Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2015
02/26/2015US20150054067 Integrated Circuitry Comprising Nonvolatile Memory Cells And Methods Of Forming A Nonvolatile Memory Cell
02/26/2015US20150054066 Semiconductor devices including vertical transistors, electronic systems including the same and methods of manufacturing the same
02/26/2015US20150054057 3d memory array with improved ssl and bl contact layout
02/26/2015US20150054055 Silicon Dot Formation by Self-Assembly Method and Selective Silicon Growth for Flash Memory
02/26/2015US20150054051 Semiconductor device and fabrication method
02/26/2015US20150054044 Method to Form a Polysilicon Nanocrystal Thin Film Storage Bitcell within a High K Metal Gate Platform Technology Using a Gate Last Process to Form Transistor Gates
02/26/2015US20150054039 FinFet Device with Channel Epitaxial Region
02/26/2015US20150054037 Semiconductor gallium arsenide compatible epitaxial ferroelectric devices for microwave tunable application
02/26/2015US20150054029 Metal Gate Stack Having TaAlCN Layer
02/26/2015US20150054025 Semiconductor device and semiconductor device manufacturing method
02/26/2015US20150054020 High-power electronic devices containing metal nanoparticle-based thermal interface materials and related methods
02/26/2015US20150054000 Method for treating surface of diamond thin film, method for forming transistor, and sensor device
02/26/2015US20150053997 Compound semiconductor device and method of fabricating the same
02/26/2015US20150053996 Layered substrate with a miscut angle comprising a silicon single crystal substrate and a group-iii nitride single crystal layer
02/26/2015US20150053989 Display substrate and method of manufacturing the display substrate
02/26/2015US20150053988 Array substrate, method for manufacturing the same and display device
02/26/2015US20150053983 Systems and methods for dopant activation using pre-amorphization implantation and microwave radiation
02/26/2015US20150053976 Display device and method for manufacturing the same
02/26/2015US20150053974 Thin film transistor and display array substrate using same
02/26/2015US20150053969 Semiconductor device and method for manufacturing same
02/26/2015US20150053967 Oxide tft, preparation method thereof, array substrate, and display device
02/26/2015US20150053966 Method for producing high-performing and electrically stable semi-conductive metal oxide layers, layers produced according to the method and use thereof
02/26/2015US20150053928 Silicon and silicon germanium nanowire formation
02/26/2015US20150053921 Enhanced switch device and manufacturing method therefor
02/26/2015US20150053885 Piezoelectric ceramic, method for manufacturing piezoelectric ceramic, piezoelectric element, and electronic device
02/26/2015US20150053659 Thermal processing by scanning a laser line beam
02/26/2015US20150053642 Chemical mechanical polishing composition for polishing a sapphire surface and methods of using same
02/26/2015US20150053563 Magnetic structure for metal plating control
02/26/2015US20150053350 Bonding method, bonding apparatus, and method for manufacturing substrate
02/26/2015US20150053347 Controlling cd and cd uniformity with trim time and temperature on a wafer by wafer basis
02/26/2015US20150053285 Liquid processing apparatus
02/26/2015US20150053263 Semiconductor laminate and method for manufacturing same, method for manufacturing semiconductor device, semiconductor device, dopant composition, dopant injection layer, and method for forming doped layer
02/26/2015US20150053259 P-type doping of ii-vi materials with rapid vapor deposition using radical nitrogen
02/26/2015US20150053234 Method for cleaning semiconductor wafer
02/26/2015US20150052722 Orientating and installing jig
02/26/2015US20150052702 Substrate cleaning apparatus
02/26/2015DE112013002722T5 Adaptiver ladungsausgeglichener Randabschluss Adaptive charge balanced edge termination
02/26/2015DE112013002260T5 Aufbau einer integrierten Schaltung Construction of an integrated circuit
02/26/2015DE112013001927T5 Herstellungsverfahren für eine Siliziumcarbid-Halbleitervorrichtung Manufacturing method for a silicon carbide semiconductor device
02/26/2015DE112013001802T5 Hochspannungshalbleitervorrichtung High voltage semiconductor device
02/26/2015DE112011103146B4 Verfahren zum Verbessern der mechanischen Eigenschaften von Halbleiterzwischenverbindungen mit Nanopartikeln A method for improving the mechanical properties of semiconductor nanoparticles with intermediate compounds
02/26/2015DE112011100975B4 Verfahren zur Herstellung biaxial verspannter Feldeffekttransistor-Bauelemente A process for producing biaxially strained field effect transistor devices
02/26/2015DE112010002199B4 Brausekopf für eine Vakuumschichtabscheidungsvorrichtung Shower head for a vacuum layer deposition apparatus
02/26/2015DE10329663B4 Verfahren zur Herstellung einer vertikalen Isolation für ein elektronisches Bauelement A process for producing a vertical insulation for an electronic component
02/26/2015DE10250830B4 Verfahren zum Herstellung eines Schaltkreis-Arrays A method of manufacturing a circuit array
02/26/2015DE10232987B4 Verfahren und System zur Steuerung der Verteilung eines Kältemittels A method and system for controlling the distribution of a refrigerant
02/26/2015DE102014112044A1 Reperaturvorrichtung Repair device
02/26/2015DE102014111829A1 Ein Halbleitermodul und ein Verfahren zu dessen Fabrikation durch erweiterte Einbettungstechnologien A semiconductor module and a method for its manufacture by embedding Advanced Technologies
02/26/2015DE102014010808A1 Chemisch-mechanische Polierzusammensetzung zum Polieren einer Saphiroberfläche und Verfahren, bei denen diese eingesetzt wird The chemical mechanical polishing composition for polishing a sapphire surface, and methods in which it is used
02/26/2015DE102014010775A1 Harzzusammensetzung zur Lötpunktbildung, Lötpunkt-Bildungsverfahren und Bauelement mit Lötpunkten Resin composition for Lötpunktbildung, solder-forming method and device with solder bumps
02/26/2015DE102014010409A1 Verbindungsvorrichtung und Verbindungsverfahren Connection device and connection method
02/26/2015DE102013216709A1 Halbleiteranordnung, verfahren zur herstellung einer anzahl von chipbaugruppen und verfahren zur herstellung einer halbleiteranordnung A semiconductor device, method for manufacturing a number of chip assemblies and methods for making a semiconductor device
02/26/2015DE102013112785B3 Verfahren zur Herstellung eines Verbundkörpers mit zumindest einer funktionellen Schicht oder zur weiteren Herstellung elektronischer oder opto-elektronischer Bauelemente A process for producing a composite body having at least one functional layer or to the further manufacture of electronic or opto-electronic components,
02/26/2015DE102013109635A1 Halbleiteranordnung und Verfahren, um dieselbe zu bilden To form the same semiconductor device and method
02/26/2015DE102013109210A1 Evakuierbare Kammer, insbesondere mit einem Spülgas spülbare Beladeschleuse Evacuated chamber, flushable especially with a purge gas load lock
02/26/2015DE102013109079A1 Verfahren zum Durchtrennen von Substraten und Halbleiterchip A method for cutting substrates and semiconductor chip
02/26/2015DE102013109055A1 Ausrichteinrichtung und Handhabungsvorrichtung Alignment and handling device
02/26/2015DE102013108134A1 Anordnung optoelektronischer Bauelemente und Verfahren zum Herstellen einer Anordnung optoelektronischer Bauelemente Arrangement of optoelectronic components and method for manufacturing an array of optoelectronic devices
02/26/2015DE102013018533A1 Verfahren zum reduzieren der oberflächenrauhigkeit einer oberfläche aus halbleitermaterial eines substrats A method for reducing the surface roughness of a surface of a substrate of semiconductor material
02/26/2015DE102012223655B4 Bildung von Source-Drain-Erweiterungen in Metall-Ersatz-Gate-Transistoreinheit Formation of source-drain extensions in metal replacement gate transistor unit
02/26/2015DE102011002419B4 Befestigungsanordnung für eine Wärmesenke Mounting arrangement for a heat sink
02/26/2015DE102010041576B4 Verfahren zum Verbinden von Körpern, Verbundkörper sowie dessen Verwendung A method of joining bodies, composites and the use thereof
02/26/2015DE102004059971B4 Lasermaske und Kristallisationsverfahren unter Verwendung derselber sowie Display und Verfahren zu dessen Herstellung Laser mask and crystallization method using DERS Elber and display and process for its preparation
02/25/2015EP2840613A1 Heterojunction unipolar diode with low turn-on voltage
02/25/2015EP2840601A1 Substrate support pin and substrate support device adopting substrate support pin
02/25/2015EP2840600A1 Process station for a machine as well as control device and control method for controlling a movement in a process of a machine
02/25/2015EP2840599A1 Accommodating container, shutter opening and closing unit for accommodating container, and wafer stocker using same
02/25/2015EP2840598A1 Probe apparatus, and wafer placing table for probe apparatus
02/25/2015EP2840597A2 Automatic assembling system and method
02/25/2015EP2840596A1 Solder bump and forming method therefor, and substrate having solder bump and manufacturing method for substrate having solder bump
02/25/2015EP2840595A1 Method for manufacturing silicon carbide semiconductor device
02/25/2015EP2840594A2 Recrystallisation of blocks with source and drain by the top
02/25/2015EP2840593A1 Enhanced switch device and manufacturing method therefor
02/25/2015EP2840592A1 Semiconductor device manufacturing method
02/25/2015EP2840591A1 Composition for silicon wafer polishing liquid
02/25/2015EP2840590A1 Method for producing an oxide film using a low temperature process, an oxide film and an electronic device thereof
02/25/2015EP2840589A1 Improved separation method between an active area of a substrate and the rear surface thereof or a portion of the rear surface thereof
02/25/2015EP2840164A1 Compositions and methods using same for flowable oxide deposition
02/25/2015EP2839904A1 Functional material
02/25/2015EP2839519A1 Method and apparatus for creating a w-mesa street
02/25/2015EP2839508A1 Device with graded barrier layer
02/25/2015EP2839506A1 Electrostatic clamp
02/25/2015EP2839505A1 Apparatus and method for synchronizing sample stage motion with a time delay integration charge-couple device in a semiconductor inspection tool
02/25/2015EP2839504A1 Formulations comprising ammoniacal hydroxo-zinc compounds
02/25/2015EP2839503A1 System for delivery of purified multiple phases of carbon dioxide to a process tool
02/25/2015EP2839502A1 Integrated thin film solar cell interconnection
02/25/2015EP2839501A1 Free layer with high thermal stability for magnetic device applications by insertion of a boron dusting layer
02/25/2015EP2839341A1 Silicon hardmask layer for directed self-assembly
02/25/2015EP2838658A1 A nanocapillary device for biomolecule detection, a fluidic network structure and a method of manufacturing thereof
02/24/2015US8966433 Support method, recording medium storing design support program and semiconductor device
02/24/2015US8966410 Semiconductor structure and method for fabricating semiconductor layout
02/24/2015US8965572 Frame feeding system and frame feeding method
02/24/2015US8965551 Defect analyzing method and defect analyzing apparatus
02/24/2015US8965550 Experiments method for predicting wafer fabrication outcome
02/24/2015US8964491 Graphene-based memory devices and methods therefor
02/24/2015US8964470 Method and architecture for improving defect detectability, coupling area, and flexibility of NVSRAM cells and arrays
02/24/2015US8964453 SRAM layouts
02/24/2015US8964440 Stacked semiconductor devices including a master device
02/24/2015US8964351 Robotic arm
02/24/2015US8964350 Substrate removing method and storage medium
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