Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2012
01/19/2012US20120012836 Semiconductor device and manufacturing method thereof
01/19/2012US20120012835 Metal Oxide Semiconductor Thin Film Transistors
01/19/2012US20120012817 Semiconductor devices and methods of manufacturing an operating same
01/19/2012US20120012812 Solid state lighting devices with reduced crystal lattice dislocations and associated methods of manufacturing
01/19/2012US20120012806 Improved on/off ratio for non-volatile memory device and method
01/19/2012US20120012805 Nonvolatile memory device and method for manufacturing same
01/19/2012US20120012803 Nonvolatile memory device and method for manufacturing the same
01/19/2012US20120012753 Solid-state imaging device and method of manufacturing the same, radiological imaging apparatus and method of manufacturing the same, and method of testing solid-state imaging device
01/19/2012US20120012642 Interconnections for flip-chip using lead-free solders and having reaction barrier layers
01/19/2012US20120012253 Plasma shield for electrode
01/19/2012US20120012252 Plasma processing apparatus
01/19/2012US20120012172 Thin-film solar fabrication process, deposition method for tco layer, and solar cell precursor layer stack
01/19/2012US20120012169 Diamond-Like Carbon Electronic Devices and Methods of Manufacture
01/19/2012DE19946447B4 Teilchenoptisches Abbildungssystem für Lithographiezwecke A particle imaging system for lithography purposes
01/19/2012DE112009002400T5 Verfahren zum Handhaben eines Substrats A method for handling a substrate
01/19/2012DE112009002348T5 Fotomaskenrohling, Fotomaske, Verfahren zu deren Herstellung und Verfahren zur Herstellung eines Halbleiterbauelements Photomask blank photomask, to processes for their preparation and process for the production of a semiconductor device
01/19/2012DE112009002311T5 Farbabstimmbare Halbleiter-Breitbandlichtquellen und Vollfarbmikrodisplays Farbabstimmbare semiconductor broadband light sources and full-color microdisplays
01/19/2012DE112008003488B4 Verfahren zum Herstellen eines Dünnschichttransistors und Dünnschichttransistor A method of fabricating a thin film transistor and the thin film transistor
01/19/2012DE10326505B4 Laserritzen von Dünnschichthalbleiterbauelementen Laser scribing of thin film semiconductor devices
01/19/2012DE102011078726A1 Method for processing wafer for e.g. integrated circuit, involves removing division tape attached to annular amplification section as well as annular frame to remove annular reinforcing section
01/19/2012DE102011077778A1 Verfahren zum Messen der Eigenschaften eines Halbleiterelements und Verfahren zum Herstellen einer Halbleitervorrichtung A method for measuring the characteristics of a semiconductor element and method of manufacturing a semiconductor device
01/19/2012DE102011077410A1 Herstellungsverfahren für Halbleitervorrichtung Manufacturing method for semiconductor device
01/19/2012DE102011051407A1 Halbleitervorrichtung mit einer Kanalstoppzone A semiconductor device comprising a channel stop region
01/19/2012DE102011005512A1 Method for performing double-sided polishing of semiconductor wafer in double side polishing machine, involves providing clothes with segments comprising specific dimensions, and polishing front side of wafer
01/19/2012DE102011001844A1 Verfahren zum Herstellen eines Halbleiterchip-Package und Halbleiterchip-Package A method for producing a semiconductor chip package and semiconductor chip package
01/19/2012DE102010050110B3 Metall-Komposit-Beschichtung mit hoher optischer Transmissivität im visuellen Spektrum Metal-composite coating with high optical transmittance in the visible spectrum
01/19/2012DE102010027411A1 Halbleiterbauelement, Substrat und Verfahren zur Herstellung einer Halbleiterschichtenfolge A semiconductor device, substrate and method of manufacturing a semiconductor layer sequence,
01/19/2012DE102010027238A1 Sägevorrichtung und Verfahren zur Herstellung eines in Szintillatorelemente strukturierten Szintillators sowie Szintillator mit Szintillatorelementen Sawing device and process for the preparation of a structured scintillator in the scintillator, and the scintillator with scintillator
01/19/2012DE102010013038B4 Verfahren zum Herstellen einer Fotovoltaikzelle A method of manufacturing a photovoltaic cell
01/19/2012DE102010007459B4 Verfahren zum Abtrennen einer Vielzahl von Scheiben von einem Kristall aus Halbleitermaterial A method for separating a plurality of wafers from a crystal of semiconductor material
01/19/2012DE102009047786A1 Ein Halbleiterbauelement und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof
01/19/2012DE102009030281B4 Vorrichtung und Verfahren zur aktiven Abschirmung von Leitern in MEMS-Vorrichtungen Apparatus and method for active shielding of conductors in MEMS devices
01/19/2012DE102009010174B9 Verfahren zur Herstellung eines Halbleiterbauelements und Halbleiterbauelement A process for producing a semiconductor device and semiconductor device
01/19/2012DE102005041358B4 Feldplatten-Trenchtransistor sowie Verfahren zu dessen Herstellung Field plate trench transistor as well as methods for its preparation
01/19/2012DE102005004795B9 Konzept zur nass-chemischen Entfernung eines Opfermaterials in einer Materialstruktur Concept for the wet chemical removal of a sacrificial material in a material structure
01/19/2012DE10119741B4 Verfahren und Vorrichtung zum Behandeln von Halbleitersubstraten Method and apparatus for treatment of semiconductor substrates
01/18/2012EP2408276A1 Plasma processing apparatus
01/18/2012EP2408275A1 Plasma processing apparatus
01/18/2012EP2408154A1 Optimal route selection apparatus, optimal route selection method, and program
01/18/2012EP2408031A2 Light emitting diode package and frame shaping method of the same
01/18/2012EP2408011A2 Oxide semiconductor devices and methods of manufacturing the same
01/18/2012EP2408007A2 Semiconductor integrated circuit device
01/18/2012EP2408006A2 Method for forming 3D-interconnect structures with airgaps
01/18/2012EP2408005A1 Substrate transporting method
01/18/2012EP2408004A1 Robot provided with end effector, and method for operating the robot
01/18/2012EP2408003A1 Atomic layer deposition apparatus and thin film forming method
01/18/2012EP2408002A1 Atomic layer deposition apparatus
01/18/2012EP2408001A2 Memory element comprising a fuse in parallel with an anti-fuse
01/18/2012EP2407578A1 Electroless gold plating solution for forming fine gold structure, method of forming fine gold structure using same, and fine gold structure formed using same
01/18/2012EP2407576A1 Process for removing residual water molecules in process for producing metallic thin film, and purge solvent
01/18/2012EP2407403A1 Apparatus for controlling position of flexible substrate
01/18/2012EP2407232A1 Exhaust gas processing apparatus and method for processing exhaust gas
01/18/2012EP2406826A1 Method for manufacturing semiconductor device
01/18/2012EP2406821A2 Stacked microelectronic assemblies having vias extending through bond pads
01/18/2012EP2406820A1 A method of fabricating a multilayer structure with circuit layer transfer
01/18/2012EP2406819A2 Methods and systems for generating an inspection process for a wafer
01/18/2012EP2406818A1 A method of producing a heterostructure with local adaptation of the thermal expansion coefficient
01/18/2012EP2406817A2 Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment
01/18/2012EP2406816A1 Method for fabricating semiconductor components using maskless back side alignment to conductive vias
01/18/2012EP2406815A1 Method for positioning chips during the production of a reconstituted board
01/18/2012EP2406686A1 Actinic-ray- or radiation-sensitive resin composition and method of forming pattern using the composition
01/18/2012EP2406413A1 Methods and apparati for making thin semiconductor bodies from molten material
01/18/2012EP2406341A2 Chemical mechanical planarization using nanodiamond
01/18/2012EP2263251B1 Method of transfer using a ferroelectric substrate
01/18/2012EP2168152B1 Reducing transistor junction capacitance by recessing drain and source regions
01/18/2012EP1952436B1 Bipolar carrier wafer and mobile bipolar electrostatic wafer arrangement
01/18/2012EP1947682B1 Multilayer reflecting mirror, multilayer reflecting mirror manufacturing method, optical system, exposure apparatus and device manufacturing method
01/18/2012EP1880416B1 Process for minimizing electromigration in an electronic device
01/18/2012EP1815526B1 Insulated gate type semiconductor device and method for producing the same
01/18/2012EP1779438B1 Iii-v hemt devices
01/18/2012EP1750298B1 RF power transistor with impedance matched output electrode
01/18/2012EP1452626B9 Mixer, and device and method for manufacturing thin film
01/18/2012EP1340126B1 Method of aligning a photolithographic mask to a crystal plane
01/18/2012EP1277236B1 Electrostatic discharge (esd) protection circuit
01/18/2012EP1055153B1 Photomask with a mask edge provided with a ring-shaped esd protection area
01/18/2012DE202011000518U1 Elektrisch leitfähige Kontaktstrukturen auf einer Substratoberfläche Electrically conductive contact structures on a substrate surface
01/18/2012CN202120988U Substrate conveying equipment for forming passivation layer on OLED (Organic Light Emitting Diode) substrate
01/18/2012CN202120970U Wet method etching groove
01/18/2012CN202120969U Assembly transmission device
01/18/2012CN202120967U Automatic junction device
01/18/2012CN202120885U Etching tool clamp
01/18/2012CN202120884U Glass bar used for bearing glass and stage device
01/18/2012CN202120883U Etching suction pen
01/18/2012CN202120882U Semiconductor packaging mold construction having no pins all around
01/18/2012CN202120881U Chip molding die
01/18/2012CN202120880U Supporting wheel component for wafer cleaning and vertical cleaning device for wafers
01/18/2012CN202120879U Hot water heating device for cleaning and drying silicon wafers
01/18/2012CN202120878U Ejector sleeve device mechanism
01/18/2012CN202120877U Chip bonding system
01/18/2012CN202120876U Quick wafer thermal treatment device with composite control interfaces
01/18/2012CN1997495B Method and device for controllable encapsulation of electronic components
01/18/2012CN1992199B Method for forming metal interconnection in image sensor
01/18/2012CN1831073B Low stress conductive adhesive
01/18/2012CN1801486B High surface area aluminum bond pad for through-wafer connections to an electronic package
01/18/2012CN1723549B Method for plasma etching performance enhancement
01/18/2012CN1646894B Dark field detection apparatus with traveling lens multi-beam scanner and a method thereof
01/18/2012CN102326458A Plasma processing device
01/18/2012CN102326457A Plasma apparatus
01/18/2012CN102326267A Nitride semiconductor light-emitting element and manufacturing method therefor
01/18/2012CN102326262A Solar cell and method for manufacturing same