconductor crystal growth method
1 ... 1689 1690 1691 1692 1693 1694 1695 1696 1697 1698 1699 1700 1701 1702 1703 1704 1705 1706 1707 1708 1709 ... 6590