Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2011
03/03/2011US20110053349 Application of millisecond heating source for surface treatment
03/03/2011US20110053348 Semiconductor device and method of manufacturing the same
03/03/2011US20110053347 Method for manufacturing semiconductor device
03/03/2011US20110053346 Dicing/die bonding film
03/03/2011US20110053345 Method for reprocessing semiconductor substrate, method for manufacturing reprocessed semiconductor substrate, and method for manufacturing soi substrate
03/03/2011US20110053344 Semiconductor on insulator and methods of forming same using temperature gradient in an anodic bonding process
03/03/2011US20110053343 Method for manufacturing semiconductor device
03/03/2011US20110053342 Semiconductor substrate surface preparation method
03/03/2011US20110053341 Integrated circuit arrangement comprising isolating trenches and a field effect transistor and associated production method
03/03/2011US20110053340 Method of forming a trench isolation
03/03/2011US20110053339 Method for manufacturing semiconductor device
03/03/2011US20110053338 Flash memory and method of fabricating the same
03/03/2011US20110053337 Self-alignment method for recess channel dynamic random access memory
03/03/2011US20110053336 Method for selective deposition of dielectric layers on semiconductor structures
03/03/2011US20110053335 Phase-change memory device and method of manufacturing phase-change memory device
03/03/2011US20110053334 Phase change memory device with heater electrodes having fine contact area and method for manufacturing the same
03/03/2011US20110053333 Phase change memory devices and methods for fabricating the same
03/03/2011US20110053332 Semiconductor circuit
03/03/2011US20110053331 Bipolar transistor finfet technology
03/03/2011US20110053330 Method of manufacturing semiconductor device
03/03/2011US20110053329 Semiconductor device including a gate electrode of lower electrial resistance and method of manufacturing the same
03/03/2011US20110053328 Method for manufacturing memory cell
03/03/2011US20110053327 Method of forming recess and method of manufacturing semiconductor device having the same
03/03/2011US20110053326 Super junction trench power mosfet device fabrication
03/03/2011US20110053325 Method for producing semiconductor device
03/03/2011US20110053324 Manufacturing method of semiconductor device and electronic device
03/03/2011US20110053323 Photomask and method for fabricating source/drain electrode of thin film transistor
03/03/2011US20110053322 Semiconductor device and method for manufacturing the same
03/03/2011US20110053321 Method of fabricating and encapsulating mems devices
03/03/2011US20110053320 Method of fabricating a semiconductor device
03/03/2011US20110053319 Method for Fabricating a Circuit Substrate Assembly and a Power Electronics Module Comprising an Anchoring Structure for Producing a Changing Temperature-Stable Solder Bond
03/03/2011US20110053318 Fabrication method of package structure
03/03/2011US20110053317 Phase change ram device and method for fabricating the same
03/03/2011US20110053316 Organic Thin Film Transistor With Tunneling Barrier Layer and Method for Manufacturing the Same
03/03/2011US20110053306 Photovoltaic Lead Manufacture
03/03/2011US20110053305 Solid-state imaging device, camera and method of producing the solid-stae imaging device
03/03/2011US20110053304 Method of making an electronic device with a curved backplate
03/03/2011US20110053303 Method of fabricating semiconductor substrate and method of fabricating light emitting device
03/03/2011US20110053295 Resin application apparatus, optical property correction apparatus and method, and method for manufacturing led package
03/03/2011US20110053294 Uv irradiance monitoring in semiconductor processing using a temperature dependent signal
03/03/2011US20110053293 Magnetic memory device and method of fabricating the same
03/03/2011US20110053058 Semiconductor device fabrication mask and method of manufacturing the same
03/03/2011US20110052349 Vacuum processing apparatus and substrate transfer method
03/03/2011US20110051767 High-power diode laser and method for producing a high-power diode laser
03/03/2011US20110051765 Semiconductor laser device and method for manufacturing the same
03/03/2011US20110051535 Fin-Type Device System and Method
03/03/2011US20110051515 Nonvolatile semiconductor memory
03/03/2011US20110051509 System and Method to Manufacture Magnetic Random Access Memory
03/03/2011US20110051503 Magnetic Devices and Structures
03/03/2011US20110051487 Read only memory cell for storing a multiple bit value
03/03/2011US20110051322 Porous amorphous silicon-carbon nanotube composite based electrodes for battery applications
03/03/2011US20110051307 Plasma processing system esc high voltage control and methods thereof
03/03/2011US20110051304 Defectivity-immune technique of implementing mim-based decoupling capacitors
03/03/2011US20110051131 Inspection device and inspection method
03/03/2011US20110051114 Optimized polarization illumination
03/03/2011US20110051054 Lcos panel and method for fabricating the same
03/03/2011US20110050838 Semiconductor composite device, method of manufacturing the same, optical print head and image forming apparatus
03/03/2011US20110050357 Transformer Signal Coupling for Flip-Chip Integration
03/03/2011US20110050320 Using interrupted through-silicon-vias in integrated circuits adapted for stacking
03/03/2011US20110050282 Architecture and interconnect scheme for programmable logic circuits
03/03/2011US20110050210 Vertical Hall Sensor and Method for Manufacturing a Vertical Hall Sensor
03/03/2011US20110049921 Robot hand for substrate transfer
03/03/2011US20110049731 Materials and methods for stress reduction in semiconductor wafer passivation layers
03/03/2011US20110049729 Method for producing a hermetically sealed, electrical feedthrough using exothermic nanofilm
03/03/2011US20110049728 Method to perform electrical testing and assembly of electronic devices
03/03/2011US20110049727 Recessed interlayer dielectric in a metallization structure of a semiconductor device
03/03/2011US20110049726 Semiconductor package and manufacturing method of the semiconductor package
03/03/2011US20110049725 Semiconductor Chip with Contoured Solder Structure Opening
03/03/2011US20110049724 Beol interconnect structures and related fabrication methods
03/03/2011US20110049723 Methods and structures for controlling wafer curvature
03/03/2011US20110049720 Refractory metal nitride capped electrical contact and method for frabricating same
03/03/2011US20110049719 Semiconductor device and method for manufacturing the same
03/03/2011US20110049718 Method of manufacturing semiconductor device, semiconductor device, electronic instrument, semiconductor manufacturing apparatus, and storage medium
03/03/2011US20110049717 Integrated circuits having tsvs including metal gettering dielectric liners
03/03/2011US20110049716 Structures of and methods and tools for forming in-situ metallic/dielectric caps for interconnects
03/03/2011US20110049715 Method for depositing metal oxide films
03/03/2011US20110049714 Illuminant
03/03/2011US20110049713 Dual contact metallization including electroless plating in a semiconductor device
03/03/2011US20110049710 Interconnect layouts for electronic assemblies
03/03/2011US20110049709 Method of manufacturing a semiconductor device
03/03/2011US20110049707 Semiconductor device and method of manufacturing the semiconductor device
03/03/2011US20110049704 Semiconductor device packages with integrated heatsinks
03/03/2011US20110049702 Semiconductor package and method of producing the same
03/03/2011US20110049701 Semiconductor device and method of manufacturing the same
03/03/2011US20110049700 Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers
03/03/2011US20110049699 Method of semiconductor device protection, package of semiconductor device
03/03/2011US20110049698 Semiconductor package and method of fabricating the same
03/03/2011US20110049695 Semiconductor Device and Method of Forming Pre-Molded Semiconductor Die Having Bumps Embedded in Encapsulant
03/03/2011US20110049694 Semiconductor Wafer-To-Wafer Bonding For Dissimilar Semiconductor Dies And/Or Wafers
03/03/2011US20110049693 Semiconductor device, method of manufacturing semiconductor device, and lead frame thereof
03/03/2011US20110049691 Semiconductor package and method for packaging the same
03/03/2011US20110049689 Semiconductor device with acene heat spreader
03/03/2011US20110049687 Encapsulant interposer system with integrated passive devices and manufacturing method therefor
03/03/2011US20110049686 Semiconductor package and method of manufacturing the same
03/03/2011US20110049684 Anticounterfeiting system and method for integrated circuits
03/03/2011US20110049683 Structures, methods and applications for electrical pulse anneal processes
03/03/2011US20110049682 System and method for substrate wafer back side and edge cross section seals
03/03/2011US20110049681 Semiconductor Structure and a Method of Forming the Same
03/03/2011US20110049680 Dual exposure track only pitch split process
03/03/2011US20110049679 Method of processing of nitride semiconductor wafer, nitride semiconductor wafer, method of producing nitride semiconductor device and nitride semiconductor device