H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2011
10/06/2011	US20110244672 Method of manufacturing semiconductor device
10/06/2011	US20110244671 Method for Fabricating a III-Nitride Semiconductor Device
10/06/2011	US20110244670 Replacement Gate Approach for High-K Metal Gate Stacks by Avoiding a Polishing Process for Exposing the Placeholder Material
10/06/2011	US20110244669 Method for low temperature ion implantation
10/06/2011	US20110244668 Semiconductor device and manufacturing process therefor
10/06/2011	US20110244667 Method of manufacturing semiconductor device
10/06/2011	US20110244666 Methods Of Manufacturing Stair-Type Structures And Methods Of Manufacturing Nonvolatile Memory Devices Using The Same
10/06/2011	US20110244665 MANUFACTURING METHOD OF GaN BASED SEMICONDUCTOR EPITAXIAL SUBSTRATE
10/06/2011	US20110244664 Method of manufacturing superjunction structure
10/06/2011	US20110244663 Forming a compound-nitride structure that includes a nucleation layer
10/06/2011	US20110244662 Method of manufacturing graphene by using germanium layer
10/06/2011	US20110244661 Large Scale High Quality Graphene Nanoribbons From Unzipped Carbon Nanotubes
10/06/2011	US20110244660 Manufacturing method of semiconductor substrate and manufacturing method of semiconductor device
10/06/2011	US20110244659 Wafer cutting method and a system thereof
10/06/2011	US20110244658 Crack Stops for Semiconductor Devices
10/06/2011	US20110244657 Semiconductor die singulation method
10/06/2011	US20110244656 Integrated circuit device and manufacturing method thereof
10/06/2011	US20110244655 Method for fabricating soi substrate
10/06/2011	US20110244654 Method for manufacturing semiconductor substrate
10/06/2011	US20110244653 Method for manufacturing semiconductor substrate and method for manufacturing semiconductor device
10/06/2011	US20110244652 Method of manufacturing soi substrate
10/06/2011	US20110244651 Method and device for alternately contacting two wafers
10/06/2011	US20110244650 Semiconductor device with sti and method for manufacturing the semiconductor device
10/06/2011	US20110244649 Method of manufacturing semiconductor device
10/06/2011	US20110244648 Method of Manufacturing Nonvolatile Memory Device
10/06/2011	US20110244647 Mark Structure for Coarse Wafer Alignment and Method for Manufacturing Such a Mark Structure
10/06/2011	US20110244646 Semiconductor with a dynamic gate-drain capacitance
10/06/2011	US20110244645 Semiconductor device and method for fabricating the same
10/06/2011	US20110244644 Two Step Poly Etch LDMOS Gate Formation
10/06/2011	US20110244643 Silicon carbide semiconductor device and manufacturing method thereof
10/06/2011	US20110244642 Method of fabricating semiconductor device
10/06/2011	US20110244641 Shielded Gate Trench FET with an Inter-electrode Dielectric Having a Low-k Dielectric Therein
10/06/2011	US20110244640 Method of manufacturing flash memory cell
10/06/2011	US20110244639 Method for manufacturing a pattern formed body, method for manufacturing a functional element, and method for manufacturing a semiconductor element
10/06/2011	US20110244638 Semiconductor device manufacturing method
10/06/2011	US20110244637 Mold and substrate for use with mold
10/06/2011	US20110244636 Manufacturing method of semiconductor chip-embedded wiring substrate
10/06/2011	US20110244635 Method for manufacture of inline integrated circuit system
10/06/2011	US20110244634 Semiconductor package and methods of manufacturing the same
10/06/2011	US20110244633 Package assembly for semiconductor devices
10/06/2011	US20110244632 Reduction of Mechanical Stress in Metal Stacks of Sophisticated Semiconductor Devices During Die-Substrate Soldering by an Enhanced Cool Down Regime
10/06/2011	US20110244631 Semiconductor device manufacturing method, semiconductor device, and wiring board
10/06/2011	US20110244630 Method of Substrate Bonding with Bonding Material Having Rare Earth Metal
10/06/2011	US20110244629 Packaging Process to Create Wettable Lead Flank During Board Assembly
10/06/2011	US20110244628 Method of manufacturing semiconductor device
10/06/2011	US20110244627 Method of manufacturing photoelectric conversion device
10/06/2011	US20110244623 Rapid thermal method and device for thin film tandem cell
10/06/2011	US20110244615 Method for manufacturing pixel structure
10/06/2011	US20110244613 WAFER-LEVEL In-P Si BONDING FOR SILICON PHOTONIC APPARATUS
10/06/2011	US20110244612 Optical device wafer processing method
10/06/2011	US20110244609 Method of forming current-injecting/tunneling light-emitting device
10/06/2011	US20110244608 Solid-state lasers
10/06/2011	US20110244605 Method of fabricating semiconductor device
10/06/2011	US20110244604 Method of manufacturing semiconductor device
10/06/2011	US20110244603 Customized metallization patterns during fabrication of semiconductor devices
10/06/2011	US20110244602 Method of producing semiconductor
10/06/2011	US20110244601 Method for producing a substrate including a step of thinning with stop when a porous zone is detected
10/06/2011	US20110244600 Method for tunably repairing low-k dielectric damage
10/06/2011	US20110244599 Process integration of a single chip three axis magnetic field sensor
10/06/2011	US20110244378 Device and method for providing wavelength reduction with a photomask
10/06/2011	US20110244184 Alkaline etching solution for texturing a silicon wafer surface
10/06/2011	US20110243690 Substrate transport hand and substrate transport robot
10/06/2011	US20110243520 Optical waveguide structure and method of manufacture thereof
10/06/2011	US20110243176 Integrating and aligning laser chips on sliders for hamr applications
10/06/2011	US20110243175 Segmented distributed feedback laser
10/06/2011	US20110242895 Memory device, manufacturing method for memory device and method for data writing
10/06/2011	US20110242888 Semiconductor device and manufacturing method thereof
10/06/2011	US20110242885 Three-dimensional phase change memory
10/06/2011	US20110242765 Semiconductor package and method of manufacturing the same
10/06/2011	US20110242510 Substrate processing system, substrate surface processing apparatus, substrate surface inspecting apparatus, substrate surface inspecting method, and storage medium storing program for implementing the method
10/06/2011	US20110242464 Insulated gate transistor, active matrix substrate, liquid crystal display device, and method for producing the same
10/06/2011	US20110242390 Solid-state imaging device and electronic instrument
10/06/2011	US20110242012 Organic electro-luminescent device package and fabricating method thereof
10/06/2011	US20110241793 Semiconductor Device and Method of Forming RF Balun Having Reduced Capacitive Coupling and High CMRR
10/06/2011	US20110241644 Semiconductor device and method of manufacturing the same and power supply device
10/06/2011	US20110241367 Robot edge contact gripper
10/06/2011	US20110241229 Encapsulated nanoparticles
10/06/2011	US20110241228 Epoxy resin composition for sealing packing of semiconductor, semiconductor device, and manufacturing method thereof
10/06/2011	US20110241226 Method for producing a microfluid component, as well as microfluid component
10/06/2011	US20110241224 Wire bonding structure of semiconductor device and wire bonding method
10/06/2011	US20110241223 Integrated circuit package system with wire-in-film isolation barrier and method for manufacturing thereof
10/06/2011	US20110241222 Semiconductor Package and Manufacturing Method
10/06/2011	US20110241220 Air gaps in a multilayer integrated circuit and method of making same
10/06/2011	US20110241219 Semiconductor device and method for manufacturing the same
10/06/2011	US20110241218 Electronic Device and Manufacturing Method
10/06/2011	US20110241217 Multi-Layer Interconnect Structure for Stacked Dies
10/06/2011	US20110241215 Embedded semiconductive chips in reconstituted wafers, and systems containing same
10/06/2011	US20110241214 Virtually Substrate-less Composite Power Semiconductor Device and Method
10/06/2011	US20110241213 Silicide Contact Formation
10/06/2011	US20110241210 Composition for sealing semiconductor, semiconductor device, and process for producing semiconductor device
10/06/2011	US20110241209 Substrate comprising alloy film of metal element having barrier function and metal element having catalytic power
10/06/2011	US20110241205 Semiconductor with through-substrate interconnect
10/06/2011	US20110241203 Semiconductor module, method for manufacturing semiconductor module, and portable apparatus
10/06/2011	US20110241201 Radiate Under-Bump Metallization Structure for Semiconductor Devices
10/06/2011	US20110241197 Device and Method for Manufacturing a Device
10/06/2011	US20110241195 Forming in-situ micro-feature structures with coreless packages
10/06/2011	US20110241193 Semiconductor Device Packages with Fan-Out and with Connecting Elements for Stacking and Manufacturing Methods Thereof
10/06/2011	US20110241192 Wafer-Level Semiconductor Device Packages with Stacking Functionality
10/06/2011	US20110241191 Semiconductor lamination package and method of producing semiconductor lamination package
10/06/2011	US20110241190 Semiconductor Package

1 ... 1246 1247 1248 1249 1250 1251 1252 1253 1254 1255 1256 1257 1258 1259 1260 1261 1262 1263 1264 1265 1266 ... 6590