Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2014
10/21/2014US8866292 Semiconductor packages with integrated antenna and methods of forming thereof
10/21/2014US8866276 Semiconductor chip device with polymeric filler trench
10/21/2014US8866275 Leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect
10/21/2014US8866274 Semiconductor packages and methods of formation thereof
10/21/2014US8866272 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
10/21/2014US8866271 Semiconductor device manufacturing method, substrate processing apparatus and semiconductor device
10/21/2014US8866270 Method of manufacturing semiconductor device mounting structure
10/21/2014US8866269 Semiconductor chips having improved solidity, semiconductor packages including the same and methods of fabricating the same
10/21/2014US8866268 Semiconductor package structure and manufacturing method thereof
10/21/2014US8866264 Semiconductor device and manufacturing method of the same
10/21/2014US8866261 Self-aligned silicide bottom plate for eDRAM applications by self-diffusing metal in CVD/ALD metal process
10/21/2014US8866260 MIM decoupling capacitors under a contact pad
10/21/2014US8866258 Interposer structure with passive component and method for fabricating same
10/21/2014US8866255 Semiconductor device with staggered oxide-filled trenches at edge region
10/21/2014US8866254 Devices including fin transistors robust to gate shorts and methods of making the same
10/21/2014US8866250 Multiple metal film stack in BSI chips
10/21/2014US8866248 Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device
10/21/2014US8866247 Photonic device with a conductive shunt layer
10/21/2014US8866242 MTJ structure and integration scheme
10/21/2014US8866240 System and methods for preparing freestanding films using laser-assisted chemical etch, and freestanding films formed using same
10/21/2014US8866238 Hybrid integrated component and method for the manufacture thereof
10/21/2014US8866237 Methods for embedding controlled-cavity MEMS package in integration board
10/21/2014US8866236 Package structure having MEMS element
10/21/2014US8866235 Source and drain dislocation fabrication in FinFETs
10/21/2014US8866234 Semiconductor device and method for manufacturing the same
10/21/2014US8866233 Semiconductor device
10/21/2014US8866231 Nitride semiconductor device
10/21/2014US8866227 Thin semiconductor-on-insulator MOSFET with co-integrated silicon, silicon germanium and silicon doped with carbon channels
10/21/2014US8866226 SOI radio frequency switch with enhanced electrical isolation
10/21/2014US8866224 Display device
10/21/2014US8866223 Process for manufacturing a power semiconductor device having charge-balance columnar structures on a non-planar surface, and corresponding power semiconductor device
10/21/2014US8866216 Semiconductor device and method for fabricating the same
10/21/2014US8866213 Non-Volatile memory with silicided bit line contacts
10/21/2014US8866212 Structures and methods of improving reliability of non-volatile memory devices
10/21/2014US8866206 Integrated circuit device and method for manufacturing same
10/21/2014US8866204 Method to form finFET/trigate devices on bulk semiconductor wafers
10/21/2014US8866202 Device with gaps for capacitance reduction
10/21/2014US8866199 Group III-V compound semiconductor photo detector, method of fabricating group III-V compound semiconductor photo detector, photo detector, and epitaxial wafer
10/21/2014US8866195 III-V compound semiconductor device having metal contacts and method of making the same
10/21/2014US8866194 Semiconductor device
10/21/2014US8866190 Methods of combining silicon and III-nitride material on a single wafer
10/21/2014US8866188 Semiconductor devices and methods of manufacture thereof
10/21/2014US8866186 Group III nitride semiconductor light-emitting device
10/21/2014US8866176 Display device
10/21/2014US8866171 Light-emitting element and light-emitting device
10/21/2014US8866161 Light-emitting semiconductor device having sub-structures for reducing defects of dislocation therein
10/21/2014US8866158 Semiconductor device and method for manufacturing same
10/21/2014US8866157 Semiconductor device and method of fabricating the semiconductor device
10/21/2014US8866156 Silicon carbide semiconductor device and method for manufacturing same
10/21/2014US8866153 Functional element and manufacturing method of same
10/21/2014US8866151 Semiconductor device
10/21/2014US8866150 Silicon carbide power devices including P-type epitaxial layers and direct ohmic contacts
10/21/2014US8866149 Method for the reuse of gallium nitride epitaxial substrates
10/21/2014US8866147 Method and system for a GaN self-aligned vertical MESFET
10/21/2014US8866145 Organic light-emitting display device including an insulating layer having different thicknesses
10/21/2014US8866144 Thin film semiconductor device having silicon nitride film
10/21/2014US8866143 Semiconductor device and method for fabricating the same
10/21/2014US8866141 Thin film transistor and method for fabricating the same
10/21/2014US8866135 Anthracene derivative and organic electroluminescent element using the same
10/21/2014US8866127 Nitride semiconductor light-emitting element including Si-doped layer, and light source
10/21/2014US8866126 Anisotropic strain control in semipolar nitride quantum wells by partially or fully relaxed aluminum indium gallium nitride layers with misfit dislocations
10/21/2014US8865785 Polishing pad
10/21/2014US8865603 Laser annealing systems and methods with ultra-short dwell times
10/21/2014US8865602 Edge ring lip
10/21/2014US8865601 Methods for preparing a semiconductor wafer with high thermal conductivity
10/21/2014US8865600 Patterned line end space
10/21/2014US8865599 Self-leveling planarization materials for microelectronic topography
10/21/2014US8865598 Method for positioning spacers in pitch multiplication
10/21/2014US8865597 Ta—TaN selective removal process for integrated device fabrication
10/21/2014US8865596 Methods for forming semiconductor structures using selectively-formed sidewall spacers
10/21/2014US8865595 Device and methods for forming partially self-aligned trenches
10/21/2014US8865594 Formation of liner and barrier for tungsten as gate electrode and as contact plug to reduce resistance and enhance device performance
10/21/2014US8865593 Metal silicide layer, NMOS transistor, and fabrication method
10/21/2014US8865592 Silicided semiconductor structure and method of forming the same
10/21/2014US8865591 N-type contact electrode formed on an N-type semiconductor layer and method of forming same using a second metal electrode layer heat-treated after being formed on a first, heat-treated metal electrode layer
10/21/2014US8865590 Film forming method, pretreatment device, and processing system
10/21/2014US8865589 Semiconductor device and manufacturing method of semiconductor device
10/21/2014US8865588 Method of manufacturing semiconductor device
10/21/2014US8865587 Multi-chip-scale package
10/21/2014US8865586 UBM formation for integrated circuits
10/21/2014US8865585 Method of forming post passivation interconnects
10/21/2014US8865584 Semiconductor device and manufacturing method thereof
10/21/2014US8865583 Manufacturing method of a semiconductor device and method for creating a layout thereof
10/21/2014US8865582 Method for producing a floating gate memory structure
10/21/2014US8865581 Hybrid gate last integration scheme for multi-layer high-k gate stacks
10/21/2014US8865580 Pattern forming method, semiconductor device manufacturing method, and coating apparatus
10/21/2014US8865579 Nonvolatile memory device and method of manufacturing the same
10/21/2014US8865578 Method of manufacturing polycrystalline silicon layer, and method of manufacturing transistor having the polycrystalline silicon layer
10/21/2014US8865577 Method for making epitaxial structure
10/21/2014US8865576 Producing vertical transistor having reduced parasitic capacitance
10/21/2014US8865575 Fabrication of III-nitride semiconductor device and related structures
10/21/2014US8865574 Method for deposition of nanoparticles onto substrates
10/21/2014US8865573 Method for fabricating semiconductor device
10/21/2014US8865572 Dislocation engineering using a scanned laser
10/21/2014US8865571 Dislocation engineering using a scanned laser
10/21/2014US8865570 Chips with high fracture toughness through a metal ring
10/21/2014US8865569 Method and apparatus for dividing thin film device into separate cells
10/21/2014US8865568 Workpiece cutting method
10/21/2014US8865567 Method of manufacturing semiconductor device
10/21/2014US8865566 Method of cutting semiconductor substrate
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