Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2010
10/28/2010WO2010123162A1 Process for formation of hierarchical microstructure using partial curing
10/28/2010WO2010123101A1 Radiation-sensitive resin composition
10/28/2010WO2010123009A1 Radiation-sensitive resin composition, polymer, and method for forming resist pattern
10/28/2010WO2010123001A1 Cleaning agent for silicon wafer
10/28/2010WO2010123000A1 Top coating composition
10/28/2010WO2010122985A1 Polishing liquid for semiconductor substrate and method for polishing semiconductor substrate
10/28/2010WO2010122972A1 Liquid raw material vaporizer
10/28/2010WO2010122948A1 Composition for forming resist underlayer film for euv lithography
10/28/2010WO2010122933A1 Method for manufacturing iii nitride crystal substrate
10/28/2010WO2010122921A1 Phthalocyanine nanowires, ink composition and electronic element each containing same, and method for producing phthalocyanine nanowires
10/28/2010WO2010122866A1 Laser machining method
10/28/2010WO2010122821A1 Process for producing indium-phosphorus substrate, process for producing epitaxial wafer, indium-phosphorus substrate, and epitaxial wafer
10/28/2010WO2010122795A1 Semiconductor device
10/28/2010WO2010122788A1 Moving-object apparatus, exposure apparatus, exposure method, and device manufacturing method
10/28/2010WO2010122757A1 Method for mounting semiconductor package component, and structure having semiconductor package component mounted therein
10/28/2010WO2010122754A1 Semiconductor integrated circuit
10/28/2010WO2010122701A1 Soi wafer, method for producing same, and method for manufacturing semiconductor device
10/28/2010WO2010122698A1 Method for verifying layout of semiconductor integrated circuit
10/28/2010WO2010122697A1 Pellicle for lithography and manufacturing method thereof
10/28/2010WO2010122695A1 Substrate structure and semiconductor device
10/28/2010WO2010122689A1 Display device
10/28/2010WO2010122628A1 Compound semiconductor device and method for manufacturing the same
10/28/2010WO2010122622A1 Solid state imaging device
10/28/2010WO2010122459A2 Method and apparatus for high aspect ratio dielectric etch
10/28/2010WO2010122454A1 Method for fabricating an integrated-passives device with a mim capacitor and a high-accuracy resistor on top
10/28/2010WO2010122153A1 Method and device for introducing and removing substrates
10/28/2010WO2010122152A1 Transport device having a deflectable sealing frame
10/28/2010WO2010122023A2 Method to thin a silicon-on-insulator substrate
10/28/2010WO2010121703A1 Device and method for separating a substrate from a carrier substrate
10/28/2010WO2010121702A1 Device for aligning and pre-attaching a wafer
10/28/2010WO2010121701A1 Receiving device for receiving semiconductor substrates
10/28/2010WO2010101858A3 Hermetic packaging of integrated circuit components
10/28/2010WO2010100577A3 Method of bonding a semiconductor device using a compliant bonding structure
10/28/2010WO2010099051A3 Ceramic sealed transmissive substrate assemblies
10/28/2010WO2010093733A3 Detecting defects on a wafer
10/28/2010WO2010090846A3 Particle reduction treatment for gas delivery system
10/28/2010WO2010088139A3 Compact abbe's kernel generation using principal component analysis
10/28/2010WO2010087638A3 Batch-type substrate-processing apparatus
10/28/2010WO2010085685A3 Diffusion barrier layers
10/28/2010WO2010085439A3 Self-aligned selective emitter formed by counterdoping
10/28/2010WO2010082902A3 System and method for inspecting a wafer
10/28/2010WO2010082901A3 System and method for inspecting a wafer
10/28/2010WO2010077299A3 High pressure bevel etch process
10/28/2010WO2010065459A3 Method of etching organosiloxane dielectric material and semiconductor device thereof
10/28/2010WO2010029138A9 Method of etching using a multilayer masking structure
10/28/2010WO2010019286A3 Subset selection of rfid tags using light
10/28/2010WO2010015678A3 Improving solder bump connections in semiconductor devices
10/28/2010US20100275177 Method for transferring self-assembled dummy pattern to substrate
10/28/2010US20100275174 Semiconductor device pattern creation method, pattern data processing method, pattern data processing program, and semiconductor device manufacturing method
10/28/2010US20100274523 Apparatus and method for real time measurement of substrate temperatures for use in semiconductor growth and wafer processing
10/28/2010US20100273401 Polishing apparatus and polishing method
10/28/2010US20100273396 Polishing method, polishing apparatus and method of monitoring a substrate
10/28/2010US20100273334 Millisecond annealing (dsa) edge protection
10/28/2010US20100273333 Heat treatment method and heat treatment apparatus for heating substrate by light irradiation
10/28/2010US20100273332 Method and apparatus for high aspect ratio dielectric etch
10/28/2010US20100273331 Method of fabricating a nano/micro structure
10/28/2010US20100273330 Rinse formulation for use in the manufacture of an integrated circuit
10/28/2010US20100273329 Method for preparing a donor surface for reuse
10/28/2010US20100273328 Method for producing an organometallic layer
10/28/2010US20100273327 Method for improving uniformity and adhesion of low resistivity tungsten film
10/28/2010US20100273326 Method for purifying unsaturated fluorocarbon compound, method for forming fluorocarbon film, and method for producing semiconductor device
10/28/2010US20100273325 Method of manufacturing semiconductor device
10/28/2010US20100273324 Methods of manufacturing metal-silicide features
10/28/2010US20100273323 Pre-treatment method to increase copper island density of cu on barrier layers
10/28/2010US20100273322 Method of processing a substrate having a non-planar surface
10/28/2010US20100273321 Wet soluble lithography
10/28/2010US20100273320 Device and method for selectively depositing crystalline layers using mocvd or hvpe
10/28/2010US20100273319 Method for Manufacturing Semiconductor Device
10/28/2010US20100273318 Substrate pretreatment for subsequent high temperature group iii depositions
10/28/2010US20100273317 Method of growing, on a dieletric material, nanowires made of semi-conductor materials connecting two electrodes
10/28/2010US20100273316 Method for fabricating silicon and/or germanium nanowires
10/28/2010US20100273315 Thin Film Deposition via Charged Particle-Depleted Plasma Achieved by Magnetic Confinement
10/28/2010US20100273314 Non-circular substrate holders
10/28/2010US20100273313 Manufacturing method of laser processed parts, and pressure-sensitive adhesive sheet for laser processing used for the same
10/28/2010US20100273312 Method of manufacturing semiconductor device
10/28/2010US20100273311 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
10/28/2010US20100273310 Method of manufacturing soi substrate
10/28/2010US20100273309 Method for forming a self aligned isolation trench
10/28/2010US20100273308 Semiconductor structure and method of manufacture
10/28/2010US20100273307 Method of making a device including a capacitive structure
10/28/2010US20100273305 Electro- and Electroless Plating of Metal in the Manufacture of PCRAM Devices
10/28/2010US20100273304 Method of fabricating semiconductor device
10/28/2010US20100273303 Memory Arrays and Methods of Fabricating Memory Arrays
10/28/2010US20100273302 Memory device and manufacturing method thereof
10/28/2010US20100273300 Semiconductor device and method for manufacturing the same
10/28/2010US20100273299 Method for fabricating non-volatile storage with individually controllable shield plates between storage elements
10/28/2010US20100273298 Method of Making Integrated Circuit Chip Utilizing Oriented Carbon Nanotube Conductive Layers
10/28/2010US20100273297 Chip packaging method
10/28/2010US20100273296 Thermally Enhanced Wafer Level Package
10/28/2010US20100273295 Surface-Decorated Polymeric Amphiphile Porogens for the Templation of Nanoporous Materials
10/28/2010US20100273294 Compact Co-packaged Semiconductor Dies with Elevation-adaptive Interconnection Plates
10/28/2010US20100273293 Substrate for a microelectronic package and method of fabricating thereof
10/28/2010US20100273290 Mocvd single chamber split process for led manufacturing
10/28/2010US20100273289 Method of fabricating a backside illuminated image sensor
10/28/2010US20100273286 Method Of Fabricating An Integrated CMOS-MEMS Device
10/28/2010US20100273285 Array Substrate for LCD and Method of Fabrication Thereof
10/28/2010US20100273284 Array substrate for liquid crystal display device and method of manufacturing the same
10/28/2010US20100273283 Method of manufacturing flat panel display
10/28/2010US20100273282 Liquid crystal display device and method of fabricating the same
10/28/2010US20100273281 Laser diode and method for fabricating same
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