Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2015
02/24/2015US8964190 Alignment apparatus, substrates stacking apparatus, stacked substrates manufacturing apparatus, exposure apparatus and alignment method
02/24/2015US8964167 Cylindrical magnetic levitation stage and lithography
02/24/2015US8963657 On-chip slow-wave through-silicon via coplanar waveguide structures, method of manufacture and design structure
02/24/2015US8963572 Testing in trays
02/24/2015US8963346 Semiconductor wafer and semiconductor device
02/24/2015US8963345 Encapsulation device having improved sealing
02/24/2015US8963343 Ferroelectric memories with a stress buffer
02/24/2015US8963342 Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types
02/24/2015US8963340 No flow underfill or wafer level underfill and solder columns
02/24/2015US8963339 Stacked multi-chip integrated circuit package
02/24/2015US8963337 Thin wafer support assembly
02/24/2015US8963335 Tunable composite interposer
02/24/2015US8963334 Die-to-die gap control for semiconductor structure and method
02/24/2015US8963330 Circuit structures and electronic systems
02/24/2015US8963327 Semiconductor device including wiring board with semiconductor chip
02/24/2015US8963325 Power device and power device module
02/24/2015US8963321 Semiconductor device including cladded base plate
02/24/2015US8963320 Integrated circuit packaging system with thermal structures and method of manufacture thereof
02/24/2015US8963319 Semiconductor chip with through hole vias
02/24/2015US8963318 Packaged semiconductor device
02/24/2015US8963317 Thermal dissipation through seal rings in 3DIC structure
02/24/2015US8963316 Semiconductor device and method for manufacturing the same
02/24/2015US8963315 Semiconductor device with surface electrodes
02/24/2015US8963314 Packaged semiconductor product and method for manufacture thereof
02/24/2015US8963312 Stacked chip package and method for forming the same
02/24/2015US8963310 Low cost hybrid high density package
02/24/2015US8963309 Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof
02/24/2015US8963300 Semiconductor device with selective planished leadframe
02/24/2015US8963299 Semiconductor package and fabrication method thereof
02/24/2015US8963297 Semiconductor apparatus
02/24/2015US8963296 Double trench rectifier
02/24/2015US8963295 Semiconductor structure with beryllium oxide
02/24/2015US8963294 Dense chevron finFET and method of manufacturing same
02/24/2015US8963293 High resistivity silicon-on-insulator substrate and method of forming
02/24/2015US8963292 Semiconductor device having backside redistribution layers and method for fabricating the same
02/24/2015US8963291 Semiconductor chip with seal ring and sacrificial corner pattern
02/24/2015US8963290 Semiconductor device and manufacturing method therefor
02/24/2015US8963287 Deep trench capacitor with conformally-deposited conductive layers having compressive stress
02/24/2015US8963286 Finger metal oxide metal capacitor structures
02/24/2015US8963285 Semiconductor device and method of manufacturing thereof
02/24/2015US8963284 Semiconductor devices having E-fuse structures and methods of fabricating the same
02/24/2015US8963283 Method of fabricating isolated capacitors and structure thereof
02/24/2015US8963282 Crack stop structure and method for forming the same
02/24/2015US8963281 Simultaneous isolation trench and handle wafer contact formation
02/24/2015US8963280 Semiconductor devices and methods of manufacture
02/24/2015US8963279 Semiconductor device isolation structures
02/24/2015US8963278 Three-dimensional integrated circuit device using a wafer scale membrane
02/24/2015US8963263 Resistant strain gauge
02/24/2015US8963261 Capacitive transducer and methods of manufacturing and operating the same
02/24/2015US8963259 Device isolation in finFET CMOS
02/24/2015US8963257 Fin field effect transistors and methods for fabricating the same
02/24/2015US8963256 CMOS device structures
02/24/2015US8963254 Simultaneous formation of FinFET and MUGFET
02/24/2015US8963253 Bi-directional bipolar junction transistor for high voltage electrostatic discharge protection
02/24/2015US8963251 Semiconductor device with strain technique
02/24/2015US8963248 Semiconductor device having SSOI substrate with relaxed tensile stress
02/24/2015US8963246 Semiconductor device and method for manufacturing semiconductor device
02/24/2015US8963240 Shielded gate trench (SGT) mosfet devices and manufacturing processes
02/24/2015US8963239 800 V superjunction device
02/24/2015US8963238 Double diffused drain metal-oxide-semiconductor devices with floating poly thereon and methods of manufacturing the same
02/24/2015US8963237 High voltage device and manufacturing method thereof
02/24/2015US8963228 Non-volatile memory device integrated with CMOS SOI FET on a single chip
02/24/2015US8963227 Semiconductor devices having a diffusion barrier layer and methods of manufacturing the same
02/24/2015US8963226 Semiconductor device with gate electrodes
02/24/2015US8963225 Band engineered semiconductor device and method for manufacturing thereof
02/24/2015US8963223 Scalable integrated MIM capacitor using gate metal
02/24/2015US8963221 Strongly correlated nonvolatile memory element
02/24/2015US8963219 Tunnel field effect transistor
02/24/2015US8963217 Wafer structure and power device using the same
02/24/2015US8963211 Method, structure and design structure for customizing history effects of SOI circuits
02/24/2015US8963208 Semiconductor structure including a semiconductor-on-insulator region and a bulk region, and method for the formation thereof
02/24/2015US8963207 Semiconductor device
02/24/2015US8963205 Method for fabricating a semiconductor device
02/24/2015US8963204 Semiconductor device and method for manufacturing same
02/24/2015US8963199 Semiconductor device and method for manufacturing same
02/24/2015US8963171 Image display device and the method for manufacturing the same
02/24/2015US8963167 Diode energy converter for chemical kinetic electron energy transfer
02/24/2015US8963166 III nitride crystal substrate and light-emitting device
02/24/2015US8963165 Nitride semiconductor structure, nitride semiconductor light emitting element, nitride semiconductor transistor element, method of manufacturing nitride semiconductor structure, and method of manufacturing nitride semiconductor element
02/24/2015US8963164 Compound semiconductor device and method of manufacturing the same
02/24/2015US8963163 Semiconductor device
02/24/2015US8963158 Structure, structure and method of latch-up immunity for high and low voltage integrated circuits
02/24/2015US8963157 Thin film transistor, array substrate, and manufacturing method thereof
02/24/2015US8963156 Semiconductor devices including WiSX
02/24/2015US8963155 Semiconductor device and method for manufacturing the same
02/24/2015US8963147 Thin film transistor, method of manufacturing the same, and image display device equipped with thin film transistor
02/24/2015US8963124 Semiconductor device including a plurality of different functional elements and method of manufacturing the same
02/24/2015US8963121 Vertical solid-state transducers and high voltage solid-state transducers having buried contacts and associated systems and methods
02/24/2015US8963119 Semiconductor nanocrystal, method of manufacture thereof and articles including the same
02/24/2015US8963116 Wrap around phase change memory
02/24/2015US8963052 Method for controlling spatial temperature distribution across a semiconductor wafer
02/24/2015US8963051 Heat treatment apparatus and method of manufacturing substrates
02/24/2015US8963050 Apparatus for and method of heat-treating thin film on surface of substrate
02/24/2015US8963013 Three dimensional interposer device
02/24/2015US8962983 Laminated body having semiconductor layer and layer thickness measurement portion, and thin-film photoelectric conversion device and integrated thin-film solar cell having the same
02/24/2015US8962747 Resist underlayer composition and process of producing integrated circuit devices using the same
02/24/2015US8962496 Process for smoothing a surface via heat treatment
02/24/2015US8962495 Film deposition method
02/24/2015US8962494 Method of manufacturing dual gate oxide devices
02/24/2015US8962493 Magnetic random access memory cells having improved size and shape characteristics
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