Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2012
05/09/2012CN102446838A Preparation method of CMOS (complementary metal-oxide semiconductor) nickel silicide and metal ohmic contact process
05/09/2012CN102446837A Manufacturing of a device including a semiconductor chip
05/09/2012CN102446836A Damascus process with metal protection layer on copper interconnection wire
05/09/2012CN102446835A Damascus technology for forming metal protective layer on copper interconnecting wire
05/09/2012CN102446834A Surface treatment method for increasing copper interconnection reliability
05/09/2012CN102446833A Processing method for reducing particles of dual-damascene silicon nitride process
05/09/2012CN102446832A Method for avoiding contact hole blockage caused by dual etching barrier layers
05/09/2012CN102446831A Method for pretreating copper surface
05/09/2012CN102446830A Cost-Effective TSV Formation
05/09/2012CN102446829A Device for carrying out electroplating copper in through hole of silicon wafer
05/09/2012CN102446828A Manufacturing process for removing redundant filled metal from metal layers
05/09/2012CN102446827A Manufacture process of removing redundant metal filling of metal layer
05/09/2012CN102446826A Design and application of redundant metal filler testing photo mask on metal layer
05/09/2012CN102446825A Manufacturing technology for removing redundant metal filler of metal layer
05/09/2012CN102446824A Damascus integration method
05/09/2012CN102446823A Damascus manufacturing process
05/09/2012CN102446822A Integration method of dual Damascus
05/09/2012CN102446821A Method used for reducing copper interconnection structure material damage after chemical machinery polishing
05/09/2012CN102446820A Novel etching barrier layer structure capable of avoiding light resistance poisoning and preparation method thereof
05/09/2012CN102446819A Method used for improving dual contact-etch-stop-layer crossover region contact etch
05/09/2012CN102446818A Method for improving uniformity of etching end point in through hole etching process
05/09/2012CN102446817A Production method of interconnecting structure
05/09/2012CN102446816A Manufacturing method for contact holes in active region of split-grid type memory device
05/09/2012CN102446815A Method for forming interconnecting groove and through hole and method for forming interconnecting structure
05/09/2012CN102446814A Forming method for dual mosaic structure
05/09/2012CN102446813A Production method of interconnecting structure
05/09/2012CN102446812A Metal interconnecting method
05/09/2012CN102446811A Metal interconnecting structure and methods for forming metal interlayer through holes and interconnecting metal wire
05/09/2012CN102446810A Method for forming shallow trench isolation
05/09/2012CN102446809A Process for molecular bonding of silicon and glass substrate
05/09/2012CN102446808A Method for improving multi-exposure stability of shallow groove isolation
05/09/2012CN102446807A Manufacturing method for trench isolation structure of phase change memory
05/09/2012CN102446806A Manufacturing method for trench isolation structure of phase change memory
05/09/2012CN102446805A Method for reducing particle defects at edges of wafers
05/09/2012CN102446804A Integration method of high-integration high-reliability working temperature controllable thick film hybrid integrated circuit
05/09/2012CN102446803A Wire bonding clamp
05/09/2012CN102446802A Wafer platform
05/09/2012CN102446801A Heat treatment apparatus and heat treatment method
05/09/2012CN102446800A Suction table
05/09/2012CN102446799A Suction table
05/09/2012CN102446798A Substrate support member and substrate storage device
05/09/2012CN102446797A Static chuck and semiconductor processing device
05/09/2012CN102446796A Substrate processing apparatus and method of manufacturing a semiconductor device
05/09/2012CN102446795A Substrate carrying device and carrying method
05/09/2012CN102446794A Mask plate box capable of measuring size of mask plate protection film
05/09/2012CN102446793A Method for controlling pollution in manufacturing of semiconductor wafer
05/09/2012CN102446792A Substrate processing system and substrate transferring method
05/09/2012CN102446791A Cleaning method for substrate processing apparatus
05/09/2012CN102446790A Sealed container and semiconductor manufacturing apparatus
05/09/2012CN102446789A Etching bath circulating pipeline device
05/09/2012CN102446788A Equipment and method for repairing poor protrusions of substrate
05/09/2012CN102446787A Vacuum transmission processing equipment and method
05/09/2012CN102446786A Device monitoring method during semiconductor process
05/09/2012CN102446785A Method of inspecting semiconductor device
05/09/2012CN102446784A Testing method and apparatus of polycrystalline silicon thin film
05/09/2012CN102446783A Method used for monitoring ion implantation dosage
05/09/2012CN102446782A Method for measuring critical dimension by using overlay (OVL) machine table
05/09/2012CN102446781A Packaging method of chip of phase change memory
05/09/2012CN102446780A Wafer-level packaging method
05/09/2012CN102446779A Method of manufacturing semiconductor device
05/09/2012CN102446778A Method for improving wire bonding performance
05/09/2012CN102446777A Method of manufacturing semiconductor device
05/09/2012CN102446776A Method of manufacturing electronic device and electronic device
05/09/2012CN102446775A Non-carrier semiconductor packaging component and manufacturing method thereof
05/09/2012CN102446774A Method of manufacturing a base plate for mounting semiconductor elements
05/09/2012CN102446773A Carrier tape for tab-package and manufacturing method thereof
05/09/2012CN102446772A Method for manufacturing semiconductor package
05/09/2012CN102446771A Method for reducing gate induced drain leakage (GIDL) effect of metal oxide semiconductor (MOS) input-output (IO) device
05/09/2012CN102446770A Method and structure for enhancing write-in speed of floating body dynamic random memory cell
05/09/2012CN102446769A Method used for reducing resistance of polysilicon gate in carbon auxiliary injection technological process
05/09/2012CN102446768A Semiconductor device and method of manufacturing semiconductor device
05/09/2012CN102446767A Manufacturing method of NMOS (N-channel metal oxide semiconductor) transistor
05/09/2012CN102446766A MOSFET (Metallic Oxide Semiconductor Field Effect Transistor) forming method
05/09/2012CN102446765A Manufacturing method of small-sized MOS (Metal Oxide Semiconductor) device
05/09/2012CN102446764A MOS (Metal Oxide Semiconductor) transistor and manufacturing method thereof
05/09/2012CN102446763A MOS (Metal Oxide Semiconductor) transistor and manufacturing method thereof
05/09/2012CN102446762A Metal oxide silicon (MOS) transistor and production method thereof
05/09/2012CN102446761A Method for manufacturing semiconductor structure
05/09/2012CN102446760A Method of manufacturing vertical diode
05/09/2012CN102446759A Polycrystalline silicon annealing method for improving silicon loss in logic process
05/09/2012CN102446758A Asymmetric rapid thermal annealing to reduce pattern effect
05/09/2012CN102446757A Method for manufacturing aluminum liner of double-layer passivation protection layer
05/09/2012CN102446756A Method for improving homogeneity of figure density of metal layer of silicon chip
05/09/2012CN102446755A Method for reducing particle defects after chemically mechanical polishing
05/09/2012CN102446754A Method for eliminating phosphorosilicate glass initial oxidation films
05/09/2012CN102446753A Method for controlling reflectivity and extinction coefficients of dielectric anti-reflective film needed by light resistance
05/09/2012CN102446752A Method for forming side wall and storage unit formed thereby
05/09/2012CN102446751A Method for manufacturing semiconductor device with silicide mask layers of different thicknesses
05/09/2012CN102446750A Spacer etching method for increasing writing speed of floating body dynamic random memory unit
05/09/2012CN102446749A Method for achieving accurate graphic positioning during observation using scanning electron microscope
05/09/2012CN102446748A Method for reducing minimum line width in spacer-defined double patterning process
05/09/2012CN102446747A Method for forming side wall and p-channel metal oxide semiconductor (PMOS) transistor
05/09/2012CN102446746A Method for preventing collapse of figures of polysilicon layer
05/09/2012CN102446745A Method for reducing cracking of dual-layer front metal dielectric substance layer
05/09/2012CN102446744A Method for removing excessive nickel after formation of nickel silicide
05/09/2012CN102446743A Process for establishing active region silicon nitride film application database
05/09/2012CN102446742A Method for preventing photoresist from losing efficacy in double-stress silicon nitride process
05/09/2012CN102446741A Semiconductor device manufacturing method, substrate processing apparatus and semiconductor device
05/09/2012CN102446740A Integrated process for improving gap fill property of PMD (pre-metal dielectric)
05/09/2012CN102446739A Method and apparatus of a substrate etching system and process
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