H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2011
05/19/2011	DE112009001885T5 Vakuumbearbeitungsvorrichtung und Vakuumbearbeitungsverfahren Vacuum processing apparatus and vacuum processing method
05/19/2011	DE102010060272A1 Bauelement und Verfahren zur Herstellung eines Bauelements mittels eines Elektroplattierungsprozesses Device and method for producing a component by means of an electroplating process
05/19/2011	DE102010051478A1 CMOS-kompatibler lateraler MOSFET mit niedriger Gate-Charge CMOS-compatible lateral MOSFET with low gate charge
05/19/2011	DE102010051214A1 Method for processing disk-shaped semiconductor wafer, involves forming circular opening on rear side of wafer, surrounding circular opening by ring shaped reinforcement sections with two beveled surface area
05/19/2011	DE102010051045A1 Zusammensetzung zum chemisch-mechanischen Polieren und damit zusammenhängende Verfahren A composition for chemical mechanical polishing and related method
05/19/2011	DE102010051044A1 Verbesserter MOS Leistungstransistor Improved MOS power transistor
05/19/2011	DE102010050552A1 Maskenmaterial-Zusammensetzung, Verfahren zur Bildung einer Verunreinigungsdiffusionsschicht und Solarbatterie Mask material composition, method of forming an impurity diffusion layer, and the solar battery
05/19/2011	DE102010037276A1 Verfahren zur Herstellung eines Halbleiterbauelements A process for producing a semiconductor device
05/19/2011	DE102009053818A1 Dotierung von Siliciumschichten aus flüssigen Silanen für Elektronik- und Solar-Anwendungen Doping silicon layers of liquid silanes for electronic and solar applications
05/19/2011	DE102009053262A1 Verfahren zum Bilden von dünnen Halbleiterschichtsubstraten sowie Verfahren zum Herstellen eines Halbleiterbauelements, insbesondere einer Solarzelle, mit einem solchen Halbleiterschichtsubstrat A method of forming semiconductor thin film substrates and methods of making a semiconductor device, in particular a solar cell, with such a semiconductor multilayer substrate
05/19/2011	DE102009051847A1 Verfahren und Vorrichtung zur Behandlung einer Substratoberlfäche eines Substrats Method and apparatus for treating a a substrate Substratoberlfäche
05/19/2011	DE102009051521A1 Verfahren zur Herstellung von Siliziumhalbleiterscheiben mit III-V-Schichtstrukturen für die Integration von Siliziumbauelementen mit auf Gruppe III-V-Schichtstrukturen basierenden High Electron Mobility Transistoren (HEMT) und entsprechende Halbleiterschichtanordnung A method for producing silicon wafers with III-V-layer structures for the integration of silicon devices with on group III-V-layer structures based High Electron Mobility Transistors (HEMT) and the corresponding semiconductor layer assembly
05/19/2011	DE102009046849A1 Aqueous dispersion used in polishing silicon dioxide layers comprising cerium oxide and silicon dioxide is obtainable by mixing cerium oxide and silicon dioxide while stirring, and then dispersing at a specific shear rate
05/19/2011	DE102009046800A1 Verfahren zur Herstellung einer Vielzahl von Dünnchips und entsprechend gefertigter Dünnchip A method of manufacturing a plurality of thin chips and fabricated according to thin chip
05/19/2011	DE102009046687A1 Mikromechanisches Verfahren und entsprechende Anordnung zum Bonden von Halbleitersubstraten sowie entsprechender gebondeter Halbleitechip The micromechanical methods and corresponding apparatus for bonding semiconductor substrates and corresponding bonded semiconductor single chip
05/19/2011	DE102009006801B4 Verfahren zur Herstellung eines Feldeffekt-Kurzkanaltransistors mit geringerer Längenfluktuation durch Verwenden eines amorphen Elektrodenmaterials während der Implantation A method for producing a field effect transistor short channel length with less fluctuation by using an amorphous electrode material during implantation
05/19/2011	DE102008046400B4 Verfahren zur Herstellung eines CMOS-Bauelements mit MOS-Transistoren mit abgesenkten Drain- und Sourcebereichen und einem Si/Ge-Material in den Drain- und Sourcebereichen des PMOS-Transistors A method of fabricating a CMOS device including MOS transistors with lowered drain and source regions and a Si / Ge material in the drain and source regions of the PMOS transistor
05/19/2011	DE102008031231A1 Planare elektrische Leistungselektronik-Module für Hochtemperatur-Anwendungen und entsprechende Herstellungsverfahren Planar electric power electronics modules for high temperature applications and appropriate methods of preparation
05/19/2011	DE102008029194B4 Verfahren zum Ausbilden einer Metallelektrode eines Systems in einem Gehäuse A method of forming a metal electrode of a system in a housing
05/19/2011	DE102008025708B4 Kontaktstrukturen für FinFET-Bauelement und Verfahren zur Herstellung Contact FinFET device structures and processes for making
05/19/2011	DE102006051492B4 Halbleiterbauelement mit NMOS- und PMOS-Transistoren mit eingebettetem Si/Ge-Material zum Erzeugen einer Zugverformung und einer Druckverformung und Verfahren zur Herstellung eines solchen Halbleiterbauelements A semiconductor device with NMOS and PMOS transistors with embedded Si / Ge material for generating a tensile strain and a compressive strain and methods for producing such a semiconductor device
05/19/2011	DE102006036076B4 Verfahren zum Herstellen eines Kondensatorbauelements A method for manufacturing a capacitor component
05/19/2011	DE102005045059B4 Integrierte Schaltungsanordnung mit mehreren Leitstrukturlagen und Spule sowie Verfahren zur Herstellung An integrated circuit device having a plurality of conductive structure and coil and methods for preparing
05/19/2011	DE102004048723B4 Herstellverfahren für ein Dünnschichttransistorarray-Substrat Manufacturing method of a thin film transistor array substrate
05/19/2011	DE10010871B4 System zum Bearbeiten von Halbleiterwafern, das einen nach unten gerichteten laminaren Strom von Reinstluft an der Vorderseite von Trocknereinheiten erzeugt A system for processing semiconductor wafers, which produces a downward laminar flow of pure air at the front of the dryer units
05/19/2011	CA2815754A1 Wet-chemical systems and methods for producing black silicon substrates
05/19/2011	CA2780269A1 Protection and surface modification of carbon nanostructures
05/19/2011	CA2757786A1 Method for manufacturing semiconductor substrate
05/19/2011	CA2757205A1 Method for manufacturing semiconductor substrate
05/19/2011	CA2757200A1 Method for manufacturing semiconductor substrate
05/18/2011	EP2323190A2 Electronic devices
05/18/2011	EP2323180A1 Nitride semiconductor optical device, epitaxial wafer for nitride semiconductor optical device, and method for manufacturing semiconductor light-emitting device
05/18/2011	EP2323173A2 Paste and manufacturing methods of a solar cell using the same
05/18/2011	EP2323172A1 Photoelectric conversion device manufacturing method, photoelectric conversion device, and photoelectric conversion device manufacturing system
05/18/2011	EP2323166A1 Semiconductor element
05/18/2011	EP2323164A2 Dense arrays and charge storage devices, and methods for making same
05/18/2011	EP2323162A1 Semiconductor integrated circuit
05/18/2011	EP2323161A2 Shallow trench isolating structure having an air gap, a cmos image sensor employing the same, and a production method therefor
05/18/2011	EP2323160A1 Method for manufacturing field-effect transistors with a counter electrode and semi-conductor device
05/18/2011	EP2323159A1 Method of forming polycrystalline silicon layer, thin film transistor, organic light emitting diode display device having the same, and methods of fabricating the same
05/18/2011	EP2323138A1 Method for smoothing optical member for euvl and optical member for euvl having smoothed optical surface
05/18/2011	EP2323079A2 Electrical device manufacturing techniques
05/18/2011	EP2322992A1 Phase shift masking for complex patterns
05/18/2011	EP2322943A1 Electric contact member and contact probe
05/18/2011	EP2322699A2 Process for producing III-N substrates
05/18/2011	EP2322698A1 Method for manufacturing nitride substrate, and nitride substrate
05/18/2011	EP2322585A1 Adhesive composition, circuit connecting material and connecting structure of circuit member
05/18/2011	EP2322490A1 Titania and sulfur co-doped quartz glass member and making method
05/18/2011	EP2322322A1 Aluminum oxide particle and polishing composition containing the same
05/18/2011	EP2322291A1 Cleaning device adapted to eject high-pressure cleaning liquid
05/18/2011	EP2322022A1 Pick- and-place machine
05/18/2011	EP2321863A2 Method for producing an organic radiation-emitting component and organic radiation-emitting component
05/18/2011	EP2321851A2 Support for solar cells and method for producing a group of solar cells
05/18/2011	EP2321848A1 Multi-chip printhead assembler
05/18/2011	EP2321847A1 Shallow trench isolation
05/18/2011	EP2321846A2 Electrostatic chuck assembly
05/18/2011	EP2321845A1 Device and method for handling substrates
05/18/2011	EP2321844A1 Coating system
05/18/2011	EP2321843A2 Copper layer processing
05/18/2011	EP2321842A1 A mixed trimming method
05/18/2011	EP2321841A2 Method and system for producing a solar cell using atmospheric pressure plasma chemical vapor deposition
05/18/2011	EP2321840A2 Method for optical proximity correction, design and manufacturing of a reticle using variable shaped beam lithography
05/18/2011	EP2321839A2 Method for design and manufacture of a reticle using variable shaped beam lithography
05/18/2011	EP2321701A2 Method for optical proximity correction, design and manufacturing of a reticle using character projection lithography
05/18/2011	EP2321378A1 Chemical-mechanical polishing compositions and methods of making and using the same
05/18/2011	EP2321373A1 Modified particles and dispersions comprising said particles
05/18/2011	EP2321068A1 Dispensing patterns including lines and dots at high speeds
05/18/2011	EP2201340B1 Semiconductor wafer metrology apparatus and method
05/18/2011	EP2134887B1 Method for the precision processing of substrates and use of said method
05/18/2011	EP1872410B1 A method of making a semiconductor device having an arched structure strained semiconductor layer
05/18/2011	EP1801265B1 Cleaning system of sulfuric acid recycling type and persulfuric acid feeder of sulfuric acid recycling type
05/18/2011	EP1754810B1 Method for producing group iii nitride semiconductor crystal
05/18/2011	EP1665372B1 Support for vertically oriented capacitors during the formation of a semiconductor device
05/18/2011	EP1625334B1 Percussively ignited self-contained heating unit
05/18/2011	EP1570363B1 Method and apparatus for process state monitoring and state transition detection
05/18/2011	EP1405018B1 Wafer boat with arcuate wafer support arms
05/18/2011	EP1194954B1 Electrostatic chuck and its manufacturing method
05/18/2011	EP1161767B1 Method of making a vertical MOS transistor device
05/18/2011	EP1138058B1 Method of manufacturing a semiconductor device having a gate with a varying work function
05/18/2011	EP1062691B1 Selective wet etching of inorganic antireflective coatings
05/18/2011	CN201839454U Heating cavity of rapid temperature raising and lowering system
05/18/2011	CN201838582U Lead frame structure with big top and small bottom of metal foot of integrated circuit or discrete device
05/18/2011	CN201838580U Single packaging structure for inverted mounting of chip with double-sided graphics
05/18/2011	CN201838579U Module packaging structure for direct arranging of chip with double-sided graphics
05/18/2011	CN201838578U Single packaging structure for mounting of plating-to-carving chip with double-sided graphics
05/18/2011	CN201838577U Module packaging structure for inverted mounting of chip with double-sided graphics
05/18/2011	CN201838576U Single packaging structure for direct arranging of chip with double-sided graphics
05/18/2011	CN201838574U DIP (dual in-line) package chip lead frame and packaging mold thereof
05/18/2011	CN201838569U Locating device for chip package
05/18/2011	CN201838568U Silicon wafer pushing device
05/18/2011	CN201838567U Substrate blanking system
05/18/2011	CN201838566U Improved structure of piece holding rack
05/18/2011	CN201838565U Automatic wet silicon slice distributing device
05/18/2011	CN201838564U Wafer stabilizing spacer
05/18/2011	CN201838563U Workbench for high-speed jet dispenser
05/18/2011	CN201838562U Hooking device for integrated block package
05/18/2011	CN201837243U Oxide furnace bottom structure
05/18/2011	CN201833275U Chemical-mechanical polishing machine and chemical-mechanical polishing equipment with same
05/18/2011	CN201833188U Air-floating type positioning platform
05/18/2011	CN1982076B Laser induced thermal imaging method and fabricating method of organic light-emitting diode using the same

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