Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2011
05/25/2011CN102076882A Synthesis and use of precursors for ALD of tellurium and selenium thin films
05/25/2011CN102076881A Plant for forming electronic circuits on substrates
05/25/2011CN102076776A Composition for insulating layer
05/25/2011CN102076774A Radiation-sensitive resin composition, laminate and method for producing the same, and semiconductor device
05/25/2011CN102076518A Traveling vehicle system
05/25/2011CN102076178A Fixture for solder paste printing and method for repairing integrated circuit board by utilizing same
05/25/2011CN102076171A Printed circuit board packaging method and crystal oscillator
05/25/2011CN102074825A Electrical connecting apparatus and testing system using the same
05/25/2011CN102074637A Method and structure for encapsulating solid-state luminous chips and light source device using encapsulation structure
05/25/2011CN102074588A Metal-insulator-metal (MIM) capacitor, manufacturing method of MIM capacitor, and manufacturing method of integrated circuit
05/25/2011CN102074587A Gallium nitride semiconductor device with improved termination scheme
05/25/2011CN102074586A Fast recovery diode
05/25/2011CN102074584A Air-gap grapheme transistor and manufacturing method thereof
05/25/2011CN102074583A Low power consumption composite source structure MOS (Metal Oxide for and preparation method thereof
05/25/2011CN102074582A Integrated circuit structure and formation method thereof
05/25/2011CN102074581A Semiconductor device and method for manufacturing the same
05/25/2011CN102074578A Semiconductor device and method for producing the same
05/25/2011CN102074577A Vertical channel field effect transistor and preparation method thereof
05/25/2011CN102074576A Normally off gallium nitride field effect transistors (fet)
05/25/2011CN102074575A IGBT (Insulated Gate Bipolar Translator) device structure and preparation method thereof
05/25/2011CN102074574A Method for forming stack gate of CMOS (Complementary Metal-Oxide-Semiconductor) device and stack gate sturcture
05/25/2011CN102074573A Semiconductor device having a device isolation structure
05/25/2011CN102074572A 集成电路结构 Integrated circuit structure
05/25/2011CN102074571A Semiconductor device and method of manufacturing semiconductor device
05/25/2011CN102074569A Organic light emitting diode display device and method of fabricating the same
05/25/2011CN102074563A Image sensor having enhanced backside illumination quantum efficiency
05/25/2011CN102074562A NAND (Not AND) structure and forming method thereof
05/25/2011CN102074561A Groove metal-oxide semiconductor field effect transistor and manufacture method thereof
05/25/2011CN102074559A SiP (Session Initiation Protocol) system integrated-level IC (Integrated Circuit) chip packaging part and manufacturing method thereof
05/25/2011CN102074556A Semiconductor device and manufacturing method thereof
05/25/2011CN102074554A Heat conduction board and mounting method of electronic components
05/25/2011CN102074552A Semiconductor device packages and manufacturing methods thereof
05/25/2011CN102074551A Semiconductor device packages and manufacturing method thereof
05/25/2011CN102074550A Chip for measuring ohmic contact degradation of semiconductor device and method
05/25/2011CN102074546A Electronic device with fuse structure and method for repairing the same
05/25/2011CN102074545A Integrated circuit element, semiconductor element and semiconductor technology
05/25/2011CN102074544A Through-silicon via structure and a process for forming the same
05/25/2011CN102074542A Double-flat integrated circuit (IC) chip packaging part with short pins and manufacturing method thereof
05/25/2011CN102074541A Carrier-free pin-free grid-array IC (Integrated Circuit) chip packaging part and production method thereof
05/25/2011CN102074540A Matrix dual in-line package (DIP) lead frame, integrated circuit (IC) packages based on frame and production method of IC packages
05/25/2011CN102074536A Power semiconductor device and manufacturing method therefor
05/25/2011CN102074534A Micro PCB radio frequency module and packaging method thereof
05/25/2011CN102074516A Semiconductor device packages and methods for manufacturing the same
05/25/2011CN102074515A Semiconductor device, method of manufacturing the same, and wireless transmission system utilizing the same
05/25/2011CN102074514A Encapsulation element and manufacturing method thereof
05/25/2011CN102074513A Quad flat no-lead chip encapsulation structure and method
05/25/2011CN102074511A Flip chip package and manufacturing method thereof
05/25/2011CN102074508A Process for integrating Schottky diode in power MOS transistor
05/25/2011CN102074507A Integrated circuits and fabrication methods thereof
05/25/2011CN102074506A Method for fabricating fin-like field effect transistor
05/25/2011CN102074505A Liquid crystal on silicon (LCOS) device and manufacturing method thereof
05/25/2011CN102074504A Method for manufacturing self-alignment thin film transistor (TFT) active matrix
05/25/2011CN102074503A Array substrate of display panel and patching method thereof
05/25/2011CN102074502A Method of fabricating array substrate
05/25/2011CN102074501A Integrated guarded schottky diode compatible with trench-gate DMOS, structure and method
05/25/2011CN102074500A Uv and reducing treatment for K recovery and surface clean in semiconductor processing
05/25/2011CN102074499A Method for producing a contact area of an electronic component
05/25/2011CN102074498A Integrated circuits and methods for forming the integrated circuits
05/25/2011CN102074497A Semiconductor chip and method of manufacturing wafer stack package
05/25/2011CN102074496A Wire connecting method for line repair
05/25/2011CN102074495A Forming method for shallow trench isolation (STI)
05/25/2011CN102074494A Thermosetting die-bonding film
05/25/2011CN102074493A Thermosetting die bonding film
05/25/2011CN102074492A Bidirectional intermittent transmission mechanism
05/25/2011CN102074491A Chemical-liquid classified recovering device with rotatable chassis
05/25/2011CN102074490A Intermittent transmission and heating mechanism
05/25/2011CN102074489A Method for testing field effect transistor (FET) grate drain capacitance under multi-bias points
05/25/2011CN102074488A Flaw detection method for opening filling material
05/25/2011CN102074487A 半导体组装结构与其形成方法 Structure and its method of forming a semiconductor assembly
05/25/2011CN102074486A Method of forming an integrated circuit structure
05/25/2011CN102074485A Mould for packaging semiconductor and method for packaging semiconductor by using same
05/25/2011CN102074484A Method of attaching interconnection plate to semiconductor die within leadframe package
05/25/2011CN102074483A Methods of manufacturing semiconductor device
05/25/2011CN102074482A Method for manufacturing flexible thin film transistor
05/25/2011CN102074481A Method of fabricating vertical channel semiconductor device
05/25/2011CN102074480A Thin film transistor compositions, and methods relating thereto
05/25/2011CN102074479A Semiconductor device and production method thereof
05/25/2011CN102074478A Manufacturing process method for trench MOS
05/25/2011CN102074477A UMOS device and formation method thereof
05/25/2011CN102074476A Forming method of N-channel metal oxide semiconductor (NMOS) transistor
05/25/2011CN102074475A Metal-oxide semiconductor (MOS) device and forming method thereof
05/25/2011CN102074474A Method for manufacturing bipolar transistor
05/25/2011CN102074473A Corrosion method for polycrystalline silicon layer
05/25/2011CN102074472A Method for improving chemical mechanical polishing efficiency of silicon
05/25/2011CN102074471A Method for preparing silicon oxide nitride oxide semiconductor (SONOS) flash memory by using aluminum oxide as tunneling dielectric film
05/25/2011CN102074470A Method for forming amorphous silicon oxide laminated structure
05/25/2011CN102074469A Method for regulating metal gate work function for PMOS (P-channel Metal Oxide Semiconductor) device
05/25/2011CN102074468A A method for separate silicification of source leakage and grid
05/25/2011CN102074467A Method for forming side wall of grid structure
05/25/2011CN102074466A Grid manufacturing method
05/25/2011CN102074465A Double-well manufacturing process
05/25/2011CN102074464A Boron-aluminum process for high-power transistor chip
05/25/2011CN102074463A Method for manufacturing potential dividing rings of planar high voltage transistor and structures of potential dividing rings
05/25/2011CN102074462A Method for forming electronic device
05/25/2011CN102074461A Semiconductor device and method of fabricating same
05/25/2011CN102074460A Method for cleaning surface after chemically mechanical polishing of tungsten-molybdenum alloy
05/25/2011CN102074459A Method for fabricating semiconductor device
05/25/2011CN102074458A Chip peeling device
05/25/2011CN102074457A Oven for manufacturing integrated circuit (IC)
05/25/2011CN102074456A Decompression drying apparatus