Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2011
03/24/2011WO2011032983A2 Process for the manufacture of wafers for solar cells at ambient pressure
03/24/2011WO2011032947A1 Pinch roll, device, and method for removing a film from a disc-shaped workpiece
03/24/2011WO2011032831A1 Dual dielectric tri-gate field effect transistor
03/24/2011WO2011032812A1 Conductive structure for narrow interconnect openings
03/24/2011WO2011032647A1 Method for chip to wafer bonding
03/24/2011WO2011032567A1 Device and method for accommodating and retaining flat objects without contact and for conveying flat objects
03/24/2011WO2011032546A1 Semi-polar, wurtzite-type, group iii nitride based semiconductor layers and semiconductor components based thereon
03/24/2011WO2011032538A2 Diode array and method for producing a diode array
03/24/2011WO2011032520A1 Flexible capacitive micromachined ultrasonic transducer array with increased effective capacitance
03/24/2011WO2011032347A1 Semiconductor device and method for producing the same
03/24/2011WO2011032309A1 Light emitting device having remotely located light scattering material
03/24/2011WO2011032218A1 Method for texturing surfaces
03/24/2011WO2011013893A3 Cmp polishing pad and method for manufacturing same
03/24/2011WO2011012559A3 Post ion implant stripper for advanced semiconductor application
03/24/2011WO2011009446A3 Contactless vacuum gripper
03/24/2011WO2011002155A3 Flat plate precision floating system
03/24/2011WO2010148147A3 Apparatus for wetting pretreatment for enhanced damascene metal filling
03/24/2011WO2010147937A3 Enhancing nand flash floating gate performance
03/24/2011WO2010141115A3 Directed material assembly
03/24/2011WO2010135250A3 Methods for determining the quantity of precursor in an ampoule
03/24/2011WO2010124261A4 Substrate pretreatment for subsequent high temperature group iii depositions
03/24/2011WO2010122459A3 Method and apparatus for high aspect ratio dielectric etch
03/24/2011WO2010120458A3 Methods of depositing antimony-comprising phase change material onto a substrate and methods of forming phase change memory circuitry
03/24/2011WO2010120437A3 Methods of forming phase change materials and methods of forming phase change memory circuitry
03/24/2011WO2010115128A9 High pressure rf-dc sputtering and methods to improve film uniformity and step-coverage of this process
03/24/2011WO2010080352A3 Semiconductor core, integrated fibrous photovoltaic device
03/24/2011US20110071036 Isoelectric focusing biochip
03/24/2011US20110070813 Method for manufacturing polishing head and polishing apparatus
03/24/2011US20110070810 Multiple zone carrier head with flexible membrane
03/24/2011US20110070808 Substrate polishing metrology using interference signals
03/24/2011US20110070807 Machining apparatus using rotary grinder
03/24/2011US20110070746 Method of increasing operation speed and saturated current of semiconductor device and method of reducing site flatness and roughness of surface of semiconductor wafer
03/24/2011US20110070745 Polishing method, polishing apparatus, and manufacturing method of semiconductor device
03/24/2011US20110070744 Silicon Texturing Formulations for Solar Applications
03/24/2011US20110070743 Apparatus and methods for edge ring implementation for substrate processing
03/24/2011US20110070742 Method of forming metal interconnection on thick polyimide film
03/24/2011US20110070741 Method of cleaning plasma etching apparatus
03/24/2011US20110070740 Clamped monolithic showerhead electrode
03/24/2011US20110070739 Double patterning process for integrated circuit device manufacturing
03/24/2011US20110070738 Double patterning strategy for contact hole and trench in photolithography
03/24/2011US20110070737 Method for preparing of cerium oxide powder for chemical mechanical polishing and method for preparing of chemical mechanical polishing slurry using the same
03/24/2011US20110070736 Method for polishing through-silicon via (TSV) wafers and a polishing composition used in the method
03/24/2011US20110070735 Method and Composition for Chemical Mechanical Planarization of a Metal-Containing Substrate
03/24/2011US20110070734 Manufacturing a microelectronic device comprising silicon and germanium nanowires integrated on a same substrate
03/24/2011US20110070733 Template and pattern forming method
03/24/2011US20110070732 Method of silicide formation by adding graded amount of impurity during metal deposition
03/24/2011US20110070731 Method of manufacturing semiconductor device
03/24/2011US20110070730 Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor
03/24/2011US20110070729 Method of manufacturing semiconductor device
03/24/2011US20110070728 Fabrication method of semiconductor device having conductive bumps
03/24/2011US20110070727 Method of Fabricating Semiconductor Device
03/24/2011US20110070726 Method For Making Semiconductor Device
03/24/2011US20110070725 Method For Making Semiconductor Device
03/24/2011US20110070724 Defect-free junction formation using octadecaborane self-amorphizing implants
03/24/2011US20110070723 Method of manufacturing a silicon carbide semiconductor device
03/24/2011US20110070722 Manufacturing method of semiconductor device
03/24/2011US20110070721 Epitaxial growth of compound nitride semiconductor structures
03/24/2011US20110070720 Method of manufacturing semiconductor device
03/24/2011US20110070719 Tuning of soi substrate doping
03/24/2011US20110070718 Semiconductor device and method of fabricating the same
03/24/2011US20110070717 Capacitors and methods with praseodymium oxide insulators
03/24/2011US20110070716 Manufacturing method of capacitor in semiconductor device
03/24/2011US20110070713 Method of manufacturing electronic component
03/24/2011US20110070712 Method for fabricating a semiconductor device having a semiconductive resistor structure
03/24/2011US20110070711 Method for manufacturing nano-crystalline silicon material from chloride chemistries for the semiconductor integrated circuits
03/24/2011US20110070710 Method for fabricating nor semiconductor memory structure
03/24/2011US20110070709 Method for forming semiconductor structure
03/24/2011US20110070708 Method for making trench MOSFET with shallow trench structures
03/24/2011US20110070707 Method of manufacturing nor flash memory
03/24/2011US20110070706 Method for forming NAND typed memory device
03/24/2011US20110070705 Manufacturing method of a nor flash memory with phosphorous and arsenic ion implantations
03/24/2011US20110070704 Semiconductor device and method for manufacturing the same
03/24/2011US20110070703 Disposable Spacer Integration with Stress Memorization Technique and Silicon-Germanium
03/24/2011US20110070702 Method for fabricating semiconductor device
03/24/2011US20110070701 Integration scheme for strained source/drain cmos using oxide hard mask
03/24/2011US20110070700 Apparatus for Connecting Integrated Circuit Chip to Power and Ground Circuits
03/24/2011US20110070699 3d smart power module
03/24/2011US20110070698 Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
03/24/2011US20110070697 Method for fabricating stack structure of semiconductor packages
03/24/2011US20110070696 Fabrication method of semiconductor integrated circuit device
03/24/2011US20110070695 Method of fabricating a high-temperature compatible power semiconductor module
03/24/2011US20110070694 Diamond semiconductor element and process for producing the same
03/24/2011US20110070693 Method for manufacturing oxide semiconductor film and method for manufacturing semiconductor device
03/24/2011US20110070692 Heat treatment apparatus, heat treatment method and method for manufacturing semiconductor device
03/24/2011US20110070691 Methods of fabricating metal oxide or metal oxynitride tfts using wet process for source-drain metal etch
03/24/2011US20110070690 Thermal management and method for large scale processing of cis and/or cigs based thin films overlying glass substrates
03/24/2011US20110070680 Pattern forming method and manufacturing method of semiconductor device
03/24/2011US20110070679 Semiconductor Processing Methods
03/24/2011US20110070675 Method for manufacturing micromechanical components
03/24/2011US20110070674 Gallium nitride-based iii-v group compound semiconductor device and method of manufacturing the same
03/24/2011US20110070673 Semiconductor device and method for manufacturing the same
03/24/2011US20110070670 Process condition evaluation method for liquid crystal display module
03/24/2011US20110070669 Methods of selectively applying luminous material to light emitting devices based on measured output thereof
03/24/2011US20110070668 Methods of selectively removing luminous material from a light emitting device based on measured output thereof
03/24/2011US20110070667 Method of processing substrate and method of manufacturing substrate for use in liquid ejection head
03/24/2011US20110070666 Deposition method
03/24/2011US20110070665 DC and RF Hybrid Processing System
03/24/2011US20110070531 Photomask designing method, photomask manufacturing method, and photomask designing program
03/24/2011US20110070436 Adhesive compositions for use in die attach applications
03/24/2011US20110070055 Load port apparatus and dust exhaust method for load port apparatus