Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2011
03/10/2011US20110057239 Semiconductor device and manufacturing method thereof
03/10/2011US20110057237 Semiconductor devices and methods of forming thereof
03/10/2011US20110057236 Inertial sensor having a field effect transistor
03/10/2011US20110057234 Semiconductor device and method for manufacturing of the same
03/10/2011US20110057233 Semiconductor component and method for manufacturing of the same
03/10/2011US20110057232 Semiconductor devices including shallow implanted regions and methods of forming the same
03/10/2011US20110057231 Semiconductor device and method for manufacturing of the same
03/10/2011US20110057230 Lateral Insulated Gate Bipolar Transistors (LIGBTS)
03/10/2011US20110057202 Semiconductor device and method of fabricating the same
03/10/2011US20110057200 Group iii nitride semiconductor device, epitaxial substrate, and method of fabricating group iii nitride semiconductor device
03/10/2011US20110057199 Antistatic Gallium Nitride Based Light Emitting Device and Method for Fabricating the Same
03/10/2011US20110057198 TECHNIQUE FOR DEVELOPMENT OF HIGH CURRENT DENSITY HETEROJUNCTION FIELD EFFECT TRANSISTORS BASED ON (10-10)-PLANE GaN BY DELTA-DOPING
03/10/2011US20110057197 GaN SINGLE CRYSTAL SUBSTRATE AND METHOD OF MANUFACTURING THEREOF AND GaN-BASED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
03/10/2011US20110057196 GaN HEMT with Nitrogen-Rich Tungsten Nitride Schottky Gate and Method of Forming the Same
03/10/2011US20110057189 Display device and manufacturing method thereof
03/10/2011US20110057188 Semiconductor device and method for manufacturing same
03/10/2011US20110057187 Light-emitting device and method for manufacturing the same
03/10/2011US20110057165 Epitaxial formation structures and associated methods of manufacturing solid state lighting devices
03/10/2011US20110057164 Carbon nanotube field emission device with overhanging gate
03/10/2011US20110057163 Nano-wire field effect transistor, method for manufacturing the transistor, and integrated circuit including the transistor
03/10/2011US20110057162 In via formed phase change memory cell with recessed pillar heater
03/10/2011US20110057161 Thermally shielded resistive memory element for low programming current
03/10/2011US20110056912 Plasma processing apparatus and plasma processing method
03/10/2011US20110056908 Method and apparatus for manufacturing magnetic recording medium
03/10/2011US20110056900 Article Transport Facility
03/10/2011US20110056740 Through-hole electrode substrate and manufacturing method thereof
03/10/2011US20110056626 Replaceable upper chamber parts of plasma processing apparatus
03/10/2011US20110056625 Electron beam etching device and method
03/10/2011US20110056543 Hybrid nanocomposite
03/10/2011US20110056436 A device for layered deposition of various materials on a semiconductor substrate, as well as a lift pin for use in such a device
03/10/2011US20110056432 Contact barrier layer deposition process
03/10/2011DE4412541B4 Gaseinlassanlage und -verfahren Gas inlet system and method
03/10/2011DE19938142B4 Behälter zur Aufnahme von Präzisionssubstraten Container for holding precision substrates
03/10/2011DE112009000965T5 Reflektive Maske, reflektiver Maskenrohling und Verfahren zum Herstellen einer reflektiven Maske Reflective mask, reflective mask blank and method for producing a reflective mask
03/10/2011DE112009000532T5 Heizgerät für Pufferschichtaufbringung Heater for buffer layer deposition
03/10/2011DE112009000297T5 Roboterhand zum Substrat-Transfer Robot hand for substrate transfer
03/10/2011DE102010040221A1 Grinding device for grinding e.g. silicon wafer, for producing e.g. mobile phone, has pressure pins equally spaced from each other in circumferential direction of pressure section, so that pressure pins surround holding portion
03/10/2011DE102010039654A1 Verfahren zur Herstellung eines Verbundsubstrats A process for producing a composite substrate
03/10/2011DE102010039325A1 Halbleiteranordnung mit einem Lasttransistor und einem Messtransistor und Verfahren zu deren Herstellung A semiconductor device having a load transistor and a sense transistor and processes for their preparation
03/10/2011DE102009040835A1 Verfahren zum thermischen Kontaktieren einander gegenüberliegender elektrischer Anschlüsse einer Halbleiterbauelement-Anordnung Process for the thermal contact of opposing electrical terminals of a semiconductor component arrangement
03/10/2011DE102009040078A1 Metallpaste mit CO-Vorläufern Metal paste with CO precursors
03/10/2011DE102009040076A1 Metallpaste mit Oxidationsmittel Metal paste with oxidizing agents
03/10/2011DE102009039982A1 Optoelektronisches Halbleiterbauelement und Verfahren zum Herstellen eines optoelektronischen Halbleiterbauelements An optoelectronic semiconductor device and method for producing an optoelectronic semiconductor component,
03/10/2011DE102009039891A1 Optoelektronisches Modul aufweisend zumindest einen ersten Halbleiterkörper mit einer Strahlungsaustrittsseite und einer Isolationsschicht und Verfahren zu dessen Herstellung An optoelectronic module comprising at least a first semiconductor body having a radiation exit side and an insulating layer and process for its preparation
03/10/2011DE102009039890A1 Optoelektronisches Bauelement mit einem Halbleiterkörper, einer Isolationsschicht und einer planaren Leitstruktur und Verfahren zu dessen Herstellung Optoelectronic component having a semiconductor body, an insulating layer and a planar conductive structure and process for its preparation
03/10/2011DE102009039744A1 Bipolartransistor Bipolar transistor
03/10/2011DE102009039521A1 Verbesserte Füllbedingungen in einem Austauschgateverfahren unter Anwendung einer zugverspannten Deckschicht Improved filling conditions in an exchange gate method using a tensile-covering layer
03/10/2011DE102009038941A1 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer
03/10/2011DE102009029201A1 Method for manufacturing semiconductor component in pressure sensor, involves separating connection of encapsulating compound, micro or nano-structured element and resin-coated-copper-foil from carrier connection layer
03/10/2011DE102009029199A1 Component parts manufacturing method for e.g. pressure sensors, involves selecting temperature for heating microstructured or nanostructured components such that materials of components are not converted into gaseous component parts
03/10/2011DE102009028918A1 Verfahren zur Bestimmung der Struktur eines Transistors A method for determining the structure of a transistor
03/10/2011DE102009028868A1 Method for treating e.g. polycrystalline wafer with liquid in wet bench during production of solar cell, involves forming angle so that liquid does not flow to rear side of wafer along edge and/or another edge when wafer leaves roller
03/10/2011DE102009013826A1 Schaltungsanordnung, Verfahren zum elektrischen und/oder mechanischen Verbinden und Vorrichtung zum Aufbringen von Verbindungselementen Circuit arrangement, method for electrical and / or mechanical connection and apparatus for applying fasteners
03/10/2011DE102009010816B4 Verfahren zur Herstellung eines Halbleiter-Bauelements A process for producing a semiconductor device
03/10/2011DE102008064671B4 Verfahren zur Herstellung eines Halbleiterbauelements mit einer Gatestruktur und Erhöhung der Integrität eines Gatestapels mit großem ε durch Schützen einer Beschichtung an der Gateunterseite während des Freilegens der Gateobseite A process for producing a semiconductor device having a gate structure and increasing the integrity of a gate stack with large ε by protecting a coating on the gate during the underside exposing the Gateobseite
03/10/2011DE102007007696B4 Halbleiterbauelement und Verfahren zum Herstellen eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device
03/10/2011DE102006015087B4 Verfahren zur Herstellung von Transistoren A process for the production of transistors
03/10/2011DE102006009226B9 Verfahren zum Herstellen eines Transistors mit einer erhöhten Schwellwertstabilität ohne Durchlass-Strombeeinträchtigung und Transistor A method for manufacturing a transistor with an increased Schwellwertstabilität without forward current impairment and transistor
03/09/2011EP2293657A1 Electronic component and method of forming an electronic component
03/09/2011EP2293343A1 Apparatus for manufacturing thin film solar cell
03/09/2011EP2293342A1 Apparatus for manufacturing thin film solar cell
03/09/2011EP2293339A2 Semiconductor devices and methods of manufacture thereof
03/09/2011EP2293338A2 Double-gate transistor with enhanced carrier mobility field
03/09/2011EP2293337A1 Semiconductor device and method for fabricating the same
03/09/2011EP2293336A1 Semiconductor device
03/09/2011EP2293327A1 Integrated circuit with electrostatically coupled MOS transistors, and method for producing the same
03/09/2011EP2293326A2 Method for manufacturing a SOI wafer
03/09/2011EP2293325A2 Semiconductor electronic device and method of manufacturing thereof
03/09/2011EP2293324A1 Packaging structure and method for manufacturing packaging structure
03/09/2011EP2293323A1 Contact forming method, semiconductor device manufacturing method and semiconductor device
03/09/2011EP2293322A1 Method for forming a metal nitride layer
03/09/2011EP2293321A1 Mechanical modularity chambers
03/09/2011EP2293141A1 Method of manufacturing a high quality and ultra large screen liquid crystal display device.
03/09/2011EP2292707A1 Ink composition for forming an insulating film and an insulating film formed from said ink composition
03/09/2011EP2292583A2 Triarylamine compounds for use as charge transport materials
03/09/2011EP2292360A1 Method for the removal of surface oxides by electron attachment
03/09/2011EP2291857A2 Wire on wire stitch bonding in a semiconductor device
03/09/2011EP2291856A1 Thin film transistor
03/09/2011EP2291855A1 Apparatus and methods for manufacturing thin-film solar cells
03/09/2011EP1701194B1 Projection optical system and exposure apparatus with the same
03/09/2011EP1395877B1 Lithographic method of manufacturing a device
03/09/2011EP1218289B1 Dissolved wafer fabrication process and associated microelectromechanical device having a support substrate with spacing mesas
03/09/2011EP1186049B1 A bipolar transistor
03/09/2011CN201758491U High heat-conducting circuit board manufactured by oil printing method
03/09/2011CN201758490U Circuit board with high-thermal conductivity manufactured with plating method
03/09/2011CN201758486U Metal base high conductivity circuit board
03/09/2011CN201758485U High-thermal conductivity circuit board made by using hot-press method
03/09/2011CN201758120U Axial-type surface contact glass packaging rectifying tube
03/09/2011CN201758118U Supporter for fixing wafer
03/09/2011CN201758117U Structure capable of reducing stress
03/09/2011CN1971885B Semiconductor element and method for manufacturing the same
03/09/2011CN1964011B Apparatus and method for pressure bonding and method for manufacturing semiconductor device
03/09/2011CN1953932B Tap unit for a beverage dispenser
03/09/2011CN1937271B Method of manufacturing nitride semiconductor device
03/09/2011CN1918705B Integrated circuit storage unit and its preparation method
03/09/2011CN1910596B Semiconductor device
03/09/2011CN1909188B Method for manufacturing semiconductor devices
03/09/2011CN1904726B Method for producing optical shield pattern
03/09/2011CN1890795B Dual damascene process using carbon doped and carbon free oxide layers
03/09/2011CN1846310B Nitride semiconductor device and manufacturing method thereof