Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2010
10/27/2010CN101874298A Electrostatic reinforcing apparatus
10/27/2010CN101874297A Substrate rotating and oscillating apparatus for rapid thermal process
10/27/2010CN101874296A Flip chip interconnection with double post
10/27/2010CN101874295A Method for manufacturing flexible semiconductor device and multilayer film used therein
10/27/2010CN101874294A Semiconductor device manufacturing method, semiconductor device and display apparatus
10/27/2010CN101874293A Method for plasma deposition and plasma CVD system
10/27/2010CN101874292A Apparatus and method for controlling edge performance in an inductively coupled plasma chamber
10/27/2010CN101874291A Prediction and compensation of erosion in a magnetron sputtering target
10/27/2010CN101874290A Manufacturing method for laminated substrate
10/27/2010CN101874289A Semiconductor device manufacturing method and semiconductor device
10/27/2010CN101874288A Substrate holding member, substrate bonding apparatus, apparatus for manufacturing multilayer substrate, substrate bonding method, method for manufacturing multilayer substrate, and method for manufacturing multilayer semiconductor device
10/27/2010CN101874287A Through-wafer interconnections in electrostatic transducer and array
10/27/2010CN101874286A Ultra-low dislocation density Group III - Nitride semiconductor substrates grown via nano-or micro-particle film
10/27/2010CN101872817A Light-emitting diode packaging structure and manufacturing method thereof
10/27/2010CN101872814A Method for removing sapphire substrate of GaN-based LED chip
10/27/2010CN101872800A Treatment method of semiconductor substrate
10/27/2010CN101872791A Schottky diode with improved high current behaviour and method for its production
10/27/2010CN101872790A Schottky diode element having epitaxial guard ring and manufacturing method thereof
10/27/2010CN101872789A High-power high-current density rectifier diode chip and fabrication method thereof
10/27/2010CN101872788A Integrated circuit 3D memory array and manufacturing method
10/27/2010CN101872787A 金属氧化物薄膜晶体管及其制备方法 Metal oxide thin film transistor and its preparation method
10/27/2010CN101872786A Silicon carbide high pressure N-type metal oxide transistor with floating buried layer and method
10/27/2010CN101872785A Silicon carbide high pressure P-type metal oxide transistor with floating buried layer and method
10/27/2010CN101872784A Three-sided silicified gate metallic oxide semiconductor field effect transistor and preparation method thereof
10/27/2010CN101872783A Vertical super-junction bilateral diffusion metal oxide semiconductor device and manufacture method
10/27/2010CN101872779A Image display system and manufacturing method thereof
10/27/2010CN101872778A Integrated circuit 3d phase change memory array and manufacturing method
10/27/2010CN101872774A Solid-state imaging device and imaging apparatus
10/27/2010CN101872773A Thin-film transistor array substrate, display and manufacturing method thereof
10/27/2010CN101872770A Pixel unit, coplane conversion type liquid crystal display device and manufacturing method
10/27/2010CN101872769A Ferroelectric dynamic random access memory based on atomic layer deposited isolating layer and preparation method
10/27/2010CN101872768A Ferroelectric dynamic random storage based on bismuth based storage materials and preparation method thereof
10/27/2010CN101872767A Silicon nitride trap layer olive-shaped energy band gap structure and manufacturing method thereof of SONOS (Silicon Oxide Nitride Oxide Semiconductor) component
10/27/2010CN101872766A OTP (One Time Programmable) device and preparation method thereof
10/27/2010CN101872765A NMOS (N-channel Metal Oxide Semiconductor) one time programmable device and manufacture method thereof
10/27/2010CN101872764A OTP-ROM (One Time Programmable Read Only Memory), memory units thereof and manufacturing, programming and reading method thereof
10/27/2010CN101872763A LDMOS (Laterally Diffused Metal Oxide Semiconductor) device capable of reducing substrate current and manufacturing method thereof
10/27/2010CN101872756A Semiconductor device and manufacturing method of semiconductor device
10/27/2010CN101872754A Welding wire joint structure, method for strengthening welding wire joint and manufacturing method of semiconductor encapsulation construction
10/27/2010CN101872753A Restoration of electrical and mechanical connectability to an electrical device with a face equipped with contact studs
10/27/2010CN101872752A Electronic label package and manufacturing method thereof
10/27/2010CN101872750A Chip structure, stack chip packaging structure and manufacturing method of chip structure
10/27/2010CN101872746A Method for enhancing reliability of SONOS (Silicon Oxide Nitride Oxide Semiconductor) flash memory by adopting ND3 annealing
10/27/2010CN101872745A Semiconductor memory device and method for manufacturing the same
10/27/2010CN101872744A Method for producing a compound semiconductor MMIC (Monolithic Microwave Integrated Circuit) chip on silicon substrate
10/27/2010CN101872743A Preparation method of depletion region in MOS (Metal Oxide Semiconductor) image sensor
10/27/2010CN101872742A Semiconductor device and manufacturing method
10/27/2010CN101872741A Dominant wavelength distribution convergent light emitting element and manufacturing method thereof
10/27/2010CN101872740A Method of manufacturing SOI substrate
10/27/2010CN101872739A Groove filling method
10/27/2010CN101872738A Groove filling method
10/27/2010CN101872737A MOS structure for inhibiting SOI floating-body effect and manufacturing method thereof
10/27/2010CN101872736A Substrate platform shelf and substrate processing apparatus
10/27/2010CN101872735A Sucking and holding apparatus, sucking and holding method, transporting apparatus, and transporting method
10/27/2010CN101872734A Suction hold hand, suction hold method, and carrying device
10/27/2010CN101872733A System and method for sensing and removing residual charge of processed semiconductor process component
10/27/2010CN101872732A Substrate holder, substrate carrying arm and substrate carrying device
10/27/2010CN101872731A Lifting device and plasma processing equipment applying same
10/27/2010CN101872730A Method for filling silicon through holes by using carbon nanotube clusters
10/27/2010CN101872729A Routing device, and protective gas automatic switching system and method thereof
10/27/2010CN101872728A Manufacturing method of solder pad layer
10/27/2010CN101872727A Chip welding method and structure
10/27/2010CN101872726A Manufacture method of semiconductor device
10/27/2010CN101872725A Manufacturing method of semiconductor structure and semiconductor element
10/27/2010CN101872724A Manufacturing method of super junction MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor)
10/27/2010CN101872723A Germanium tunnelling diode and preparation method thereof
10/27/2010CN101872722A Metal layer surface treatment method
10/27/2010CN101872721A Apparatus and method for confined area planarization
10/27/2010CN101872720A Method of manufacturing semiconductor device
10/27/2010CN101872719A Epitaxial growth method for improving In component uniformity of InGaN quantum well
10/27/2010CN101872718A Preparation method of graphene wafer
10/27/2010CN101872717A Coating and developing apparatus, coating and developing method
10/27/2010CN101872716A Method for optimized removal of wafer from electrostatic chuck
10/27/2010CN101872715A Wafer defect marking system
10/27/2010CN101872714A On-line detection method and system for wafer
10/27/2010CN101872713A Electrostatic chuck device, plasma processing device and method for manufacturing electrostatic chuck device
10/27/2010CN101872529A Wafer bumping alarm system for wafer processing equipment
10/27/2010CN101872173A Method for bin-based control
10/27/2010CN101872130A Lithographic projection apparatus
10/27/2010CN101872129A Lithographic apparatus and device manufacturing method
10/27/2010CN101872126A Wet soluble lithography
10/27/2010CN101872096A Pixel structure of liquid crystal display and manufacturing method thereof
10/27/2010CN101872095A Liquid crystal display panel and forming method thereof
10/27/2010CN101872094A Panel processing device and method thereof
10/27/2010CN101871110A Electrocoppering method
10/27/2010CN101871096A Methods and apparatuses for transferring articles through a load lock chamber under vacuum
10/27/2010CN101870394A Antivibration mechanism for article receiving container
10/27/2010CN101870142A Cutting device, cutting device assembly and cutting method
10/27/2010CN101870141A Cutting device, cutting device having dewatering exhaust mechanism and environment control method
10/27/2010CN101870085A Method for simultaneous grinding of a plurality of semiconductor wafers
10/27/2010CN101869903A Systems and methods for capture substrates
10/27/2010CN101621027B Method for adjusting characteristics of variable capacitance diode by using local secondary doping process
10/27/2010CN101621004B Method for enhancing characteristic frequency and linearity of gallium nitride transistor with high electron mobility
10/27/2010CN101593707B Packaging method used for high-power integrated circuit
10/27/2010CN101556932B Series/parallel connection two-coordinate precise motion locating platform
10/27/2010CN101542707B Semiconductor device inspecting method and semiconductor device inspecting apparatus
10/27/2010CN101496142B Method for manufacturing semiconductor substrate
10/27/2010CN101483184B Image sensor and method for manufacturing the same
10/27/2010CN101467240B Semiconductor device and touch sensor device
10/27/2010CN101467238B Formation of carbon and semiconductor nanomaterials using molecular assemblies
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