Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2011
02/24/2011US20110042672 Coplanar waveguide having amorphous silicon layer between substrate and insulated layer and a manufacturing method thereof
02/24/2011US20110042670 Thin film transistor and method of manufacturing the same
02/24/2011US20110042667 Semiconductor device and method for manufacturing the same
02/24/2011US20110042646 Nitride semiconductor wafer, nitride semiconductor chip, method of manufacture thereof, and semiconductor device
02/24/2011US20110042642 Method for producing nanostructures on metal oxide substrate, method for depositing thin film on same, and thin film device
02/24/2011US20110042641 Branched nanoscale wires
02/24/2011US20110042640 Method of fabricating phase change memory cell
02/24/2011US20110042639 Memory cell that employs a selectively grown reversible resistance-switching element and methods of forming the same
02/24/2011US20110042622 Resist pattern and reflow technology
02/24/2011US20110042588 Semiconductor manufacturing apparatus
02/24/2011US20110042578 Ion beam monitoring arrangement
02/24/2011US20110042467 Semiconductor memory device and semiconductor memory card
02/24/2011US20110042266 Wafer container with cushion sheets
02/24/2011US20110042224 Apparatus and methods for electrochemical processing of microfeature wafers
02/24/2011US20110042128 Coreless packaging substrate and method for fabricating the same
02/24/2011US20110042046 Integrated coolant circuit arrangement, operating method and production method
02/24/2011US20110042007 Etching apparatus and etching method for substrate bevel
02/24/2011US20110042006 E-chuck with automated clamped force adjustment and calibration
02/24/2011US20110042005 Processing Systems and Methods for Semiconductor Devices
02/24/2011US20110041900 Solar cells having nanowires and methods of fabricating nanowires
02/24/2011US20110041764 Batch processing platform for ald and cvd
02/24/2011US20110041329 Room temperature metal direct bonding
02/24/2011DE19929026B4 Verfahren zur Herstellung eines Drucksensors A process for producing a pressure sensor
02/24/2011DE112009001026T5 Flüssig-Phase molekulare Selbstanordnung zur Barrieren-Ablagerung und Strukturen, die damit gebildet sind Liquid-phase molecular self-assembly to the barrier deposition and structures formed thereby
02/24/2011DE112009001018T5 Phasenerinnerung für dielektrische Filme mit geringer Ableitung Phase memory for dielectric films with low leakage
02/24/2011DE112009000207T5 Substraterfassungsvorrichtung und Substratfördervorrichtung Substrate detection apparatus and substrate conveyor
02/24/2011DE112006002487B4 Herstellung von Gruppe-III-Nitrid-Halbleiter-Bauteilen Preparation of group-III nitride semiconductor devices
02/24/2011DE112005002998B4 Transistoranordnung und Verfahren zur Herstellung derselben Transistor device and method of manufacturing the same
02/24/2011DE112004001324B4 Filme mit niedriger Dielektrizitätskonstante und Herstellungsverfahren für diese Filme sowie elektronische Bauteile, die diese Filme verwenden Low dielectric constant films and manufacturing methods for these films, and electronic components using these films
02/24/2011DE112004001049B4 Verfahren zum Herstellen einer nichtflüchtigen Speichervorrichtung A method of manufacturing a nonvolatile memory device
02/24/2011DE10260619B4 Verfahren zur Herstellung einer Deckschicht mit antireflektierenden Eigenschaften auf einem Dielektrikum mit kleinem ε A process for producing a coating having anti-reflective properties to a dielectric with small ε
02/24/2011DE102010039148A1 Elektronische Vorrichtung und Verfahren zu deren Fertigung An electronic device and method for its manufacturing
02/24/2011DE102010038933A1 Halbleitervorrichtung mit Halbleiterchip und Metallplatte und Verfahren zu deren Fertigung A semiconductor device having semiconductor chip and metal plate, and methods for their production
02/24/2011DE102010038910A1 Halbleitervorrichtung mit Durchgangselektrode und Herstellungsverfahren A semiconductor device having through-electrode and production method
02/24/2011DE102010036678A1 Multichip-Modul und Verfahren zu seiner Herstellung Multi-chip module and method for its preparation
02/24/2011DE102010036402A1 Lufthohlraum-Baustein mit Kupferkühlkörper und keramischem Fensterrahmen Air cavity block with copper heat sink and ceramic window frame
02/24/2011DE102010027852A1 Maskenrahmenanordnung zur Dünnfilmabscheidung und zugehörige Verfahren Mask frame assembly for thin film deposition and associated methods
02/24/2011DE102010026987A1 Herstellvorrichtung und -verfahren für Halbleiterbauelement Fabrication and method for semiconductor device
02/24/2011DE102010025506A1 Halbleitervorrichtung Semiconductor device
02/24/2011DE102009035887A1 Vorrichtung zur Beleuchtung einer Bar oder Theke Apparatus for illuminating a bar or counter
02/24/2011DE102009032219A1 Verfahren zum Herstellen einer integrierten Schaltung und resultierender Folienchip A method of fabricating an integrated circuit chip and resulting film
02/24/2011DE102009023251B4 Verfahren zur Herstellung eines Kontaktelements mit großem Aspektverhältnis und mit einer günstigeren Form in einem Halbleiterbauelement zur Verbesserung der Abscheidung einer Beschichtung A process for producing a contact element with a high aspect ratio and with a more favorable form in a semiconductor device for improving the deposition of a coating
02/24/2011DE102006045125B4 Feldeffekttransistoranordnung, Speichereinrichtung und Verfahren zur Herstellung solcher sowie einer 3D-Polysiliziumstruktur Field effect transistor device, storage device and method of making such, as well as a 3D-polysilicon structure
02/24/2011DE102006026218B4 Flüssigkristalldisplay-Tafel und Herstellungsverfahren für diese Liquid crystal display panel and manufacturing method for this
02/24/2011DE102006024121B4 Nichtflüchtige Speicherzelle einer in einem Halbleiterplättchen integrierten Schaltung, Verfahren zu deren Herstellung und Verwendung einer nichtflüchtigen Speicherzelle A non-volatile memory cell of an integrated circuit in a semiconductor wafer, to processes for their preparation and use a non-volatile memory cell
02/24/2011DE102005018346B4 Halbleiterchip für eine vollständig verarmte SOI-Mehrfach-Schwellenspannungs-Anwendung und ein Verfahren zu dessen Herstellung A semiconductor chip for a fully depleted SOI-multiple threshold voltage application and a process for its preparation
02/24/2011DE102004060448B4 Verfahren zum Bilden einer Isolationsschicht in einem Halbleiterbauelement A method of forming an insulating layer in a semiconductor device
02/24/2011DE102004051180B4 Waferteilungsverfahren Wafer dividing method
02/24/2011DE102004028331B4 Verfahren zum Kristallisieren von Silicium Method of crystallizing silicon
02/24/2011DE102004004539B4 Waferverbindung unter Verwendung von Reaktivfolien zum Häusen mikro-elektromechhanischer Systeme Wafer bonding using reactive foils for housing micro-elektromechhanischer systems
02/24/2011DE10112783B4 Halbleiteranordnung mit einem Leistungs-MOSFET und einem Widerstandselement A semiconductor device having a power MOSFET and a resistor element
02/24/2011CA2738680A1 Semiconductor device
02/24/2011CA2676495A1 Mechanical barrier element for improved thermal reliability of electronic components
02/23/2011EP2288244A1 Wiring circuit substrate
02/23/2011EP2288030A1 I/O cell configuration for multiple I/O standards
02/23/2011EP2287988A1 Article conveying robot device
02/23/2011EP2287929A2 Power light emitting die package with reflecting lens and the method of making the same
02/23/2011EP2287928A2 Power light emitting die package with reflecting lens and the method of making the same
02/23/2011EP2287927A2 Power light emitting die package with reflecting lens and the method of making the same
02/23/2011EP2287926A2 Power Light Emitting Die Package With Reflecting Lens And The Method Of Making The Same
02/23/2011EP2287924A2 Substrate Structures and Methods of Manufacturing the same
02/23/2011EP2287916A2 Method of contacting and housing integrated circuits
02/23/2011EP2287911A2 Photoelectric X-ray converter, its driving method, and system including the photoelectric X-ray converter
02/23/2011EP2287907A2 Semiconductor integrated circuit
02/23/2011EP2287906A2 Semiconductor integrated circuit
02/23/2011EP2287904A1 Method for assembling two electronic components
02/23/2011EP2287902A1 Magnetic memory cell and magnetic random access memory
02/23/2011EP2287901A2 Improvements relating to semiconductor devices
02/23/2011EP2287900A1 Holder for wafers
02/23/2011EP2287899A1 Solder connection with a multilayered solderable layer
02/23/2011EP2287898A2 Shrink Package on Board
02/23/2011EP2287897A2 Circuit member for semiconductor device, semiconductor device using the same, and process for producing said circuit member and said semiconductor device
02/23/2011EP2287896A2 Method for low temperature bonding and bonded structure
02/23/2011EP2287895A1 Semiconductor device and production method thereof
02/23/2011EP2287894A2 Exposure apparatus, exposure method and device manufacturing method
02/23/2011EP2287893A2 Exposure apparatus, exposure method and device manufacturing method
02/23/2011EP2287891A2 High performance system-on-chip using post passivation process
02/23/2011EP2287890A2 High performance system-on-chip using post passivation process
02/23/2011EP2287889A2 High performance system-on-chip using post passivation process
02/23/2011EP2287886A1 Plasma treatment system
02/23/2011EP2287825A2 Active matrix substrate, electro-optical device, and electronic device
02/23/2011EP2287670A1 Methods of forming electronic devices
02/23/2011EP2287669A1 Methods of forming electronic devices
02/23/2011EP2287668A1 Methods of forming electronic devices
02/23/2011EP2287667A1 Self-aligned spacer multiple patterning methods
02/23/2011EP2287594A1 Method for inspecting defects, and defect inspecting apparatus
02/23/2011EP2287370A1 A l X G a 1-X N SINGLE CRYSTAL AND ELECTROMAGNETIC WAVE TRANSMISSION BODY
02/23/2011EP2287368A2 Apparatus and method for producing (Ai, Ga, In)N material using an in-situ laser for parting this material
02/23/2011EP2287262A1 Connecting material
02/23/2011EP2287095A2 Non-contact type of vacuum pad
02/23/2011EP2286980A1 Mold for nanoimprinting, process for producing the same, and processes for producing molded resin having fine rugged structure on surface and for producing wire-grid polarizer
02/23/2011EP2286929A1 Methods of nanotube films and articles
02/23/2011EP2286469A1 Semiconductor body and method for producing a semiconductor body
02/23/2011EP2286455A1 Trench gate semiconductor device and method of manufacturing thereof.
02/23/2011EP2286451A2 Foil based semiconductor package
02/23/2011EP2286450A1 Read-only memory with eeprom structure
02/23/2011EP2286449A1 Thermo-mechanical stress in semiconductor wafers
02/23/2011EP2286448A1 Electrostatic chuck
02/23/2011EP2286447A2 Substrate matrix to decouple tool and process effects
02/23/2011EP2286446A1 Electronic device and method of manufacturing an electronic device