Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2010
10/20/2010CN101866896A Alpha shielding techniques and configurations
10/20/2010CN101866895A 芯片结构及其形成方法 Chip structure and method of forming
10/20/2010CN101866892A Chip layout structure and method
10/20/2010CN101866889A Substrate-free chip packaging and manufacturing method thereof
10/20/2010CN101866886A Chip packaging structure and substrate processing method thereof
10/20/2010CN101866885A Method of fabrication of a FINFET element
10/20/2010CN101866884A Processing method of word line of non-volatile memory control grid electrode
10/20/2010CN101866883A Manufacture method of CMOS (Complementary Metal Oxide Semiconductor) image sensor
10/20/2010CN101866882A Phase change memory capable of inhibiting crosscurrent between gating diodes and preparation method thereof
10/20/2010CN101866881A Optical device wafer processing method
10/20/2010CN101866880A Method for separating base plate and semiconductor layer
10/20/2010CN101866879A Interconnecting structure production method, and interconnecting structure
10/20/2010CN101866878A Forming method of conductive plug
10/20/2010CN101866877A Through hole forming method
10/20/2010CN101866876A Process for manufacturing contact hole
10/20/2010CN101866875A Method for preparing silicon germanium on insulator (SGOI) by layer transfer and ion implantation technology
10/20/2010CN101866874A Method for preparing silicon germanium on insulator (SGOI) by layer transfer technology
10/20/2010CN101866873A Slot filling method in multilayer integrated circuit
10/20/2010CN101866872A Manufacturing method of shallow trench isolation structure
10/20/2010CN101866871A Clamping and protecting device for one-sided processing
10/20/2010CN101866870A Wafer adsorbing and carrying mechanism for special equipment of semiconductor
10/20/2010CN101866869A Wafer transmission set for special equipment of semiconductor
10/20/2010CN101866868A Monitoring method of semiconductor process
10/20/2010CN101866867A Manufacturing method for lead frame of semiconductor packaging structure with no outer lead
10/20/2010CN101866866A Semiconductor integrated circuit device and method of manufacturing same
10/20/2010CN101866865A Packaging die and packaging method thereof
10/20/2010CN101866864A 电子元件安装设备 The electronic component mounting apparatus
10/20/2010CN101866863A Head assembly for chip mounter
10/20/2010CN101866862A Manufacturing method of semiconductor integrated circuit device
10/20/2010CN101866861A Integration method of high-reliability power hybrid integrated circuit
10/20/2010CN101866860A Preparation method of ZnO thin film field-effect transistor
10/20/2010CN101866859A Channel stress introducing method and field-effect transistor prepared through same
10/20/2010CN101866858A Manufacture method of sinking channel type PNPN field effect transistor
10/20/2010CN101866857A Semiconductor device and manufacturing method thereof
10/20/2010CN101866856A NPN transistor and fabricating method thereof
10/20/2010CN101866855A Method for preparing chip of high-voltage planar fast-recovery diode
10/20/2010CN101866854A Production method of ultrafast soft recovery diode chip
10/20/2010CN101866853A Substrate processing apparatus
10/20/2010CN101866852A Method for constructing interval wall
10/20/2010CN101866851A Oxidizing layer manufacture method
10/20/2010CN101866850A Structure of salicide area barrier film and preparation method thereof
10/20/2010CN101866849A Method for preparing oxide film at bottom of trench
10/20/2010CN101866848A Plasma etching method for etching organic matter layer
10/20/2010CN101866847A Method and device for improving width uniformity of groove
10/20/2010CN101866846A Method for etching groove
10/20/2010CN101866845A Method for forming grooves and double-embedding structures
10/20/2010CN101866844A Polysilicon etching method
10/20/2010CN101866843A Electrochemical corrosion method for large-distance silicon-based three-dimensional structure
10/20/2010CN101866842A Method of performing electrochemical corrosion with the help of silicon-based three-dimensional structure magnetic field
10/20/2010CN101866841A Method for forming self-aligned metal silicide at source/drain region of device
10/20/2010CN101866840A Method for taking Al2O3 as grid side wall
10/20/2010CN101866839A Method for performing rapid laser heating by using mask protection
10/20/2010CN101866838A Amorphous silicon film controllable iso-epitaxial growth method
10/20/2010CN101866837A Method for ion diffusion and semiconductor device formation
10/20/2010CN101866836A Preparation method of nanometer silicon quantum dots and application thereof in film solar batteries
10/20/2010CN101866835A Method for preparing high-germanium-content germanium-silicon virtual substrate
10/20/2010CN101866834A Method for preparing SiGe material of high-Ge component by low temperature reduced pressure chemical vapor deposition and selective epitaxy
10/20/2010CN101866833A Silicon epitaxy method for filling groove
10/20/2010CN101866832A Method for intermittently growing single-layer Ge quantum dots with high dimensional homogeneity on buffer layer by landfill
10/20/2010CN101866831A Epitaxial substrate with low surface defect density and manufacturing method thereof
10/20/2010CN101866830A Method for manufacturing semiconductor device
10/20/2010CN101866829A Method for intellectual property protection for parameterized units of integrated circuit
10/20/2010CN101866828A Electron device manufacturing chamber and forming method thereof
10/20/2010CN101866827A Gate valve and substrate-treating apparatus including the same
10/20/2010CN101866826A Fluid conveying device for vacuum processing system
10/20/2010CN101866825A Substrate processing apparatus, substrate annealing method, and semiconductor device manufacturing method
10/20/2010CN101866824A Method for reclaiming a surface of a substrate
10/20/2010CN101866823A Plasma processing equipment and method for placing workpieces to be processed on static chuck thereof
10/20/2010CN101866822A Method for preventing aluminum bonding pad from being corroded and manufacture process of aluminum bonding pad
10/20/2010CN101866802A Ion source loading and unloading device
10/20/2010CN101866371A Verification method of stereoscopic integrated circuit
10/20/2010CN101866367A IP core design of IC wafer key size microscopic image measurement algorithm
10/20/2010CN101866119A Formation method of zero object
10/20/2010CN101866118A Organic photoresist remover composition
10/20/2010CN101866114A Lithographic apparatus and device manufacturing method
10/20/2010CN101866110A Rotation test pattern of windmill-shaped scribing groove
10/20/2010CN101866083A Micro mirror layer, liquid crystal on silicon (LCOS) display device and manufacturing method thereof
10/20/2010CN101864249A Adhesive film and wafer processing tape
10/20/2010CN101863667A Ceramics and production method therefor, and ferroelectric capacitor, semiconductor device, other elements
10/20/2010CN101863450A Nanoelectrode couple containing gate electrode and preparation method thereof
10/20/2010CN101863015A Multi-joint robot
10/20/2010CN101862987A Adsorption gasket with discontinuous laminating points and manufacturing method thereof
10/20/2010CN101862908A Methods and apparatus for separating of parts
10/20/2010CN101862907A Laser beam machining method, laser beam machining apparatus, and laser machined product
10/20/2010CN101862906A Laser beam machining method, laser beam machining apparatus, and laser machined product
10/20/2010CN101862904A Laser processing method and semiconductor chip
10/20/2010CN101862897A Method for bonding copper wire of power device
10/20/2010CN101587853B Metal valley manufacture method
10/20/2010CN101556935B Manufacturing method of thin film transistor array substrate
10/20/2010CN101556903B Radio frequency identification (RFID) real-time common information system of semiconductor supply chain system
10/20/2010CN101546730B Method for reducing damages of HDP to active area
10/20/2010CN101521223B Manufacturing method of surface passivation structure of bipolar transistor
10/20/2010CN101509809B Circuit parameter demarcating method for photodetector for direct coupling and apparatus thereof
10/20/2010CN101494195B Preparation method of capacitance
10/20/2010CN101477944B Plasma processing apparatus, electrode for plasma processing apparatus, and electrode manufacturing method
10/20/2010CN101452842B Production method for metal electrode capable of reducing leakage current of device
10/20/2010CN101452215B Control method for key dimension
10/20/2010CN101425507B LED row having heat radiating fins and production method
10/20/2010CN101409234B Semiconductor structure and manufacture method thereof
10/20/2010CN101404289B Image sensor and method of fabricating the same