| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/17/2011 | DE19752319C5 Ultraschall-Drahtbondingvorrichtung mit einer Einrichtung zum Prüfen einer Bondverbindung und Verfahren zum Prüfen einer mittels eines Ultraschall-Drahtbondingwerkzeugs hergestellten Bondverbindung Ultrasonic wire bonding apparatus having a device for inspecting a bonded connection and method of testing a bond connection produced by means of an ultrasonic Drahtbondingwerkzeugs |
| 02/17/2011 | DE112009000970T5 Verfahren zur Bildung von gestapelten Trench-Kontakten und damit gebildete Strukturen A method of forming trench stacked contacts and structures formed therewith |
| 02/17/2011 | DE112009000844T5 Vorrichtung und Verfahren zum Abziehen einer Folie Apparatus and method for peeling a film |
| 02/17/2011 | DE112009000642T5 LDMOS Vorrichtungen mit verbesserten Architekturen LDMOS devices with improved architectures |
| 02/17/2011 | DE112009000387T5 Träger für eine Doppelseitenpoliervorrichtung, Doppelseitenpoliervorrichtung, bei der dieser Träger verwendet wird, und Doppelseitenpolierverfahren Carrier for a double-side polishing apparatus, a double-side polishing apparatus in which this carrier is used, and double-side polishing method |
| 02/17/2011 | DE112009000149T5 Vakuumspannfutter Vacuum chuck |
| 02/17/2011 | DE112008002818T5 Elektronisches Bauelement mit einem gesteuerten elektrischen Feld Electronic component with a controlled electric field |
| 02/17/2011 | DE10350770B4 Druckkontakt-Halbleiterbauelement mit Blindsegment The pressure contact type semiconductor device having dummy segment |
| 02/17/2011 | DE10297564B4 Verfahren und Vorrichtung zum Steuern der Photolithographie-Überlagerungsjustierung mit vorwärtsgekoppelter Überlagerungsinformation Method and apparatus for controlling the photolithography overlay adjustment with feedforward overlay information |
| 02/17/2011 | DE102010036743A1 Bipolares Halbleiterbauelement und Herstellungsverfahren A bipolar semiconductor device and manufacturing method |
| 02/17/2011 | DE102010017768A1 Verfahren zum Herstellen eines Halbleiter-Bauelements A method of manufacturing a semiconductor device |
| 02/17/2011 | DE102009049330B3 Semiconductor wafer repolishing method for e.g. memory element, involves effecting concave/convex erosion profile when polished semiconductor wafer exhibits concave/convex thickness profile during repolishing sides of wafer |
| 02/17/2011 | DE102009038141A1 Verfahren zur Herstellung einer Emitter-Elektrode auf eine kristalline Siliziumsolarzelle und entsprechende Siliziumsolarzelle A process for preparing an emitter electrode on a crystalline silicon solar cell and corresponding silicon solar cell |
| 02/17/2011 | DE102009037281A1 Verfahren zur Herstellung einer polierten Halbleiterscheibe A process for producing a polished wafer |
| 02/17/2011 | DE102009037217A1 Verfahren zur Herstellung eines Halbleiter-Bauelements A process for producing a semiconductor device |
| 02/17/2011 | DE102009037112A1 Optisches System zum Erzeugen eines Lichtstrahls zur Behandlung eines Substrats An optical system for generating a light beam for treating a substrate |
| 02/17/2011 | DE102009036033A1 Interlayer connection for semiconductor wafers, has base wafer with connection pad and cover wafer arranged on base wafer, where cover wafer has continuous opening over connection pad |
| 02/17/2011 | DE102009001028B4 Verfahren zur Herstellung einer Bondverbindung A process for preparing a bonded connection |
| 02/17/2011 | DE102006046375B4 Feldeffekttransistor mit einer verspannten dielektrischen Schicht auf der Grundlage einer(-) Bauteiltopographie sowie Halbleiterbauelement bzw. Verfahren zur Herstellung eines Feldeffekttransistors Field effect transistor with a strained dielectric layer on the basis of a (-) component topography as well as semiconductor device and the method for producing a field effect transistor |
| 02/17/2011 | DE102005010377B4 Waferbearbeitungs-Verfahren Wafer processing method |
| 02/17/2011 | DE102005001259B4 Polierverfahren für ein Halbleitersubstrat A polishing method for a semiconductor substrate |
| 02/17/2011 | DE102004040764B4 Verfahren zum Korrigieren von Verletzungen von Maskenregeln nach optischer Nachbarschaftskorrektur A method for correcting violations of rules after optical proximity correction mask |
| 02/17/2011 | DE102004026206B4 Belichtungsmaskensubstrat-Herstellungsverfahren und Belichtungsmasken-Herstellungsverfahren Exposure mask substrate manufacturing method, and exposure mask manufacturing method |
| 02/17/2011 | DE10124032B4 Verfahren zur Herstellung von Bauelementen auf einem SOI-Wafer A process for the fabrication of devices on an SOI wafer |
| 02/17/2011 | DE10065470B4 Verfahren zur Herstellung eines Kühlelements für elektrische, insbesondere elektronische, Bauelemente A process for producing a cooling element for electric, in particular electronic, components |
| 02/16/2011 | EP2285002A2 Antifuse reroute of dies |
| 02/16/2011 | EP2285001A1 Method and apparatus for mode selection for high voltage integrated circuits |
| 02/16/2011 | EP2284901A1 Semiconductor device |
| 02/16/2011 | EP2284896A1 Solid state imaging device having a photodiode and a MOSFET |
| 02/16/2011 | EP2284891A2 Semiconductor device and manufacturing method thereof |
| 02/16/2011 | EP2284880A1 Package structure and package process |
| 02/16/2011 | EP2284879A2 Capacitor-less memory device |
| 02/16/2011 | EP2284878A2 Semiconductor device and production method |
| 02/16/2011 | EP2284877A2 Stocker |
| 02/16/2011 | EP2284876A1 Manufacturing method for semiconductor device and semiconductor device |
| 02/16/2011 | EP2284875A2 Film forming method, fabrication method of semiconductor device, semiconductor device, and substrate processing system |
| 02/16/2011 | EP2284874A1 Method of producing silylated porous insulating film, method of producing semiconductor device, and silylated material |
| 02/16/2011 | EP2284873A1 Method for manufacturing semiconductor device and method for cleaning semiconductor substrate |
| 02/16/2011 | EP2284872A2 Method for cutting semiconductor substrate |
| 02/16/2011 | EP2284871A1 Scribe apparatus for thin film solar cell |
| 02/16/2011 | EP2284870A1 Method for forming a floating gate non-volatile memory cell |
| 02/16/2011 | EP2284869A1 Thin film formation device and semiconductor film manufacturing method |
| 02/16/2011 | EP2284868A1 Heterostructure |
| 02/16/2011 | EP2284867A1 Method of manufacturing silicon carbide semiconductor device |
| 02/16/2011 | EP2284866A2 Exposure apparatus, exposure method and device manufacturing method |
| 02/16/2011 | EP2284864A1 Electron beam lithography system and method for electron beam lithography |
| 02/16/2011 | EP2284863A1 Method and apparatus for inspecting a chip prior to bonding |
| 02/16/2011 | EP2284862A1 System and method for picking and placement of chip dies |
| 02/16/2011 | EP2284615A2 Optical element and exposure apparatus |
| 02/16/2011 | EP2284613A1 Lithographic apparatus and device manufacturing method |
| 02/16/2011 | EP2284605A2 Semiconductor device and fabrication method thereof |
| 02/16/2011 | EP2284297A1 Method for achieving improved epitaxy quality (surface texture and defect density) on free-standing (aluminium, indium, gallium) nitride ((AI, In,Ga)N) substrates for opto-electronic and electronic devices |
| 02/16/2011 | EP2284295A2 Sealing of pinholes in electroless metal coatings |
| 02/16/2011 | EP2284290A1 Water-reactive al composite material, water-reactive al film, method for production of the al film, and structural member for film-forming chamber |
| 02/16/2011 | EP2283518A1 Dicing a semiconductor wafer |
| 02/16/2011 | EP2283517A1 Integrated circuit manufacturing method and integrated circuit |
| 02/16/2011 | EP2283516A2 Systems and methods for detecting defects on a wafer and generating inspection results for the wafer |
| 02/16/2011 | EP2283515A1 Interconnect structure for integrated circuits having improved electromigration characteristics |
| 02/16/2011 | EP2283514A1 Junction formation on wafer substrates using group iv nanoparticles |
| 02/16/2011 | EP2283513A1 Structure and process for conductive contact integration |
| 02/16/2011 | EP2283509A1 Control of particles on semiconductor wafers when implanting boron hydrides |
| 02/16/2011 | EP2283070A1 A curable composition and use thereof |
| 02/16/2011 | EP2282977A1 Tio2-containing silica glass for optical member for euv lithography |
| 02/16/2011 | EP2282944A1 Device for packing or unpacking or sorting stackable objects, in particular wafers |
| 02/16/2011 | EP2282891A2 Improved method for encapsulating the edge of a flexible sheet |
| 02/16/2011 | EP2282874A2 New method and loader apparatus for tem machine work chamber device |
| 02/16/2011 | EP2144283B1 Method of transferring adhesive film |
| 02/16/2011 | EP1999783B1 Method for fabricating a semiconductor structure |
| 02/16/2011 | EP1690289B1 Process for improving the surface roughness of a wafer |
| 02/16/2011 | EP1639641B1 Method of manufacturing a semiconductor device with a leadframe and apparatus therefor |
| 02/16/2011 | EP1584706B1 Copper alloy sputtering target and semiconductor element wiring |
| 02/16/2011 | EP1428247B1 Production method for field-effect transistor with horizontal self-aligned gates |
| 02/16/2011 | EP1396016B1 Insulating trench and method for production thereof |
| 02/16/2011 | EP1346478B1 Architecture for field programmable gate array |
| 02/16/2011 | EP1317769B1 Connection for conducting high frequency signal between a circuit and a discrete electrical component |
| 02/16/2011 | EP1307907B1 Method for depositing a fluorine-doped silica film |
| 02/16/2011 | EP1253631B1 Wafer holder, wafer holding device, and heat treating furnace |
| 02/16/2011 | EP1208593B1 Method for treating substrates for microelectronics |
| 02/16/2011 | CN201749844U Chip carrying device |
| 02/16/2011 | CN201749843U Silicon wafer for calibrating edge-washing machine table |
| 02/16/2011 | CN201749291U Lithography system and shielding group for patterned integrated circuit layer |
| 02/16/2011 | CN1991555B Display substrate, method of manufacturing the same and display panel having the same |
| 02/16/2011 | CN1906478B Advanced roughness metrology |
| 02/16/2011 | CN1847987B Lithographic apparatus and device manufacturing method |
| 02/16/2011 | CN1841201B Salt suitable for acid generator and chemical amplifying type corrosion-resistant composition containing the same |
| 02/16/2011 | CN1783490B Integrated circuit and method for manufacturing insulated grid field effect transistor |
| 02/16/2011 | CN1777974B Critical dimension variation compensation across a wafer by means of local wafer temperature control |
| 02/16/2011 | CN1763632B Photomask blank, photomask and fabrication method thereof |
| 02/16/2011 | CN1760764B Lithographic apparatus and device manufacturing method |
| 02/16/2011 | CN1676484B Glass-ceramic and method for its production |
| 02/16/2011 | CN101978794A Power combiner and microwave introduction mechanism |
| 02/16/2011 | CN101978793A Electrode assembly and plasma processing chamber utilizing thermally conductive gasket |
| 02/16/2011 | CN101978585A Multi-degree-of-freedom actuator and stage device |
| 02/16/2011 | CN101978505A Tft. shift register, scan signal line driving circuit, display device, and tft trimming method |
| 02/16/2011 | CN101978504A Tft, shift register, scanning signal line drive circuit, and display |
| 02/16/2011 | CN101978503A Semiconductor wafer, method of manufacturing a semiconductor wafer, and semiconductor device |
| 02/16/2011 | CN101978489A Integrated nitride and silicon carbide-based devices and methods of fabricating integrated nitride-based devices |
| 02/16/2011 | CN101978488A Control device and control method |
| 02/16/2011 | CN101978487A End effector |
| 02/16/2011 | CN101978486A Methods and apparatuses for determining thickness of a conductive layer |