Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2010
10/27/2010CN101465280B Substrate processing apparatus
10/27/2010CN101459129B Self-aligning Schottky diode and corresponding resistor conversion memory production method
10/27/2010CN101442012B Model sealing and cutting method for small window and formed encapsulation conformation
10/27/2010CN101421833B Land grid array packaging method
10/27/2010CN101414654B Technique for preparing high-power LED ceramic heat-dissipating substrate
10/27/2010CN101404250B Selective formation of silicon carbon epitaxial layer
10/27/2010CN101401193B Process and equipment for production of wash water containing dissolved gas, and cleaning equipment
10/27/2010CN101399168B Method for controlling stability in wet chemical bath process
10/27/2010CN101393934B Semiconductor device and method of manufacturing the same
10/27/2010CN101378085B Metal-insulator-metal capacitor and method for manufacturing the same
10/27/2010CN101369638B Light emitting device and its fabrication method
10/27/2010CN101369532B Structures of and methods of fabricating trench-gated mis devices
10/27/2010CN101351877B Substrate of probe card and method for regenerating thereof
10/27/2010CN101341587B Apparatus and method for mounting electronic component
10/27/2010CN101336471B Method of polishing a semiconductor-on-insulator structure
10/27/2010CN101317253B Method of fabricating self aligned schottky junctions for semiconductors devices
10/27/2010CN101305453B Fine pitch interconnect and method of making
10/27/2010CN101300680B Replacement metal gate transistors with reduced gate oxide leakage
10/27/2010CN101292129B Measuring device
10/27/2010CN101271909B Image sensor and production method thereof
10/27/2010CN101263600B Method of manufacturing a semiconductor component, and semiconductor component formed thereby
10/27/2010CN101261929B Process for wafer backside polymer removal by front side gas purge
10/27/2010CN101226932B Pixel structure and manufacturing method thereof
10/27/2010CN101226904B Silicon slice with asymmetry edge contour and manufacturing method thereof
10/27/2010CN101221988B Semiconductor structure with high breakdown voltage and high resistance, and its manufacturing method
10/27/2010CN101208770B Device and method for processing dielectric materials
10/27/2010CN101197378B Non-volatile ROM and method of fabricating the same
10/27/2010CN101197316B Processing device
10/27/2010CN101179005B Exhaust air system, semi-conductor manufacturing installation for manufacturing thin film by the same and method thereof
10/27/2010CN101160663B 半导体器件 Semiconductor devices
10/27/2010CN101060070B Liquid treatment device
10/27/2010CN101041398B Transferring system
10/27/2010CN101034705B Bi-directional transistor with by-pass path and method therefor
10/27/2010CN101022085B Semiconductor element and producing method thereof
10/26/2010USRE41890 Methods for growing semiconductors and devices thereof from the alloy semiconductor GaInNAs
10/26/2010USRE41889 Process for manufacturing high-sensitivity accelerometric and gyroscopic integrated sensors, and sensor thus produced
10/26/2010USRE41873 Multiple testing bars for testing liquid crystal display and method thereof
10/26/2010USRE41869 Semiconductor device
10/26/2010USRE41868 Semiconductor memory device
10/26/2010USRE41867 MOS image pick-up device and camera incorporating the same
10/26/2010USRE41866 Semiconductor device and method of fabricating same
10/26/2010USRE41856 Process for manufacturing high-sensitivity accelerometric and gyroscopic integrated sensors, and sensor thus produced
10/26/2010US7823114 Method of designing wiring structure of semiconductor device and wiring structure designed accordingly
10/26/2010US7822574 Substrate measuring method, computer-readable recording medium recording program thereon, and substrate processing system
10/26/2010US7822494 Method for generating and using a plasma processing control program
10/26/2010US7822262 Outer surface-inspecting method, master patterns used therefor, and outer surface-inspecting apparatus equipped with such a master pattern
10/26/2010US7821814 Semiconductor memory device
10/26/2010US7821807 Nonequilibrium photodetectors with single carrier species barriers
10/26/2010US7821804 Semiconductor integrated circuit
10/26/2010US7821767 Electrostatic chuck device
10/26/2010US7821714 Apparatus and method for measuring aerial image of EUV mask
10/26/2010US7821655 In-situ absolute measurement process and apparatus for film thickness, film removal rate, and removal endpoint prediction
10/26/2010US7821654 System for scatterometric measurements and applications
10/26/2010US7821644 Apparatus for visual inspection
10/26/2010US7821628 Mask defect inspection computer program product
10/26/2010US7821616 Resist pattern forming method, semiconductor apparatus using said method, and exposure apparatus thereof
10/26/2010US7821614 Monitoring apparatus and method particularly useful in photolithographically processing substrates
10/26/2010US7821280 Process monitor for monitoring and compensating circuit performance
10/26/2010US7821200 EL display device, driving method thereof, and electronic equipment provided with the EL display device
10/26/2010US7821140 Semiconductor device and wire bonding method
10/26/2010US7821136 layer of metal composite is applied on substrate, comprising metal flakes, nanometer metal spheres, and metal precursors; precursors comprise mixture of inorganic salts and organic acidic salts; layer of metal composite is cured to induce exothermic reaction, forming a conductive layer at low temperature
10/26/2010US7821135 Semiconductor device with improved stress migration resistance and manufacturing process therefor
10/26/2010US7821133 Contact pad structure for flip chip semiconductor die
10/26/2010US7821130 Module including a rough solder joint
10/26/2010US7821126 Heat sink with preattached thermal interface material and method of making same
10/26/2010US7821125 Semiconductor device
10/26/2010US7821123 LED array cooling system
10/26/2010US7821122 Method and system for increasing circuitry interconnection and component capacity in a multi-component package
10/26/2010US7821119 Semiconductor device
10/26/2010US7821117 Semiconductor package with mechanical stress isolation of semiconductor die subassembly
10/26/2010US7821115 Tape carrier package including a heat dissipation element
10/26/2010US7821106 Process for making contact with and housing integrated circuits
10/26/2010US7821105 Method of manufacturing semiconductor device and semiconductor device
10/26/2010US7821104 Package device having crack arrest feature and method of forming
10/26/2010US7821099 Structure for low capacitance ESD robust diodes
10/26/2010US7821094 Light emitting diode structure
10/26/2010US7821079 Preparation of thin film transistors (TFTs) or radio frequency identification (RFID) tags or other printable electronics using ink-jet printer and carbon nanotube inks
10/26/2010US7821078 Semiconductor device having resistor elements and method for manufacturing the same
10/26/2010US7821075 CMOS device with zero soft error rate
10/26/2010US7821072 Semiconductor device comprising a stress applying insulating film
10/26/2010US7821071 Semiconductor device and method for manufacturing the same
10/26/2010US7821068 Device and process involving pinhole undercut area
10/26/2010US7821067 Electronic devices including a semiconductor layer
10/26/2010US7821065 Semiconductor device comprising a thin film transistor comprising a semiconductor thin film and method of manufacturing the same
10/26/2010US7821061 Silicon germanium and germanium multigate and nanowire structures for logic and multilevel memory applications
10/26/2010US7821059 Semiconductor device and method for manufacturing a semiconductor device
10/26/2010US7821058 Nonvolatile semiconductor memory and method for manufacturing the same
10/26/2010US7821052 Method for forming a buried digit line with self aligning spacing layer and contact plugs during the formation of a semiconductor device, semiconductor devices, and systems including same
10/26/2010US7821048 Double density MRAM with planar processing
10/26/2010US7821045 Apparatus, system, and method for multiple-segment floating gate
10/26/2010US7821044 Transistor with improved tip profile and method of manufacture thereof
10/26/2010US7821040 Thin film transistor substrate and fabricating method thereof
10/26/2010US7821036 Semiconductor device and method for manufacturing the same
10/26/2010US7821034 Integrated III-nitride devices
10/26/2010US7821033 Semiconductor component comprising a drift zone and a drift control zone
10/26/2010US7821028 Power semiconductor component with trench-type field ring structure
10/26/2010US7821018 GaN-based semiconductor light-emitting device and method for the fabrication thereof
10/26/2010US7821014 Semiconductor device and manufacturing method thereof with a recessed backside substrate for breakdown voltage blocking
10/26/2010US7821013 Silicon carbide semiconductor device
10/26/2010US7821011 Insulated gate field effect semiconductor devices and method of manufacturing the same
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