Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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01/19/2012 | US20120012836 Semiconductor device and manufacturing method thereof |
01/19/2012 | US20120012835 Metal Oxide Semiconductor Thin Film Transistors |
01/19/2012 | US20120012817 Semiconductor devices and methods of manufacturing an operating same |
01/19/2012 | US20120012812 Solid state lighting devices with reduced crystal lattice dislocations and associated methods of manufacturing |
01/19/2012 | US20120012806 Improved on/off ratio for non-volatile memory device and method |
01/19/2012 | US20120012805 Nonvolatile memory device and method for manufacturing same |
01/19/2012 | US20120012803 Nonvolatile memory device and method for manufacturing the same |
01/19/2012 | US20120012753 Solid-state imaging device and method of manufacturing the same, radiological imaging apparatus and method of manufacturing the same, and method of testing solid-state imaging device |
01/19/2012 | US20120012642 Interconnections for flip-chip using lead-free solders and having reaction barrier layers |
01/19/2012 | US20120012253 Plasma shield for electrode |
01/19/2012 | US20120012252 Plasma processing apparatus |
01/19/2012 | US20120012172 Thin-film solar fabrication process, deposition method for tco layer, and solar cell precursor layer stack |
01/19/2012 | US20120012169 Diamond-Like Carbon Electronic Devices and Methods of Manufacture |
01/19/2012 | DE19946447B4 Teilchenoptisches Abbildungssystem für Lithographiezwecke A particle imaging system for lithography purposes |
01/19/2012 | DE112009002400T5 Verfahren zum Handhaben eines Substrats A method for handling a substrate |
01/19/2012 | DE112009002348T5 Fotomaskenrohling, Fotomaske, Verfahren zu deren Herstellung und Verfahren zur Herstellung eines Halbleiterbauelements Photomask blank photomask, to processes for their preparation and process for the production of a semiconductor device |
01/19/2012 | DE112009002311T5 Farbabstimmbare Halbleiter-Breitbandlichtquellen und Vollfarbmikrodisplays Farbabstimmbare semiconductor broadband light sources and full-color microdisplays |
01/19/2012 | DE112008003488B4 Verfahren zum Herstellen eines Dünnschichttransistors und Dünnschichttransistor A method of fabricating a thin film transistor and the thin film transistor |
01/19/2012 | DE10326505B4 Laserritzen von Dünnschichthalbleiterbauelementen Laser scribing of thin film semiconductor devices |
01/19/2012 | DE102011078726A1 Method for processing wafer for e.g. integrated circuit, involves removing division tape attached to annular amplification section as well as annular frame to remove annular reinforcing section |
01/19/2012 | DE102011077778A1 Verfahren zum Messen der Eigenschaften eines Halbleiterelements und Verfahren zum Herstellen einer Halbleitervorrichtung A method for measuring the characteristics of a semiconductor element and method of manufacturing a semiconductor device |
01/19/2012 | DE102011077410A1 Herstellungsverfahren für Halbleitervorrichtung Manufacturing method for semiconductor device |
01/19/2012 | DE102011051407A1 Halbleitervorrichtung mit einer Kanalstoppzone A semiconductor device comprising a channel stop region |
01/19/2012 | DE102011005512A1 Method for performing double-sided polishing of semiconductor wafer in double side polishing machine, involves providing clothes with segments comprising specific dimensions, and polishing front side of wafer |
01/19/2012 | DE102011001844A1 Verfahren zum Herstellen eines Halbleiterchip-Package und Halbleiterchip-Package A method for producing a semiconductor chip package and semiconductor chip package |
01/19/2012 | DE102010050110B3 Metall-Komposit-Beschichtung mit hoher optischer Transmissivität im visuellen Spektrum Metal-composite coating with high optical transmittance in the visible spectrum |
01/19/2012 | DE102010027411A1 Halbleiterbauelement, Substrat und Verfahren zur Herstellung einer Halbleiterschichtenfolge A semiconductor device, substrate and method of manufacturing a semiconductor layer sequence, |
01/19/2012 | DE102010027238A1 Sägevorrichtung und Verfahren zur Herstellung eines in Szintillatorelemente strukturierten Szintillators sowie Szintillator mit Szintillatorelementen Sawing device and process for the preparation of a structured scintillator in the scintillator, and the scintillator with scintillator |
01/19/2012 | DE102010013038B4 Verfahren zum Herstellen einer Fotovoltaikzelle A method of manufacturing a photovoltaic cell |
01/19/2012 | DE102010007459B4 Verfahren zum Abtrennen einer Vielzahl von Scheiben von einem Kristall aus Halbleitermaterial A method for separating a plurality of wafers from a crystal of semiconductor material |
01/19/2012 | DE102009047786A1 Ein Halbleiterbauelement und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof |
01/19/2012 | DE102009030281B4 Vorrichtung und Verfahren zur aktiven Abschirmung von Leitern in MEMS-Vorrichtungen Apparatus and method for active shielding of conductors in MEMS devices |
01/19/2012 | DE102009010174B9 Verfahren zur Herstellung eines Halbleiterbauelements und Halbleiterbauelement A process for producing a semiconductor device and semiconductor device |
01/19/2012 | DE102005041358B4 Feldplatten-Trenchtransistor sowie Verfahren zu dessen Herstellung Field plate trench transistor as well as methods for its preparation |
01/19/2012 | DE102005004795B9 Konzept zur nass-chemischen Entfernung eines Opfermaterials in einer Materialstruktur Concept for the wet chemical removal of a sacrificial material in a material structure |
01/19/2012 | DE10119741B4 Verfahren und Vorrichtung zum Behandeln von Halbleitersubstraten Method and apparatus for treatment of semiconductor substrates |
01/18/2012 | EP2408276A1 Plasma processing apparatus |
01/18/2012 | EP2408275A1 Plasma processing apparatus |
01/18/2012 | EP2408154A1 Optimal route selection apparatus, optimal route selection method, and program |
01/18/2012 | EP2408031A2 Light emitting diode package and frame shaping method of the same |
01/18/2012 | EP2408011A2 Oxide semiconductor devices and methods of manufacturing the same |
01/18/2012 | EP2408007A2 Semiconductor integrated circuit device |
01/18/2012 | EP2408006A2 Method for forming 3D-interconnect structures with airgaps |
01/18/2012 | EP2408005A1 Substrate transporting method |
01/18/2012 | EP2408004A1 Robot provided with end effector, and method for operating the robot |
01/18/2012 | EP2408003A1 Atomic layer deposition apparatus and thin film forming method |
01/18/2012 | EP2408002A1 Atomic layer deposition apparatus |
01/18/2012 | EP2408001A2 Memory element comprising a fuse in parallel with an anti-fuse |
01/18/2012 | EP2407578A1 Electroless gold plating solution for forming fine gold structure, method of forming fine gold structure using same, and fine gold structure formed using same |
01/18/2012 | EP2407576A1 Process for removing residual water molecules in process for producing metallic thin film, and purge solvent |
01/18/2012 | EP2407403A1 Apparatus for controlling position of flexible substrate |
01/18/2012 | EP2407232A1 Exhaust gas processing apparatus and method for processing exhaust gas |
01/18/2012 | EP2406826A1 Method for manufacturing semiconductor device |
01/18/2012 | EP2406821A2 Stacked microelectronic assemblies having vias extending through bond pads |
01/18/2012 | EP2406820A1 A method of fabricating a multilayer structure with circuit layer transfer |
01/18/2012 | EP2406819A2 Methods and systems for generating an inspection process for a wafer |
01/18/2012 | EP2406818A1 A method of producing a heterostructure with local adaptation of the thermal expansion coefficient |
01/18/2012 | EP2406817A2 Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment |
01/18/2012 | EP2406816A1 Method for fabricating semiconductor components using maskless back side alignment to conductive vias |
01/18/2012 | EP2406815A1 Method for positioning chips during the production of a reconstituted board |
01/18/2012 | EP2406686A1 Actinic-ray- or radiation-sensitive resin composition and method of forming pattern using the composition |
01/18/2012 | EP2406413A1 Methods and apparati for making thin semiconductor bodies from molten material |
01/18/2012 | EP2406341A2 Chemical mechanical planarization using nanodiamond |
01/18/2012 | EP2263251B1 Method of transfer using a ferroelectric substrate |
01/18/2012 | EP2168152B1 Reducing transistor junction capacitance by recessing drain and source regions |
01/18/2012 | EP1952436B1 Bipolar carrier wafer and mobile bipolar electrostatic wafer arrangement |
01/18/2012 | EP1947682B1 Multilayer reflecting mirror, multilayer reflecting mirror manufacturing method, optical system, exposure apparatus and device manufacturing method |
01/18/2012 | EP1880416B1 Process for minimizing electromigration in an electronic device |
01/18/2012 | EP1815526B1 Insulated gate type semiconductor device and method for producing the same |
01/18/2012 | EP1779438B1 Iii-v hemt devices |
01/18/2012 | EP1750298B1 RF power transistor with impedance matched output electrode |
01/18/2012 | EP1452626B9 Mixer, and device and method for manufacturing thin film |
01/18/2012 | EP1340126B1 Method of aligning a photolithographic mask to a crystal plane |
01/18/2012 | EP1277236B1 Electrostatic discharge (esd) protection circuit |
01/18/2012 | EP1055153B1 Photomask with a mask edge provided with a ring-shaped esd protection area |
01/18/2012 | DE202011000518U1 Elektrisch leitfähige Kontaktstrukturen auf einer Substratoberfläche Electrically conductive contact structures on a substrate surface |
01/18/2012 | CN202120988U Substrate conveying equipment for forming passivation layer on OLED (Organic Light Emitting Diode) substrate |
01/18/2012 | CN202120970U Wet method etching groove |
01/18/2012 | CN202120969U Assembly transmission device |
01/18/2012 | CN202120967U Automatic junction device |
01/18/2012 | CN202120885U Etching tool clamp |
01/18/2012 | CN202120884U Glass bar used for bearing glass and stage device |
01/18/2012 | CN202120883U Etching suction pen |
01/18/2012 | CN202120882U Semiconductor packaging mold construction having no pins all around |
01/18/2012 | CN202120881U Chip molding die |
01/18/2012 | CN202120880U Supporting wheel component for wafer cleaning and vertical cleaning device for wafers |
01/18/2012 | CN202120879U Hot water heating device for cleaning and drying silicon wafers |
01/18/2012 | CN202120878U Ejector sleeve device mechanism |
01/18/2012 | CN202120877U Chip bonding system |
01/18/2012 | CN202120876U Quick wafer thermal treatment device with composite control interfaces |
01/18/2012 | CN1997495B Method and device for controllable encapsulation of electronic components |
01/18/2012 | CN1992199B Method for forming metal interconnection in image sensor |
01/18/2012 | CN1831073B Low stress conductive adhesive |
01/18/2012 | CN1801486B High surface area aluminum bond pad for through-wafer connections to an electronic package |
01/18/2012 | CN1723549B Method for plasma etching performance enhancement |
01/18/2012 | CN1646894B Dark field detection apparatus with traveling lens multi-beam scanner and a method thereof |
01/18/2012 | CN102326458A Plasma processing device |
01/18/2012 | CN102326457A Plasma apparatus |
01/18/2012 | CN102326267A Nitride semiconductor light-emitting element and manufacturing method therefor |
01/18/2012 | CN102326262A Solar cell and method for manufacturing same |