| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/19/2011 | US20110115461 Semiconductor circuit device and data processing system |
| 05/19/2011 | US20110115125 Method and apparatus for molding substrate |
| 05/19/2011 | US20110115099 Flip-chip underfill |
| 05/19/2011 | US20110115098 Integrated circuit package system with dual side connection and method for manufacturing thereof |
| 05/19/2011 | US20110115097 Area efficient through-hole connections |
| 05/19/2011 | US20110115096 Electrodepositing a metal in integrated circuit applications |
| 05/19/2011 | US20110115095 Method for manufacturing a plurality of thin chips and correspondingly manufactured thin chip |
| 05/19/2011 | US20110115094 STRUCTURES AND METHODS FOR PHOTO-PATTERNABLE LOW-k (PPLK) INTEGRATION |
| 05/19/2011 | US20110115092 Semiconductor device and method of manufacturing same |
| 05/19/2011 | US20110115091 Semiconductor device having groove-shaped via-hole |
| 05/19/2011 | US20110115090 Interconnect structure including a modified photoresist as a permanent interconnect dielectric and method of fabricating same |
| 05/19/2011 | US20110115087 Self-aligned lower bottom electrode |
| 05/19/2011 | US20110115086 Metal nonoparticle compositions |
| 05/19/2011 | US20110115084 Lead-free solder connection structure and solder ball |
| 05/19/2011 | US20110115083 Semiconductor Package Assembly Systems and Methods using DAM and Trench Structures |
| 05/19/2011 | US20110115082 Configurable interposer |
| 05/19/2011 | US20110115080 Semiconductor device including semiconductor construct installed on base plate, and manufacturing method of the same |
| 05/19/2011 | US20110115077 Method for Reducing Voids in a Copper-Tin Interface and Structure Formed Thereby |
| 05/19/2011 | US20110115076 Semiconductor device, electronic component, and fabrication process thereof |
| 05/19/2011 | US20110115075 Bumping free flip chip process |
| 05/19/2011 | US20110115074 Wafer bumping using printed under bump metalization |
| 05/19/2011 | US20110115073 Pad structure for semiconductor devices |
| 05/19/2011 | US20110115072 Ultraviolet energy curable tape and method of making a semiconductor chip using the tape |
| 05/19/2011 | US20110115071 Integrated circuit micro-module |
| 05/19/2011 | US20110115070 Semiconductor Device and Method of Forming Protective Material Between Semiconductor Die Stacked on Semiconductor Wafer to Reduce Defects During Singulation |
| 05/19/2011 | US20110115069 Electronic device including a packaging substrate and an electrical conductor within a via and a process of forming the same |
| 05/19/2011 | US20110115066 Semiconductor device packages with electromagnetic interference shielding |
| 05/19/2011 | US20110115065 Integrated circuit packaging system with interconnect and method of manufacture thereof |
| 05/19/2011 | US20110115064 Hybrid Package Construction With Wire Bond And Through Silicon Vias |
| 05/19/2011 | US20110115062 Semiconductor device and method of manufacturing the same |
| 05/19/2011 | US20110115061 Electronic device including a packaging substrate having a trench |
| 05/19/2011 | US20110115060 Wafer-Level Semiconductor Device Packages with Electromagnetic Interference Shielding |
| 05/19/2011 | US20110115059 Semiconductor Device Packages with Electromagnetic Interference Shielding |
| 05/19/2011 | US20110115058 Devices with crack stops |
| 05/19/2011 | US20110115057 Design structure for integrated circuit alignment |
| 05/19/2011 | US20110115055 Semiconductor device and manufacturing method thereof |
| 05/19/2011 | US20110115054 Semispherical integrated circuit structures |
| 05/19/2011 | US20110115053 Resistor in an integrated circuit |
| 05/19/2011 | US20110115052 Semiconductor device and method of manufacturing the same |
| 05/19/2011 | US20110115051 Semiconductor devices including 3-d structures with support pad structures and related methods and systems |
| 05/19/2011 | US20110115050 Semiconductor Device and Method of Forming IPD on Molded Substrate |
| 05/19/2011 | US20110115047 Semiconductor process using mask openings of varying widths to form two or more device structures |
| 05/19/2011 | US20110115044 Diffusion sidewall for a semiconductor structure |
| 05/19/2011 | US20110115039 Mems structure and method for making the same |
| 05/19/2011 | US20110115038 Physical quantity sensor, electronic device, and method of manufacturing physical quantity sensor |
| 05/19/2011 | US20110115036 Device packages and methods of fabricating the same |
| 05/19/2011 | US20110115035 General strength and sensitivity enhancement method for micromachined device |
| 05/19/2011 | US20110115033 Semiconductor device and method for manufacturing the same |
| 05/19/2011 | US20110115032 High-k/metal gate transistor with l-shaped gate encapsulation layer |
| 05/19/2011 | US20110115029 Integrated circuit and method for manufacturing an integrated circuit |
| 05/19/2011 | US20110115027 Structure and method to obtain eot scaled dielectric stacks |
| 05/19/2011 | US20110115026 Control of threshold voltages in high-k metal gate stack and structures for cmos devices |
| 05/19/2011 | US20110115025 Semiconductor device and method of manufacturing semiconductor device |
| 05/19/2011 | US20110115024 Non-Uniform Semiconductor Device Active Area Pattern Formation |
| 05/19/2011 | US20110115023 HYBRID FinFET/PLANAR SOI FETs |
| 05/19/2011 | US20110115022 Implant free extremely thin semiconductor devices |
| 05/19/2011 | US20110115021 Isolation structures for soi devices with ultrathin soi and ultrathin box |
| 05/19/2011 | US20110115019 Cmos compatible low gate charge lateral mosfet |
| 05/19/2011 | US20110115018 Mos power transistor |
| 05/19/2011 | US20110115017 LDMOS transistor with asymmetric spacer as gate |
| 05/19/2011 | US20110115015 Trench devices having improved breakdown voltages and method for manufacturing same |
| 05/19/2011 | US20110115014 Nonvolatile semiconductor memory device and method for manufacturing same |
| 05/19/2011 | US20110115012 Method for fabricating an enlarged oxide-nitride-oxide structure for nand flash memory semiconductor devices |
| 05/19/2011 | US20110115009 Control gate |
| 05/19/2011 | US20110115008 Interconnect line selectively isolated from an underlying contact plug |
| 05/19/2011 | US20110115006 Substrate for semiconductor device, method for producing the same, semiconductor device, and electronic apparatus |
| 05/19/2011 | US20110115005 Mim capacitor structure in feol and related method |
| 05/19/2011 | US20110115000 Semiconductor Device having Strain Material |
| 05/19/2011 | US20110114998 Semiconductor substrate, semiconductor device, and manufacturing method thereof |
| 05/19/2011 | US20110114993 Organic light emitting diode display and method of manufacturing the same |
| 05/19/2011 | US20110114989 Light-emitting device, method of manufacturing the same, method of mounting the same and lighting device |
| 05/19/2011 | US20110114987 Compliant bonding structures for semiconductor devices |
| 05/19/2011 | US20110114971 Substrate for semiconductor device, method of manufacturing the same, semiconductor device and electronic device |
| 05/19/2011 | US20110114965 Methods of fabricating semiconductor structures and devices using glass bonding layers, and semiconductor structures and devices formed by such methods |
| 05/19/2011 | US20110114964 Semiconductor device and method of manufacturing thereof |
| 05/19/2011 | US20110114963 Thin film transistor, organic light emitting diode display device having the same, and method of fabricating the same |
| 05/19/2011 | US20110114962 Array substrate for display device and method of fabricating the same |
| 05/19/2011 | US20110114961 Method of forming polycrystalline silicon layer, thin film transistor, organic light emitting diode display device having the same, and methods of fabricating the same |
| 05/19/2011 | US20110114960 Organic light emitting diode display and method for manufacturing the same |
| 05/19/2011 | US20110114959 Semiconductor device and manufacturing method thereof |
| 05/19/2011 | US20110114953 Transistor using derivative polymethyl-methacrylate thin film as gate insulator and passivation layer, and fabrication method thereof |
| 05/19/2011 | US20110114951 Semiconductor device and method for producing the same |
| 05/19/2011 | US20110114949 Test chiplets for devices |
| 05/19/2011 | US20110114947 Thin-film transistor and thin-film diode having amorphous-oxide semiconductor layer |
| 05/19/2011 | US20110114945 Semiconductor device and manufacturing method thereof |
| 05/19/2011 | US20110114943 Semiconductor device and manufacturing method thereof |
| 05/19/2011 | US20110114940 Thin film display panel and method of manufacturing the same |
| 05/19/2011 | US20110114919 Self-aligned graphene transistor |
| 05/19/2011 | US20110114918 Fabrication of graphene nanoelectronic devices on soi structures |
| 05/19/2011 | US20110114915 Light emitting device and method of fabricating the same |
| 05/19/2011 | US20110114912 Nonvolatile semiconductor memory device and manufacturing method thereof |
| 05/19/2011 | US20110114893 Circuit-connecting material and circuit terminal connected structure and connecting method |
| 05/19/2011 | US20110114810 Mounting Device for Disk-Shaped Substrates such as Solar Wafers |
| 05/19/2011 | US20110114708 Metal nanoink and process for producing the metal nanoink, and die bonding method and die bonding apparatus using the metal nanoink |
| 05/19/2011 | US20110114623 Apparatus for thermal processing with micro-environment |
| 05/19/2011 | US20110114597 Barrier integration scheme for high-reliability vias |
| 05/19/2011 | US20110114146 Uniwafer thermoelectric modules |
| 05/19/2011 | US20110114113 Substrate processing apparatus, cleaning method thereof and storage medium storing program |
| 05/19/2011 | US20110114020 Lid assembly for a processing system to facilitate sequential deposition techniques |
| 05/19/2011 | US20110113859 Low-voltage thin-film field-effect transistors |