Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2011
09/29/2011US20110235355 Semiconductor light-emitting device and manufacturing method
09/29/2011US20110234932 Display substrate and method of manufacturing the same
09/29/2011US20110234868 Photoelectric conversion apparatus and imaging system
09/29/2011US20110234550 Organic electroluminescent display device and method of fabricating the same
09/29/2011US20110234472 Integrated Circuit Package Assembly Including Wave Guide
09/29/2011US20110234289 Process-Variation Tolerant Diode, Standard Cells Including the Same, Tags and Sensors Containing the Same, and Methods for Manufacturing the Same
09/29/2011US20110233794 Semiconductor device and manufacturing method thereof
09/29/2011US20110233791 Method for performing parallel stochastic assembly
09/29/2011US20110233790 Sacrificial Material to Facilitate Thin Die Attach
09/29/2011US20110233787 Semiconductor structure and manufacturing method of semiconductor structure
09/29/2011US20110233786 Semiconductor device and method for manufacturing the same
09/29/2011US20110233785 Backside dummy plugs for 3d integration
09/29/2011US20110233782 Electronic device package and fabrication method thereof
09/29/2011US20110233779 Semiconductor device and method of manufacturing the same
09/29/2011US20110233778 Formation of liner and barrier for tungsten as gate electrode and as contact plug to reduce resistance and enhance device performance
09/29/2011US20110233774 Electronic devices formed of two or more substrates connected together, electronic systems comprising electronic devices, and methods of forming electronic devices
09/29/2011US20110233769 Semiconductor device provided with tin diffusion inhibiting layer, and manufacturing method of the same
09/29/2011US20110233767 Semiconductor device and semiconductor device manufacturing method
09/29/2011US20110233766 Semiconductor Device and Method of Forming a Dual UBM Structure for Lead Free Bump Connections
09/29/2011US20110233765 Semiconductor device and method of manufacturing the same
09/29/2011US20110233764 Semiconductor device package and method of fabricating the same
09/29/2011US20110233763 Integrated circuit system with stress redistribution layer and method of manufacture thereof
09/29/2011US20110233762 Wafer level integrated interconnect decal and manufacturing method thereof
09/29/2011US20110233757 Method for Facilitating the Stacking of Integrated Circuits Having Different Areas and an Integrated Circuit Package Constructed by the Method
09/29/2011US20110233756 Wafer level packaging with heat dissipation
09/29/2011US20110233754 Encapsulated Semiconductor Chip with External Contact Pads and Manufacturing Method Thereof
09/29/2011US20110233753 Integrated circuit packaging system with leads and method of manufacture thereof
09/29/2011US20110233752 Integrated circuit packaging system with an intermediate pad and method of manufacture thereof
09/29/2011US20110233751 Integrated circuit packaging system with encapsulation and method of manufacture thereof
09/29/2011US20110233750 Arrangement of Two Substrates having an SLID Bond and Method for Producing such an Arrangement
09/29/2011US20110233749 Semiconductor device package and method of fabricating the same
09/29/2011US20110233748 Integrated circuit packaging system with interconnect and method of manufacture thereof
09/29/2011US20110233747 Integrated circuit packaging system with stacking option and method of manufacture thereof
09/29/2011US20110233746 Dual-leadframe Multi-chip Package and Method of Manufacture
09/29/2011US20110233744 Integrated circuit protruding pad package system and method for manufacturing thereof
09/29/2011US20110233743 Integrated circuit packaging system with leadframe and method of manufacture thereof
09/29/2011US20110233742 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
09/29/2011US20110233741 Semiconductor memory device and manufacturing the same
09/29/2011US20110233740 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
09/29/2011US20110233739 Semiconductor structure, manufacturing method of semiconductor structure and semiconductor device
09/29/2011US20110233737 Method for manufacturing 3-dimensional structures using thin film with columnar nano pores and manufacture thereof
09/29/2011US20110233736 Integrated circuit packaging system with encapsulation and method of manufacture thereof
09/29/2011US20110233735 Semiconductor wafer and its manufacture method, and semiconductor chip
09/29/2011US20110233734 Methods of Forming One or More Covered Voids in a Semiconductor Substrate, Methods of Forming Field Effect Transistors, Methods of Forming Semiconductor-On-Insulator Substrates, Methods of Forming a Span Comprising Silicon Dioxide, Methods of Cooling Semiconductor Devices, Methods of Forming Electromagnetic Radiation Emitters and Conduits, Methods of Forming Imager Systems, Methods of Forming Nanofluidic Channels, Fluorimetry Methods, and Integrated Circuitry
09/29/2011US20110233733 Method of fabricating a release substrate
09/29/2011US20110233732 Substrate for an electronic or electromechanical component and nano-elements
09/29/2011US20110233731 Semiconductor device and method of producing the same
09/29/2011US20110233730 REACTIVE CODOPING OF GaAlInP COMPOUND SEMICONDUCTORS
09/29/2011US20110233727 Vertical soi bipolar junction transistor and manufacturing method thereof
09/29/2011US20110233724 Semiconductor device and method of manufacturing the same
09/29/2011US20110233722 Capacitor structure and method of manufacture
09/29/2011US20110233720 Treatment for bonding interface stabilization
09/29/2011US20110233719 Test method on the support substrate of a substrate of the "semiconductor on insulator" type
09/29/2011US20110233718 Heterogeneous Technology Integration
09/29/2011US20110233717 Integrated circuit guard rings
09/29/2011US20110233715 Semiconductor device and method of manufacturing the same
09/29/2011US20110233713 Schottky diode and method for fabricating the same
09/29/2011US20110233711 Method for local contacting and local doping of a semiconductor layer
09/29/2011US20110233706 Method For Wafer Level Package and Semiconductor Device Fabricated Using The Same
09/29/2011US20110233705 Wafer processing
09/29/2011US20110233696 Perpendicular Magnetic Tunnel Junction Structure
09/29/2011US20110233695 Magnetoresistive Random Access Memory (MRAM) With Integrated Magnetic Film Enhanced Circuit Elements
09/29/2011US20110233694 Manufacturing method of electronic device package, electronic device package, and oscillator
09/29/2011US20110233693 Electromechanical transducer device and method of forming a electromechanical transducer device
09/29/2011US20110233690 Semiconductor chip arrangement with sensor chip and manufacturing method
09/29/2011US20110233689 Semiconductor device, process for producing semiconductor device, semiconductor substrate, and process for producing semiconductor substrate
09/29/2011US20110233688 Novel devices with vertical extensions for lateral scaling
09/29/2011US20110233687 Semiconductor device and manufacturing method thereof
09/29/2011US20110233685 Semiconductor integrated circuit
09/29/2011US20110233681 Semiconductor device and method of manufacturing the same
09/29/2011US20110233680 Nonvolatile memory device and method for manufacturing same
09/29/2011US20110233679 Integrated circuit including finfets and methods for forming the same
09/29/2011US20110233675 Sram-type memory cell
09/29/2011US20110233674 Design Structure For Dense Layout of Semiconductor Devices
09/29/2011US20110233673 Lateral-diffusion metal-oxide semiconductor device and method for fabricating the same
09/29/2011US20110233672 Semiconductor structure and fabrication method thereof
09/29/2011US20110233671 Threshold voltage adjustment of a transistor
09/29/2011US20110233667 Dual gate oxide trench mosfet with channel stop trench and three or four masks process
09/29/2011US20110233666 Oxide terminated trench mosfet with three or four masks
09/29/2011US20110233664 Semiconductor device and a method of manufacturing the same
09/29/2011US20110233663 Semiconductor device and method of manufacturing the same
09/29/2011US20110233661 Semiconductor memory device with fin
09/29/2011US20110233660 Semiconductor device and manufacture thereof
09/29/2011US20110233659 Semiconductor power device and manufacturing method thereof
09/29/2011US20110233658 Electronic device including an insulating layer having different thicknesses and a conductive electrode and a process of forming the same
09/29/2011US20110233656 Semiconductor device and method for manufacturing the same
09/29/2011US20110233655 Semiconductor memory device and method for manufacturing the semiconductor memory device
09/29/2011US20110233654 Nano-crystal gate structure for non-volatile memory
09/29/2011US20110233649 Non-volatile semiconductor memory device
09/29/2011US20110233648 Three-Dimensional Semiconductor Memory Devices And Methods Of Fabricating The Same
09/29/2011US20110233647 Methods for forming a memory cell having a top oxide spacer
09/29/2011US20110233646 Nonvolatile semiconductor memory device and method of manufacturing the same
09/29/2011US20110233645 Manufacturing method of nonvolatile semiconductor storage device and nonvolatile semiconductor storage device
09/29/2011US20110233640 Semiconductor device and method for producing the semiconductor device
09/29/2011US20110233637 Semiconductor device and method for manufacturing the same
09/29/2011US20110233632 Semiconductor seal-ring structure and the manufacturing method thereof
09/29/2011US20110233630 Integrated circuit having a semiconductor substrate with barrier layer
09/29/2011US20110233628 Field effect transistor switch for rf signals and method of making the same
09/29/2011US20110233627 Mos structures that exhibit lower contact resistance and methods for fabricating the same
09/29/2011US20110233624 Semiconductor device and manufacturing method of the same