Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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02/17/2011 | US20110039372 Mems package and a method for manufacturing the same |
02/17/2011 | US20110039371 Flip chip cavity package |
02/17/2011 | US20110039370 Electronic parts packaging structure and method of manufacturing the same |
02/17/2011 | US20110039369 Process for producing semiconductive porcelain composition/electrode assembly |
02/17/2011 | US20110039368 Methods for making substrates and substrates formed therefrom |
02/17/2011 | US20110039367 Masked ion implant with fast-slow scan |
02/17/2011 | US20110039365 Method for fabricating semiconductor device |
02/17/2011 | US20110039364 Manufacturing method of microstructure |
02/17/2011 | US20110039362 Manufacturing method of film pattern of micro-structure and manufacturing method of tft-lcd array substrate |
02/17/2011 | US20110039361 Liquid crystal display device and method of fabricating the same |
02/17/2011 | US20110039357 Method of making a semiconductor chip assembly with a post/base heat spreader and an adhesive between the base and a terminal |
02/17/2011 | US20110039356 Method for manufacturing semiconductor device and apparatus for manufacturing same |
02/17/2011 | US20110039355 Plasma Generation Controlled by Gravity-Induced Gas-Diffusion Separation (GIGDS) Techniques |
02/17/2011 | US20110039214 Pattern Forming Method and Method of Manufacturing Semiconductor Device |
02/17/2011 | US20110038704 Sub-field enhanced global alignment |
02/17/2011 | US20110038694 Semiconductor die sorter for wafer level packaging |
02/17/2011 | US20110038692 Substrate processing apparatus |
02/17/2011 | US20110038493 Structure with an integrated circuit and a silicon condenser microphone mounted on a single substrate and method for manufacturing the same |
02/17/2011 | US20110038196 Electronic Devices Containing Switchably Conductive Silicon Oxides as a Switching Element and Methods for Production and Use Thereof |
02/17/2011 | US20110038127 Multiple chip module and package stacking method for storage devices |
02/17/2011 | US20110038093 Turnable capacitor and switch using mems with phase change material |
02/17/2011 | US20110038085 Lateral Bipolar Transistor with Additional ESD Implant |
02/17/2011 | US20110037957 Monitoring apparatus and method particularly useful in photolithographically processing substrates |
02/17/2011 | US20110037934 Liquid crystal display device and manufacturing and repairing methods thereof |
02/17/2011 | US20110037729 Oled touch panel and method of forming the same |
02/17/2011 | US20110037528 Wave Guiding Structures for Crosstalk Reduction |
02/17/2011 | US20110037449 Semiconductor device |
02/17/2011 | US20110037181 Underfill method and chip package |
02/17/2011 | US20110037179 Semiconductor package |
02/17/2011 | US20110037176 Method of manufacturing a semiconductor device module, semiconductor device connecting device, semiconductor device module manufacturing device, semiconductor device module |
02/17/2011 | US20110037174 Method of manufacturing semiconductor component, and semiconductor component |
02/17/2011 | US20110037173 Semiconductor device |
02/17/2011 | US20110037171 Electronic Structures Including Barrier Layers and/or Oxidation Barriers Defining Lips and Related Methods |
02/17/2011 | US20110037170 Electronic device and manufacturing method therefor |
02/17/2011 | US20110037169 Semiconductor Device and Method of Dual-Molding Die Formed on Opposite Sides of Build-Up Interconnect Structures |
02/17/2011 | US20110037167 Method and package for circuit chip packaging |
02/17/2011 | US20110037166 Semiconductor device and semiconductor device manufacturing method |
02/17/2011 | US20110037165 Semiconductor Device and Method of Mounting Semiconductor Die to Heat Spreader on Temporary Carrier and Forming Polymer Layer and Conductive Layer Over the Die |
02/17/2011 | US20110037164 Three-dimensional package module, method of fabricating the same, and method of fabricating passive device applied to the three-dimensional package module |
02/17/2011 | US20110037163 Device including a ring-shaped metal structure and method |
02/17/2011 | US20110037162 Hermetic packaging and method of forming the same |
02/17/2011 | US20110037161 Electrostatic chucking of an insulator handle substrate |
02/17/2011 | US20110037160 Microelectronic device and fabricating method thereof and mems package structure and fabricating method thereof |
02/17/2011 | US20110037157 Integrated circuit packaging system with package-on-package and method of manufacture thereof |
02/17/2011 | US20110037156 Variable Feature Interface That Induces A Balanced Stress To Prevent Thin Die Warpage |
02/17/2011 | US20110037155 Semiconductor Device and Method of Forming Dam Material Around Periphery of Die to Reduce Warpage |
02/17/2011 | US20110037153 High bond line thickness for semiconductor devices |
02/17/2011 | US20110037152 Drop-mold conformable material as an encapsulation for an integrated circuit package system and method for manufacturing thereof |
02/17/2011 | US20110037150 Substrate comprising different types of surfaces and method for obtaining such substrates |
02/17/2011 | US20110037149 Method of cutting a wafer-like object and semiconductor chip |
02/17/2011 | US20110037148 Package-level integrated circuit connection without top metal pads or bonding wire |
02/17/2011 | US20110037147 Semiconductor device and method of manufacturing the same |
02/17/2011 | US20110037145 Wafer level package having cylindrical capacitor and method of fabricating the same |
02/17/2011 | US20110037144 Method for fabricating a decoupling composite capacitor in a wafer and related structure |
02/17/2011 | US20110037143 Semiconductor Device Using An Aluminum Interconnect To Form Through-Silicon Vias |
02/17/2011 | US20110037142 Soi wafer and method for forming the same |
02/17/2011 | US20110037140 Integrated circuit system with sealring and method of manufacture thereof |
02/17/2011 | US20110037132 Mems package structure and method for fabricating the same |
02/17/2011 | US20110037131 Gate structure for field effect transistor |
02/17/2011 | US20110037130 Method and structure for self aligned contact for integrated circuits |
02/17/2011 | US20110037128 Method and structure for improving uniformity of passive devices in metal gate technology |
02/17/2011 | US20110037126 Semiconductor arrangement including a load transistor and sense transistor |
02/17/2011 | US20110037125 Extremely thin silicon on insulator (etsoi) complementary metal oxide semiconductor (cmos) with in-situ doped source and drain regions formed by a single mask |
02/17/2011 | US20110037115 System and method for improving mesa width in a semiconductor device |
02/17/2011 | US20110037114 Semiconductor memory device and method of manufacturing semiconductor memory device |
02/17/2011 | US20110037113 Semiconductor struture and method of forming the same |
02/17/2011 | US20110037112 Nonvolatile memory devices with oblique charge storage regions and methods of forming the same |
02/17/2011 | US20110037111 Semiconductor device and method of fabricating the same |
02/17/2011 | US20110037110 Capacitor and method for fabricationg the same, and semiconductor device and method for fabricating the same |
02/17/2011 | US20110037108 Magnetoresistive memory and manufacturing method thereof |
02/17/2011 | US20110037106 Semiconductor device and method of producing the same |
02/17/2011 | US20110037104 Vertical spacer forming and related transistor |
02/17/2011 | US20110037103 Semiconductor device and method of manufacturing the same |
02/17/2011 | US20110037099 Semiconductor wafer, semiconductor wafer manufacturing method, and electronic device |
02/17/2011 | US20110037098 Substrate structures and methods of manufacturing the same |
02/17/2011 | US20110037096 Heterojunction Bipolar Transistors and Methods of Manufacture |
02/17/2011 | US20110037093 Light-emitting element and light-emitting element fabrication method |
02/17/2011 | US20110037089 Nitride-based semiconductor device and method for fabricating the same |
02/17/2011 | US20110037088 Nitride-based semiconductor device and method for fabricating the same |
02/17/2011 | US20110037080 Methods for combining light emitting devices in a package and packages including combined light emitting devices |
02/17/2011 | US20110037079 Structure and method for fabricating fluorescent powder gel light emitting module |
02/17/2011 | US20110037076 Diamond semiconductor device and method of manufacturing the same |
02/17/2011 | US20110037074 Thin film transistor method of fabricating the same, and organic light emitting diode dislplay device having the same |
02/17/2011 | US20110037073 Methods of fabricating thin film transistor and organic light emitting diode display device having the same |
02/17/2011 | US20110037070 Thin film transistor array panel and method for manufacturing the same |
02/17/2011 | US20110037069 Method and apparatus for visually determining etch depth |
02/17/2011 | US20110037068 Semiconductor device and method for manufacturing the same |
02/17/2011 | US20110037051 Optimization of polishing stop design |
02/17/2011 | US20110037047 Programmable metallization cells and methods of forming the same |
02/17/2011 | US20110037046 Resistance-change memory and method of manufacturing the same |
02/17/2011 | US20110037045 Nonvolatile memory device and method for manufacturing the same |
02/17/2011 | US20110037043 Nonvolatile memory device and method of manufacturing the same |
02/17/2011 | US20110037042 Phase change memory device with plated phase change material |
02/17/2011 | US20110036897 Support device for resonator |
02/17/2011 | US20110036722 Semiconductor wafer holder and electroplating system for plating a semiconductor wafer |
02/17/2011 | US20110036626 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
02/17/2011 | US20110036500 Wide area radio frequency plasma apparatus for processing multiple substrates |
02/17/2011 | US20110036499 Substrate treatment apparatus |
02/17/2011 | US20110036396 Method and apparatus for fabricating optoelectromechanical devices by structural transfer using re-usable substrate |
02/17/2011 | US20110036174 Molded Differential PRT Pressure Sensor |