H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2011
10/06/2011	US20110239421 Laser beam positioning system
10/06/2011	DE19833237B4 Halbleiterdünnfilm und Halbleitergerät Semiconductor thin film and semiconductor device
10/06/2011	DE102011011972A1 Entwicklungsvorrichtung und Entwicklungsverfahren Developing device and development process
10/06/2011	DE102011006454A1 Hochspannungs-Halbleiterbauelemente und Verfahren zu deren Herstellung High voltage semiconductor devices and processes for their preparation
10/06/2011	DE102011006443A1 Verfahren zum Herstellen einer Halbleitervorrichtung A method of manufacturing a semiconductor device
10/06/2011	DE102011006341A1 Verfahren zur Fertigung eines Verdrahtungssubsrats mit eingebetteten Halbleiterchip A method for manufacturing a semiconductor chip embedded with Verdrahtungssubsrats
10/06/2011	DE102011006331A1 Herstellungsverfahren für eine Halbleitervorrichtung Manufacturing method of a semiconductor device
10/06/2011	DE102011001405A1 Halbleiter-Kapselung und Stapel von Halbleiterkapselungen Semiconductor encapsulation and stacks of semiconductor packages
10/06/2011	DE102011001306A1 Halbleiter-Kapselung Semiconductor encapsulation
10/06/2011	DE102010016325A1 Substrate turn device for e.g. continuous flow system for processing plate-shaped substrates, has holding members or axes connected by connector and provided transverse to members or axes, where connector is rotatable around axis
10/06/2011	DE102010016216A1 Method for wire bonding wire bonding contact region on wire bonding structure of silicon carbide junction FET of e.g. semiconductor component in e.g. integrated power switching circuit, involves cleaning wire bonding contact region
10/06/2011	DE102010013850A1 Method for electrical connection of solar cells for solar module, involves separating contact material in local area between conductive material and terminals and in another local area between individual conductors via plasma spraying
10/06/2011	DE102010013520A1 Verfahren zur beidseitigen Politur einer Halbleiterscheibe Method for two-sided polishing a semiconductor wafer
10/06/2011	DE102010013519A1 Verfahren zum Polieren einer Halbleiterscheibe A method of polishing a semiconductor wafer
10/06/2011	DE102010013486A1 Soldered electrode for electric actuator, has stripy solder layer arranged to stripy formed net electrode part, where stripy solder layer and/or net electrode part is folded to connect stripy solder layer with net electrode
10/06/2011	DE102010003562A1 Verringerung der mechanischen Verspannung in Metallstapel komplexer Halbleiterbauelemente während der Chip-Substrat-Lötung mittels eines verbesserten Abkühlschemas Reduction of mechanical stress in metal stack of complex semiconductor devices during the chip substrate soldering using an improved Abkühlschemas
10/06/2011	DE102010003560A1 Halbleiterbauelement mit einem Kondensator in einem Metallisierungssystem, der durch ein Hartmaskenstrukturierungsschema hergestellt ist A semiconductor device with a capacitor in a metallization, which is produced by a hard mask structuring schema
10/06/2011	DE102010003556A1 Kontaktelemente eines Halbleiterbauelements, die durch stromloses Plattieren und Entfernung von überschüssigem Material mit geringeren Scherkräften hergestellt sind Contact elements of a semiconductor device made by electroless plating and removal of excess material with lower shear forces
10/06/2011	DE102010003533A1 Substrate arrangement for use in e.g. power semiconductor chip, of power semiconductor module, has wire structure bonded on bottom metallization layer, and comprising multiple bonding wire portions
10/06/2011	DE102010003474A1 Method for manufacturing thin layer solar cell, involves forming microcrystalline layer stack on substrate by passing coated substrate into coating structure so that thin film solar cell is obtained
10/06/2011	DE102010003454A1 Halbleiterbauelement mit Metallgateelektrodenstrukturen mit großem ε und E-Sicherungen, die in dem Halbleitermaterial hergestellt sind A semiconductor device with metal gate electrode structures with large ε and e-fuses which are produced in the semiconductor material
10/06/2011	DE102010003452A1 Halbleiterbauelement mit einem Kondensator, der in der Kontaktebene ausgebildet ist A semiconductor device comprising a capacitor which is formed in the contact plane
10/06/2011	DE102010003451A1 Austauschgateverfahren für Metallgatestapel mit großem ε durch Vermeiden eines Polierprozesses zum Freilegen des Platzhaltermaterials Replacement gate process for metal gate stack with large ε by avoiding a polishing process to expose the placeholder material
10/06/2011	DE102010003450A1 Halbleiterbauelement mit E-Sicherung auf Metallbasis mit verbesserter Programmiereffizienz durch Erhöhen der Wärmeerzeugung A semiconductor device with e-fuse to the metal base with improved programming efficiency by increasing the heat generation
10/06/2011	CA2795250A1 Selective nanoparticle assembly systems and methods
10/06/2011	CA2764902A1 Field effect transistor
10/05/2011	EP2373137A1 Printed circuit board unit, electronic device and method of fabricating printed circuit board
10/05/2011	EP2372787A1 Light-receiving element, light-receiving element array, method for manufacturing light-receiving element and method for manufacturing light-receiving element array
10/05/2011	EP2372783A1 Photoelectric conversion module
10/05/2011	EP2372772A2 Semiconductor device and method of making the same
10/05/2011	EP2372771A1 Semiconductor device and semiconductor device manufacturing method
10/05/2011	EP2372756A1 Semiconductor device and manufacturing method thereof
10/05/2011	EP2372755A1 Method for permanently connecting two metal surfaces
10/05/2011	EP2372754A1 Spacer formation in the fabrication of planar bipolar transistors
10/05/2011	EP2372753A1 Gas Compositions for Cleaning the Interiors of Reactors as Well as for Etching Films of Silicon-Containing Compounds
10/05/2011	EP2372752A1 Method and device for measuring temperature during deposition of semiconductor
10/05/2011	EP2372751A1 Silicon nanowire comprising high density metal nanoclusters and method of preparing the same
10/05/2011	EP2372750A1 Method for manufacturing bonded wafer
10/05/2011	EP2372749A1 Treatment device for treating a surface of a body
10/05/2011	EP2372716A1 Pseudo-inverter circuit on SeOI
10/05/2011	EP2372457A1 Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device
10/05/2011	EP2372448A1 Method of manufacturing a wavelength converter
10/05/2011	EP2372438A1 Method of manufacturing a transflective type liquid crystal display and a transflective type active matrix substrate
10/05/2011	EP2372408A2 Reflector, optical element, interferometer system, stage device, exposure apparatus, and device fabricating method
10/05/2011	EP2371832A1 Ruthenium compound, process for producing same, process for producing ruthenium-containing thin film using same, and ruthenium-containing thin film
10/05/2011	EP2371773A1 Method for production of synthetic quartz glass
10/05/2011	EP2371767A1 Fine structural body, method for manufacturing fine structural body, magnetic memory, charge storage memory and optical information recording medium
10/05/2011	EP2371000A1 Method for producing lamps
10/05/2011	EP2370998A2 Method for producing patterned materials
10/05/2011	EP2370997A1 Bonding method
10/05/2011	EP2370996A2 Thermocouple
10/05/2011	EP2370995A1 Preparation of moulded body with electric circuit
10/05/2011	EP2370994A2 Methods for simultaneously forming doped regions having different conductivity-determining type element profiles
10/05/2011	EP2370993A1 Methods for encapsulating nanocrystals and resulting compositions
10/05/2011	EP2370401A1 Amide-linked perfluoropolyether thiol compounds and processes for their preparation and use
10/05/2011	EP2370269A1 Patterning process
10/05/2011	EP2030230B1 Holder for electrical component and electrical device including the holder and component
10/05/2011	EP1983557B1 Laser beam machining method
10/05/2011	EP1957599B1 Adjuvant for controlling polishing selectivity and chemical mechanical polishing slurry comprising the same
10/05/2011	EP1862855B1 Photosensitive resin composition
10/05/2011	EP1803151B1 Elevator-based tool loading and buffering system
10/05/2011	EP1780774B1 Heat treatment jig for a semiconductor silicon substrate
10/05/2011	EP1743339B1 Silicon on insulator read-write non-volatile memory comprising lateral thyristor and trapping layer
10/05/2011	EP1735838B1 Optical devices featuring textured semiconductor layers
10/05/2011	EP1708026B1 Photosensitive polymer composition, process for producing pattern, and electronic part
10/05/2011	EP1642329B1 Process for producing low-k dielectric films
10/05/2011	EP1636837B1 Coiled circuit device and method of making the same
10/05/2011	EP1636835B1 System and method for integrating in-situ metrology within a wafer treatment process
10/05/2011	EP1605510B1 Soi wafer and method for manufacturing same
10/05/2011	EP1543537B1 Plasma apparatus with device for reducing polymer deposition on a substrate and method for reducing polymer deposition
10/05/2011	EP1541319B1 Device and method for processing carrier tape
10/05/2011	EP1535308B1 Protected dual-voltage microcircuit power arrangement
10/05/2011	EP1508163B1 Control of contact resistance in quantum well intermixed devices
10/05/2011	EP1489666B1 Process for producing a compound thin-film solar cell
10/05/2011	EP1464079B1 Ion-implantation and shallow etching to produce effective edge termination in high-voltage heterojunction bipolar transistors
10/05/2011	EP1428263B1 Process for ultra-thin body soi devices that incorporate epi silicon tips and article made thereby
10/05/2011	EP1417722B1 Flip-chip bonding of semiconductor light emitting chips
10/05/2011	EP1417702B1 Method for doping semiconductors
10/05/2011	EP1388891B1 System for heat treating semiconductor
10/05/2011	EP1368874B8 Electrostatic discharge protection structures for high speed technologies with mixed and ultra-low voltage supplies
10/05/2011	EP1319248B1 Control of separation between gate and storage node in vertical dram
10/05/2011	EP1287088B1 Polishing composition
10/05/2011	EP1146552B1 Interconnections to copper ICs
10/05/2011	EP1134808B1 A method of producing a bonded wafer
10/05/2011	CN202004031U Plate frame silicon slice protection structure
10/05/2011	CN202004030U Silicon chip protection structure of plate frame
10/05/2011	CN202003985U Directly placed, first plated, then carved single packaging structure of two-sided figure chip
10/05/2011	CN202003984U Single first-plating second-etching packaging structure of flip chip with double-sided graphs
10/05/2011	CN202003973U Substrate paraposition mechanism
10/05/2011	CN202003972U Wafer pushing device used for die bonder
10/05/2011	CN202003971U Wafer conveying device
10/05/2011	CN202003970U Detection wafer
10/05/2011	CN202003969U Bonder
10/05/2011	CN202003968U Structure of semiconductor packing mould
10/05/2011	CN202003967U Packaging die structure
10/05/2011	CN202003966U Die used in SIM foil card produced by bare chip inverse arrangement and glue infusion molding
10/05/2011	CN202003965U Rejects cutting-off fixture
10/05/2011	CN202003964U Refrigerating coil pipe for cleaning machine
10/05/2011	CN202003963U Wafer cleaning device
10/05/2011	CN201999522U Full-automatic silicon chip feeding machine

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