H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2011
03/17/2011	US20110065268 Boron ion implantation using alternative fluorinated boron precursors, and formation of large boron hydrides for implantation
03/17/2011	US20110065267 Plasma Doping Method and Plasma Doping Apparatus
03/17/2011	US20110065266 Method for manufacturing semiconductor device
03/17/2011	US20110065265 Fabrication method and fabrication apparatus of group iii nitride crystal substance
03/17/2011	US20110065264 Methods of solid phase recrystallization of thin film using pulse train annealing method
03/17/2011	US20110065263 Method for reprocessing semiconductor substrate, method for manufacturing reprocessed semiconductor substrate, and method for manufacturing soi substrate
03/17/2011	US20110065262 Method of manufacturing semiconductor device
03/17/2011	US20110065261 Dicing method
03/17/2011	US20110065260 Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
03/17/2011	US20110065259 Manufacturing method and method for operating treatment apparatus
03/17/2011	US20110065258 Method of producing bonded substrate
03/17/2011	US20110065257 High-temperature spin-on temporary bonding compositions
03/17/2011	US20110065256 System and method for increasing breakdown voltage of locos isolated devices
03/17/2011	US20110065255 Methods of Fabricating Nonvolatile Memory Devices
03/17/2011	US20110065254 Semiconductor device fabrication method and pattern formation mold
03/17/2011	US20110065253 Manufacturing method for double-side capacitor of stack dram
03/17/2011	US20110065252 Method for fabricating phase change memory device
03/17/2011	US20110065251 Method for fabricating storage node electrode in semiconductor device
03/17/2011	US20110065250 Manufacturing method of semiconductor device
03/17/2011	US20110065249 Method of manufacturing a semiconductor device in which an increase in area of the semiconductor device is suppressed
03/17/2011	US20110065248 Semiconductor integrated circuit device and method of producing the same
03/17/2011	US20110065247 Semiconductor device and method of manufacturing the same
03/17/2011	US20110065246 Embedded phase-change memory and method of fabricating the same
03/17/2011	US20110065245 Method for fabricating mos transistor
03/17/2011	US20110065244 Asymmetric finfet device with improved parasitic resistance and capacitance
03/17/2011	US20110065243 Diode Array and Method of Making Thereof
03/17/2011	US20110065242 Method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip process
03/17/2011	US20110065240 Lead frame and method of forming same
03/17/2011	US20110065239 Method of fabricating a semiconductor device and semiconductor production equipment
03/17/2011	US20110065238 Protection layer for adhesive material at wafer edge
03/17/2011	US20110065237 Apparatus and method for manufacturing multi-component oxide heterostructures
03/17/2011	US20110065236 Method for maintaining a smooth surface of crystallizable material
03/17/2011	US20110065235 Phase change memory cell with constriction structure
03/17/2011	US20110065231 Process for producing a contact area of an electronic component
03/17/2011	US20110065230 Method for manufacturing solar cell
03/17/2011	US20110065229 Method of manufacturing back-surface electrode type solar cell
03/17/2011	US20110065223 Thermo-electric semiconductor device and method for manufacturing the same
03/17/2011	US20110065221 Method for Manufacturing an LCD Device Employing a Reduced Number of Photomasks Including Bottom and Top Gate Type Devices
03/17/2011	US20110065220 Thin film transistor array panel and method for manufacturing the same
03/17/2011	US20110065218 Pre-thermal greased led array
03/17/2011	US20110065217 Pressure-sensitive adhesive sheet and process for producing semiconductor device having same
03/17/2011	US20110065216 Method for manufacturing semiconductor device or apparatus, and apparatus for manufacturing the same
03/17/2011	US20110065215 Wafer level integration module with interconnects
03/17/2011	US20110065214 3d multiple die stacking
03/17/2011	US20110065050 Methods of forming intermediate semiconductor device structures using spin on, photopatternable, interlayer dielectric materials
03/17/2011	US20110065030 Mask pattern determining method, mask manufacturing method, and device manufacturing method
03/17/2011	US20110065028 Pattern generating method, manufacturing method of mask, and manufacturing method of semiconductor device
03/17/2011	US20110065027 Flare correction method, method for manufacturing mask for lithography, and method for manufacturing semiconductor device
03/17/2011	US20110064880 Vacuum processing apparatus, vacuum processing method, and electronic device manufacturing method
03/17/2011	US20110064642 Dielectric film with metallic oxynitride
03/17/2011	US20110064556 Edge grip end effector
03/17/2011	US20110064545 Substrate transfer mechanism with preheating features
03/17/2011	US20110064108 Method of manufacturing vertical-cavity surface emitting laser and vertical-cavity surface emitting laser array
03/17/2011	US20110064106 System and method for a micro ring laser
03/17/2011	US20110064105 Silicon carbide on diamond substrates and related devices and methods
03/17/2011	US20110064102 Growth Structures and Method for Forming Laser Diodes on or Off Cut Gallium and Nitrogen Containing Substrates
03/17/2011	US20110064100 Growth Structures and Method for Forming Laser Diodes on or Off Cut Gallium and Nitrogen Containing Substrates
03/17/2011	US20110063897 Differential read and write architecture
03/17/2011	US20110063772 Method of determining a target mesa configuration of an electrostatic chuck
03/17/2011	US20110063771 Electrostatic chuck and method for producing the same
03/17/2011	US20110063238 Touch display panels and manufacture methods thereof
03/17/2011	US20110063025 High Breakdown Voltage Double-Gate Semiconductor Device
03/17/2011	US20110063019 Dual dielectric tri-gate field effect transistor
03/17/2011	US20110062993 Nanotube-based switching elements and logic circuits
03/17/2011	US20110062872 Adaptive Switch Mode LED Driver
03/17/2011	US20110062632 Template with identification mark and method of manufacturing the same
03/17/2011	US20110062604 Scratch-resistant coatings for protecting front-side circuitry during backside processing
03/17/2011	US20110062603 Encapsulation architectures for utilizing flexible barrier films
03/17/2011	US20110062602 Integrated circuit packaging system with fan-in package and method of manufacture thereof
03/17/2011	US20110062600 Semiconductor element module and method for manufacturing the same
03/17/2011	US20110062599 Integrated circuit packaging system with package stacking and method of manufacture thereof
03/17/2011	US20110062598 Stacked-die package including substrate-ground coupling
03/17/2011	US20110062596 Semiconductor chip stacked structure and method of manufacturing same
03/17/2011	US20110062594 Through hole electrode substrate, method for manufacturing the through hole electrode substrate, and semiconductor device using the through hole electrode substrate
03/17/2011	US20110062592 Delamination Resistance of Stacked Dies in Die Saw
03/17/2011	US20110062591 Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof
03/17/2011	US20110062589 Semiconductor device having copper wiring with increased migration resistance
03/17/2011	US20110062588 Semiconductor device and method for manufacturing same
03/17/2011	US20110062587 Large grain size conductive structure for narrow interconnect openings
03/17/2011	US20110062584 Three-dimensionally integrated semicondutor device and method for manufacturing the same
03/17/2011	US20110062579 Group iii nitride based flip-chip integrated circuit and method for fabricating
03/17/2011	US20110062578 Semiconductor device and method of manufacturing the same
03/17/2011	US20110062575 Semiconductor Device and Method of Forming Cavity in PCB Containing Encapsulant or Dummy Die Having CTE Similar to CTE of Large Array WLCSP
03/17/2011	US20110062574 Integrated circuit packaging system with package-on-package and method of manufacture thereof
03/17/2011	US20110062573 Double-side mountable MEMS package
03/17/2011	US20110062572 Self-aligned silicon carrier for optical device supporting wafer scale methods
03/17/2011	US20110062571 Optical device, integrated circuit device and system
03/17/2011	US20110062569 Semiconductor device package with down-set leads
03/17/2011	US20110062566 Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
03/17/2011	US20110062565 Method for manufacturing a microelectronic package comprising at least one microelectronic device
03/17/2011	US20110062564 Semiconductor die containing lateral edge shapes and textures
03/17/2011	US20110062563 Non-volatile memory with reduced mobile ion diffusion
03/17/2011	US20110062561 Semiconductor device and method of manufacturing the same
03/17/2011	US20110062560 Bpsg film deposition with undoped capping
03/17/2011	US20110062559 Planarization stop layer in phase change memory integration
03/17/2011	US20110062557 3d polysilicon diode with low contact resistance and method for forming same
03/17/2011	US20110062553 Semiconductor device and method of manufacturing thereof
03/17/2011	US20110062551 Multilayer oxide on nitride on oxide structure and method for the manufacture of semiconductor devices
03/17/2011	US20110062550 Hydrogen barrier for ferroelectric capacitors
03/17/2011	US20110062549 Semiconductor Device and Method of Forming Integrated Passive Device

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