Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2010
11/02/2010US7824982 DRAM arrays, vertical transistor structures, and methods of forming transistor structures and DRAM arrays
11/02/2010US7824981 Method and apparatus for semiconductor device and semiconductor memory device
11/02/2010US7824980 Semiconductor device and method for manufacturing the same
11/02/2010US7824979 Semiconductor device with channel of FIN structure and method for manufacturing the same
11/02/2010US7824978 Bipolar transistor with high dynamic performances
11/02/2010US7824976 Semiconductor apparatus and method of manufacturing the semiconductor apparatus
11/02/2010US7824975 Method of fabricating semiconductor device having gate spacer layer with uniform thickness
11/02/2010US7824974 Method for manufacturing a constant current source device
11/02/2010US7824973 Method of forming a semiconductor device and semiconductor device thereof
11/02/2010US7824972 Producing a thin film transistor substrate by using a photoresist pattern having regions of different thicknesses
11/02/2010US7824971 Semiconductor device and method for manufacturing the same
11/02/2010US7824970 Semiconductor structure and method for manufacturing the same
11/02/2010US7824969 Finfet devices and methods for manufacturing the same
11/02/2010US7824968 LDMOS using a combination of enhanced dielectric stress layer and dummy gates
11/02/2010US7824967 Monolithically integrated light-activated thyristor and method
11/02/2010US7824966 Flex chip connector for semiconductor device
11/02/2010US7824965 Near chip scale package integration process
11/02/2010US7824964 Method for fabricating package structures for optoelectronic devices
11/02/2010US7824963 Inkjet printed leadframe
11/02/2010US7824962 Method of integrated circuit fabrication
11/02/2010US7824961 Stacked imager package
11/02/2010US7824960 Method of assembling a silicon stack semiconductor package
11/02/2010US7824959 Wafer level stack structure for system-in-package and method thereof
11/02/2010US7824958 Process and system for manufacturing an encapsulated semiconductor device
11/02/2010US7824957 Method for producing semiconductor device
11/02/2010US7824955 Hybrid beam deposition system and methods for fabricating metal oxide-ZnO films, p-type ZnO films, and ZnO-based II-VI compound semiconductor devices
11/02/2010US7824954 Methods of forming phase change memory devices having bottom electrodes
11/02/2010US7824951 Method of fabricating an integrated circuit having a memory including a low-k dielectric material
11/02/2010US7824950 Semiconductor device and method of fabricating the same
11/02/2010US7824949 Structure and method for flexible sensor array
11/02/2010US7824947 Method to improve flexible foil substrate for thin film solar cell applications
11/02/2010US7824946 Isolated metal plug process for use in fabricating carbon nanotube memory cells
11/02/2010US7824945 Method for making micro-electromechanical system devices
11/02/2010US7824944 Image sensor with inter-pixel isolation
11/02/2010US7824943 Methods for trapping charge in a microelectromechanical system and microelectromechanical system employing same
11/02/2010US7824942 Method of fabricating photoelectric device of group III nitride semiconductor and structure thereof
11/02/2010US7824941 Method for producing an LED light source comprising a luminescence conversion element
11/02/2010US7824940 Liquid crystal display device and method of fabricating the same
11/02/2010US7824939 Method for manufacturing display device comprising separated and electrically connected source wiring layers
11/02/2010US7824938 Method for manufacturing an LED chip package structure
11/02/2010US7824937 Solid element device and method for manufacturing the same
11/02/2010US7824936 spin coating a layer comprising phosphors and an organic binder; low cost and simplifying the manufacturing process to increase the contact interface between the light-emitting layer and the dielectric layer, and increasing the brightness
11/02/2010US7824935 Methods of combinatorial processing for screening multiple samples on a semiconductor substrate
11/02/2010US7824934 Substrate processing apparatus, parameter management system for substrate processing apparatus, parameter management method for substrate processing apparatus, program, and storage medium
11/02/2010US7824933 Method of determining n-well scattering effects on FETs
11/02/2010US7824932 Fabrication method of semiconductor device
11/02/2010US7824931 Substrate processing control method and storage medium
11/02/2010US7824930 Method of manufacturing substrate, substrate manufacturing system, and method of manufacturing display
11/02/2010US7824929 Method for producing group III nitride-based compound semiconductor
11/02/2010US7824922 Using cap comprising frangible seal which is penetrable by a plastic pipette which can form an essentially leak-proof seal with an open-ended vessel capable of receiving and holding fluid specimens or other materials for analysis
11/02/2010US7824844 Solvent mixtures for antireflective coating compositions for photoresists
11/02/2010US7824842 photolithography methods for exposing semiconductor substrates; enhancing lithographic printing image resolution, reducing mask error factor and line edge roughness
11/02/2010US7824827 Method and system for improved lithographic processing
11/02/2010US7824825 stencil mask in which various surface patterns can be formed, and in which deformation is suppressed when charged particles are introduced; mask for limiting an irradiation area of charged particles on a surface of a substrate to a predetermined shape; for semiconductor
11/02/2010US7824784 low dielectric material containing B,B',B''-tris(propylamino)borazine compound or polymer; diglyme or triglyme solvent; used to produce an interlayer dielectric film for semiconductor; spin coating
11/02/2010US7824772 Anti-etch layer comprises zirconium oxycarbide
11/02/2010US7824743 depositing metallic titanium nitride layer on surface of dielectric material and apertures during a first PVD process, depositing titanium nitride retarding layer on the metallic titanium nitride layer during a second PVD process, depositing aluminum seed layer on exposed portions of titanium nitride
11/02/2010US7824619 electron-donor molecules such as, for example, tetrathiafulvalene, tetraselenafulvalene, dithiophene-tetrathiafulvalene, tetrathiatetracene, N,N,N',N'-tetramethyl-phenylenediamine, trimethoxybenzene, and tetraminoanthraquinone form donor-acceptor complexes with target analytes containing explosiveTNT
11/02/2010US7824585 Apparatus and method for fabricating semiconductor packages
11/02/2010US7824520 Plasma treatment apparatus
11/02/2010US7824519 Variable volume plasma processing chamber and associated methods
11/02/2010US7824498 Coating for reducing contamination of substrates during processing
11/02/2010US7824496 Container, container producing method, substrate processing device, and semiconductor device producing method
11/02/2010US7824492 Method of growing oxide thin films
11/02/2010US7824146 Automated systems and methods for adapting semiconductor fabrication tools to process wafers of different diameters
11/02/2010US7823941 Handling device
11/02/2010US7823730 Substrate storage container
11/02/2010US7823597 Substrate processing apparatus and substrate processing method
11/02/2010US7823534 Development device and development method
11/02/2010US7823322 Silicon chip having inclined contact pads and electronic module comprising such a chip
11/02/2010US7823266 Method for manufacturing a die storage tray having machined grooves and vacuum channels
11/02/2010CA2611436C Method and device for nano-imprinting
11/02/2010CA2559219C Method for fabricating strained silicon-on-insulator structures and strained silicon-on-insulator structures formed thereby
11/02/2010CA2380261C Transport device and method of transporting to-be-processed elements through a high-temperature zone
11/02/2010CA2315434C Semiconductor device
10/2010
10/28/2010WO2010124268A2 Substrate support having side gas outlets and methods
10/28/2010WO2010124261A2 Substrate pretreatment for subsequent high temperature group iii depositions
10/28/2010WO2010124217A2 Treatment of polishing pad window
10/28/2010WO2010124213A2 A method for processing a substrate having a non-planar substrate surface
10/28/2010WO2010124179A2 Dicing before grinding process for preparation of semiconductor
10/28/2010WO2010124177A1 Multiple-electrode and metal-coated probes
10/28/2010WO2010124174A2 Ampoule with integrated hybrid valve
10/28/2010WO2010123877A2 Cvd apparatus for improved film thickness non-uniformity and particle performance
10/28/2010WO2010123829A2 Fiber laser substrate processing
10/28/2010WO2010123807A1 Fracture resistant metallization pattern for semiconductor lasers
10/28/2010WO2010123772A2 Led substrate processing
10/28/2010WO2010123765A2 Thin bond line semiconductor packages
10/28/2010WO2010123750A1 Multiple vt field-effect transistor devices
10/28/2010WO2010123741A2 Quartz window having gas feed and processing equipment incorporating same
10/28/2010WO2010123735A1 Nanoparticle plasmon scattering layer for photovoltaic cells
10/28/2010WO2010123711A2 Substrate cool down control
10/28/2010WO2010123707A2 Enhanced scavenging of residual fluorine radicals using silicon coating on process chamber walls
10/28/2010WO2010123680A2 Wafer processing deposition shielding components
10/28/2010WO2010123666A2 Method and apparatus for growing a thin film onto a substrate
10/28/2010WO2010123633A1 Double self-aligned metal oxide tft
10/28/2010WO2010123570A2 Apparatus and methodology for 3-d nano system construction and structural modification
10/28/2010WO2010123531A1 Zirconium precursors useful in atomic layer deposition of zirconium-containing films
10/28/2010WO2010123333A2 Single tub-type washing apparatus
10/28/2010WO2010123263A2 Method for manufacturing a polycrystalline silicon thin film
10/28/2010WO2010123262A2 Apparatus and method for manufacturing a polycrystalline silicon thin film