Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2011
02/23/2011EP2286445A1 Method for manufacturing an electronic device
02/23/2011EP2286443A2 In-line effluent analysis method and apparatus for cmp process control
02/23/2011EP2286442A1 Method of fabrication of low value resistors in a semiconductor material
02/23/2011EP2286441A2 Device and method for inspecting semiconductor wafers
02/23/2011EP2286007A1 Method for testing group-iii nitride wafers and group iii-nitride wafers with test data
02/23/2011EP2285919A1 Method for producing a metal structure on a surface of a semiconductor substrate
02/23/2011EP2089899B1 Device for positioning and/or pressing a planar component relative to a substrate and method for positioning a picking tool relative to a substrate
02/23/2011EP2079856B1 Method and apparatus for single-sided etching
02/23/2011EP2065115B1 Method for bonding a wire containing copper with the use of at least two plasma nozzles
02/23/2011EP2027509B1 Immersion flow field maintenance system for immersion lithography machine
02/23/2011EP1878809B1 ELEMENT STRUCTURE USING A Al-Ni-B ALLOY WIRING MATERIAL
02/23/2011EP1859077B1 A system and a method for the production of micro-electro-mechanical systems
02/23/2011EP1636848B1 Semiconductor device
02/23/2011EP1612853B1 Cooling device for vacuum treatment device
02/23/2011EP1543547B1 Method for controlling etch depth
02/23/2011EP1246258B1 Semiconductor device and information processing device
02/23/2011EP0913074B1 Plasma etch reactor and method of etching a wafer
02/23/2011CN201752013U Packaging structure capable of directly placing multi-ring pin by chip and passive device
02/23/2011CN201752012U Base island exposed and embedded type base island multi-turn pin encapsulation structure
02/23/2011CN201752011U Foundation island-free and multi-ring pin packaging structure
02/23/2011CN201752010U Base-island-free electrostatic discharge ring packaging structure
02/23/2011CN201752009U Lead frame structure of static discharge coil with multiple circles of pins but without base island
02/23/2011CN201752008U Paddle-free lead frame structure with static discharge ring
02/23/2011CN201752007U Lead frame structure with base island and multiple circles of pins
02/23/2011CN201752006U Encapsulation structure with base island and multiple circles of pins
02/23/2011CN201752004U Packaging structure for arranging chip directly
02/23/2011CN201752003U Lead frame structure for flip chip
02/23/2011CN201751976U Processing device with plasma
02/23/2011CN1943055B Semiconductor device structure and methods of fabricating array including the structure
02/23/2011CN1862805B Ground shield and related method
02/23/2011CN1812112B Solid image sensor device with nonplanar transistor and manufacture method thereof
02/23/2011CN1721302B Substrate conveying apparatus for sequence type substrate box
02/23/2011CN1674222B Semiconductor substrate, semiconductor device, and manufacturing methods for them
02/23/2011CN101981710A Semiconductor light emitting element and method for manufacturing the same
02/23/2011CN101981705A Photovoltaic solar cell and method of production thereof
02/23/2011CN101981703A Photodetector with valence-mending adsorbate region and a method of fabrication thereof
02/23/2011CN101981702A 半导体装置 Semiconductor device
02/23/2011CN101981701A Semiconductor device, and method for manufacturing the same
02/23/2011CN101981690A Method for manufacturing a MOS semiconductor memory device, and plasma CVD device
02/23/2011CN101981689A Semiconductor memory and method for manufacturing the same
02/23/2011CN101981688A Method of manufacturing a semiconductor device and semiconductor device
02/23/2011CN101981687A Photonic clock stabilized laser comb processing
02/23/2011CN101981686A Method for integrating selective low-temperature ruthenium deposition into copper metallization of a semiconductor device
02/23/2011CN101981685A [100] or [110] aligned, semiconductor-based, large-area, flexible, electronic devices
02/23/2011CN101981684A Methods and apparatuses for large diameter wafer handling
02/23/2011CN101981683A Method for classifying defects, computer storage medium, and device for classifying defects
02/23/2011CN101981682A Method and device for application of a chip module
02/23/2011CN101981681A Apparatus and method for mounting component
02/23/2011CN101981680A Flip chip assembly process for ultra thin substrate and package on package assembly
02/23/2011CN101981679A Bonding apparatus and bonding method
02/23/2011CN101981678A A method for fabricating thin films
02/23/2011CN101981677A Epitaxial substrate for smeiconductor element, semiconductor element, and process for producing epitaxial substrate for semiconductor element
02/23/2011CN101981676A Semiconductor device, semiconductor device manufacturing method, liquid crystal display device and electronic apparatus
02/23/2011CN101981675A Laminated structure, method of manufacturing a laminated structure, electronic element, electronic element array, image displaying medium, and image displaying device
02/23/2011CN101981674A A semiconductor device comprising a metal gate stack of reduced height and method of forming the same
02/23/2011CN101981673A Metal gate structure and method of manufacturing same
02/23/2011CN101981672A Multi-layer thick metallization structure for a microelectronic device, integrated circuit containing same, and method of manufacturing an integrated circuit containing same
02/23/2011CN101981671A Film forming method and semiconductor device manufacturing method
02/23/2011CN101981670A Selective formation of dielectric etch stop layers
02/23/2011CN101981669A Shower plate and plasma processing device using the same
02/23/2011CN101981668A Control method and processor of exhaust gas flow rate of processing chamber
02/23/2011CN101981667A Processes and solutions for substrate cleaning and electroless deposition
02/23/2011CN101981666A Improved carrier head membrane
02/23/2011CN101981665A Colloidal silica with modified surface and polishing composition for CMP containing the same
02/23/2011CN101981664A Methods for etching the edge of a silicon wafer
02/23/2011CN101981663A Method for forming a priming layer for depositing a metal on a substrate
02/23/2011CN101981662A Method of forming stacked trench contacts and structures formed thereby
02/23/2011CN101981661A Ion source cleaning in semiconductor processing systems
02/23/2011CN101981660A Organometallic-compound feeder
02/23/2011CN101981659A Method for depositing an amorphous carbon film with improved density and step coverage
02/23/2011CN101981658A Epitaxial substrate for semiconductor element, semiconductor element, and process for producing epitaxial substrate for semiconductor element
02/23/2011CN101981657A Methods of forming buffer layer architecture on silicon and structures formed thereby
02/23/2011CN101981656A Zone melt recrystallization for inorganic films
02/23/2011CN101981655A Methods for fabricating line/space routing between C4 pads
02/23/2011CN101981654A Method for producing SOI substrate
02/23/2011CN101981653A Methods and apparatus for conserving electronic device manufacturing resources
02/23/2011CN101981512A Alignment device for planar element, manufacturing equipment for the same, alignment method for the same, and manufacturing method for the same
02/23/2011CN101981502A Photosensitive resin composition, photosensitive element, method of forming resist pattern and method of producing printed wiring board
02/23/2011CN101981237A AlxGa(1-x)As substrate, epitaxial wafer for infrared LED, infrared LED, method for production of AlxGa(1-x)As substrate, method for production of epitaxial wafer for infrared LED, and method for production of infrared LED
02/23/2011CN101981225A Low wet etch rate silicon nitride film
02/23/2011CN101981154A Base-generating agent, photosensitive resin composition, pattern-forming material comprising the photosensitive resin composition, pattern formation method using the photosensitive resin composition, and article
02/23/2011CN101981098A Etching method and substrate having conductive polymer
02/23/2011CN101980935A Method and device for fixing and transporting impact-sensitive sheets in sputter feed systems
02/23/2011CN101980798A Plasma cleaning apparatus for a semiconductor panel with cleaning chambers
02/23/2011CN101980365A Pixel structure and manufacturing method thereof
02/23/2011CN101980361A Ic having wafer paste sheet adhesive tape and encapsulation method tehreof
02/23/2011CN101980359A Semiconductor package and manufacturing method thereof
02/23/2011CN101980358A Method for fabricating an isolation structure
02/23/2011CN101980357A Semiconductor device and mold for resin-molding semiconductor device
02/23/2011CN101980356A Structures of and methods of fabricating trench-gated mis devices
02/23/2011CN101980355A Non-volatile memories and methods of fabrication thereof
02/23/2011CN101593680B Methods to fabricate mosfet devices using a selective deposition process
02/23/2011CN101553914B Method of manufacturing openings in a substrate, a via in a substrate, and a semiconductor device comprising such a via
02/23/2011CN101552225B Manufacturing method of contact portion and thin film transistor array panel
02/23/2011CN101542742B Thin-film transistor, its manufacturing method, and display
02/23/2011CN101484976B Electric device comprising an improved electrode and its manufacture method
02/23/2011CN101483183B Image sensor and method for manufacturing the same
02/23/2011CN101399277B Image sensor having large micro-lenses at the peripheral regions
02/23/2011CN101390197B Substrate treating device, substrate convey device, substrate grasping device, and chemical solution treating device
02/23/2011CN101339940B Encapsulation construction and encapsulation method