Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2010
08/26/2010US20100216297 Methods for fabricating semiconductor device structures
08/26/2010US20100216296 Processing Method and Recording Medium
08/26/2010US20100216295 Semiconductor on insulator made using improved defect healing process
08/26/2010US20100216294 Method of fabricating a microelectronic structure involving molecular bonding
08/26/2010US20100216293 Method for Fabricating Semiconductor Devices
08/26/2010US20100216292 Semiconductor device for reducing interference between adjoining gates and method for manufacturing the same
08/26/2010US20100216291 Methods of fabricating semiconductor devices and semiconductor devices including threshold voltage control regions
08/26/2010US20100216290 Method for forming semiconductor device
08/26/2010US20100216289 Method of fabricating semiconductor device having metal-semiconductor compound regions
08/26/2010US20100216288 Fabrication of Source/Drain Extensions with Ultra-Shallow Junctions
08/26/2010US20100216287 Method for removing hard masks on gates in semiconductor manufacturing process
08/26/2010US20100216286 Use of in-situ hcl etch to eliminate by oxidation recrystallization border defects generated during solid phase epitaxy (spe) in the fabrication of nano-scale cmos transistors using direct silicon bond substrate (dsb) and hybrid orientation technology (hot)
08/26/2010US20100216285 Method for Manufacturing Crystalline Semiconductor Film and Method for Manufacturing Thin Film Transistor
08/26/2010US20100216284 Semiconductor memory device
08/26/2010US20100216283 Electronic device and lead frame
08/26/2010US20100216282 Low cost bonding technique for integrated circuit chips and pdms structures
08/26/2010US20100216281 Semiconductor Device and Method of Forming Through Vias with Reflowed Conductive Material
08/26/2010US20100216280 Integrated circuit micro-module
08/26/2010US20100216279 Method of a multi-level cell resistance random access memory with metal oxides
08/26/2010US20100216278 Method for making multi-cystalline film of solar cell
08/26/2010US20100216277 Formation of Devices by Epitaxial Layer Overgrowth
08/26/2010US20100216276 Method for Electrically Connecting Photovoltaic Cells in a Photovoltaic Device
08/26/2010US20100216275 Photonic integration scheme
08/26/2010US20100216274 Tandem solar cell including an amorphous silicon carbide layer and a multi-crystalline silicon layer
08/26/2010US20100216273 Method for fabricating carbon nanotube array sensor
08/26/2010US20100216272 Light emitting device and method for manufacturing the same
08/26/2010US20100216270 Method for manufacturing light emitting diode
08/26/2010US20100216268 Manufacturing method of a semiconductor element
08/26/2010US20100216264 Method of manufacturing a substrate for a liquid discharge head
08/26/2010US20100216263 Method and Apparatus for Measuring Process Parameters of a Plasma Etch Process
08/26/2010US20100216262 Method for producing bonded wafer
08/26/2010US20100216261 Method for identifying an incorrect position of a semiconductor wafer during a thermal treatment
08/26/2010US20100216260 Plasma etching method and apparatus, and method of manufacturing liquid ejection head
08/26/2010US20100216259 Wet processing system, wet processing method and storage medium
08/26/2010US20100216258 Method for measuring dopant concentration during plasma ion implantation
08/26/2010US20100216064 Semiconductor-device manufacturing method, computer program product, and exposure-parameter creating method
08/26/2010US20100215839 Integrated circuits having organic-inorganic dielectric materials and methods for forming such integrated circuits
08/26/2010US20100215513 Vacuum pumping system, driving method thereof, apparatus having the same, and method of transferring substrate using the same
08/26/2010US20100215464 automatic product distribution system and a method thereof
08/26/2010US20100215461 Substrate processing apparatus
08/26/2010US20100215460 Inline-type wafer conveyance device
08/26/2010US20100215073 Light-emitting device and method of manufacturing the same
08/26/2010US20100215070 Multiwavelength optical device and manufacturing method of multiwavelength optical device
08/26/2010US20100214840 Multi-dot flash memory and method of manufacturing the same
08/26/2010US20100214839 Nand flash memory string apparatus and methods of operation thereof
08/26/2010US20100214834 Thin film magnetic memory device including memory cells having a magnetic tunnel junction
08/26/2010US20100214823 Semiconductor device including memory cell having capacitor
08/26/2010US20100214812 Stacked semiconductor devices including a master device
08/26/2010US20100214754 Ribbon bonding in an electronic package
08/26/2010US20100214716 Mems capacitive device and method of forming same
08/26/2010US20100214704 Esd protection using isolated diodes
08/26/2010US20100214641 Crystallization apparatus, crystallization method, device and phase modulation element
08/26/2010US20100214566 Lateral shift measurement using an optical technique
08/26/2010US20100214548 Lithographic apparatus and device manufacturing method
08/26/2010US20100214518 Tft-lcd array substrate and method for manufacturing the same
08/26/2010US20100214458 Method for Manufacturing Imaging Device, Imaging Device and Portable Terminal
08/26/2010US20100214457 Solid-state imaging device, manufacturing method thereof, and imaging apparatus
08/26/2010US20100214456 Camera module and method of manufacturing camera module
08/26/2010US20100214354 Method of manufacturing inkjet head and inkjet recording apparatus
08/26/2010US20100214202 Thin film transistor matrix device and method for fabricating the same
08/26/2010US20100214034 High Frequency Nanotube Oscillator
08/26/2010US20100214012 Electronic-structure modulation transistor
08/26/2010US20100213789 Electrostatic drive mems element and method of producing the same
08/26/2010US20100213623 Method Of Manufacturing A Semiconductor Device And A Semiconductor Device Produced Thereby
08/26/2010US20100213621 Moisture-proof device, moisture-proof IC, and method for increasing moisture-proof capability of IC
08/26/2010US20100213620 Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package
08/26/2010US20100213619 Bonding structure of bonding wire and method for forming same
08/26/2010US20100213616 Semiconductor device and a method of manufacturing the same, and an electronic device
08/26/2010US20100213614 Methods for Passivating Metallic Interconnects
08/26/2010US20100213609 Solder bump, semiconductor chip, method of manufacturing the semiconductor chip, conductive connection structure, and method of manufacturing the conductive connection structure
08/26/2010US20100213608 Solder bump UBM structure
08/26/2010US20100213607 Integrated circuit micro-module
08/26/2010US20100213606 Dielectric enhancements to chip-to-chip capacitive proximity communication
08/26/2010US20100213605 Semiconductor device and method of manufacturing semiconductor device
08/26/2010US20100213604 Integrated circuit micro-module
08/26/2010US20100213603 Integrated circuit micro-module
08/26/2010US20100213602 Integrated circuit micro-module
08/26/2010US20100213600 Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers
08/26/2010US20100213599 Semiconductor device and manufacturing method thereof
08/26/2010US20100213595 Semiconductor package and manufacturing method thereof and encapsulating method thereof
08/26/2010US20100213592 Semiconductor Module, Terminal Strip, Method for Manufacturing Terminal Strip, and Method for Manufacturing Semiconductor Module
08/26/2010US20100213590 Systems and Methods of Tamper Proof Packaging of a Semiconductor Device
08/26/2010US20100213589 Multi-chip package
08/26/2010US20100213586 Semiconductor package and manufacturing method thereof
08/26/2010US20100213583 Electronic parts, and method for arranging shielding case and chip parts
08/26/2010US20100213582 Glass-based soi structures
08/26/2010US20100213581 Dielectric film with low coefficient of thermal expansion (cte) using liquid crystalline resin
08/26/2010US20100213579 Methods for fabrication of high aspect ratio micropillars and nanopillars
08/26/2010US20100213578 Methods of forming integrated circuits and resulting structures
08/26/2010US20100213577 Semiconductor electronic device and process of manufacturing the same
08/26/2010US20100213576 Method for producing group iii nitride crystal substrate, group iii nitride crystal substrate, and semiconductor device using group iii nitride crystal substrate
08/26/2010US20100213571 Edram including metal plates
08/26/2010US20100213570 Antifuse
08/26/2010US20100213568 Micro-electro-mechanical-system device with guard ring and method for making same
08/26/2010US20100213557 Micro-electro-mechanical-system sensor and method for making same
08/26/2010US20100213556 Metal source and drain transistor having high dielectric constant gate insulator
08/26/2010US20100213555 Metal oxide semiconductor devices having capping layers and methods for fabricating the same
08/26/2010US20100213554 Gate structure and method for trimming spacers
08/26/2010US20100213553 Metal oxide semiconductor devices having buried gate channels and methods for fabricating the same
08/26/2010US20100213548 Semiconductor Devices with Low Junction Capacitances and Methods of Fabrication Thereof
1 ... 1688 1689 1690 1691 1692 1693 1694 1695 1696 1697 1698 1699 1700 1701 1702 1703 1704 1705 1706 1707 1708 ... 6590