Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2012
05/09/2012CN102449090A Adhesive sheet and method for grinding back surface of semiconductor wafer
05/09/2012CN102449017A Polyurethane, composition for formation of polishing layers that contains same, pad for chemical mechanical polishing, and chemical mechanical polishing method using same
05/09/2012CN102449016A Adhesives and binders for electro-optic displays
05/09/2012CN102448854A Conveyance vehicle system
05/09/2012CN102448682A Device for teaching robot and method for teaching robot
05/09/2012CN102448659A Component having an overlapping laser track
05/09/2012CN102448627A Method and apparatus for physical confinement of a liquid meniscus over a semiconductor wafer
05/09/2012CN102447018A Improved combination structure and combining method of baseplate and heat dissipating structure
05/09/2012CN102446981A Multi-layer metal-silicon nitride-metal capacitor and manufacturing method thereof
05/09/2012CN102446980A Low-forward-voltage-drop schottky diode and manufacturing method thereof
05/09/2012CN102446979A PIN (Positive Intrinsic Negative) diode and manufacturing method thereof
05/09/2012CN102446978A PIN device in bipolar complementary metal oxide semiconductor (BiCMOS) process
05/09/2012CN102446974A FINFET and method of fabricating the same
05/09/2012CN102446972A Transistor having notched fin structure and method of making the same
05/09/2012CN102446970A Semiconductor device capable of preventing cavitation from forming during acid tank washing and manufacturing method of semiconductor device
05/09/2012CN102446969A Semiconductor device and forming method thereof
05/09/2012CN102446968A LDMOS (Laterally Diffused Metal Oxide Semiconductor) device structure and manufacturing method
05/09/2012CN102446966A IGBT ((Insulated Gate Bipolar Transistor) structure of integrated anti-parallel diode and manufacturing method thereof
05/09/2012CN102446965A Germanium-silicon heterojunction bipolar transistor
05/09/2012CN102446964A Preparation method of ONO (oxide nitride oxide) structure utilizing DPN (diphesphopyridine nucleotide) silicon oxynitride as SONOS (silicon oxide nitride oxide semiconductor) storage medium layer
05/09/2012CN102446963A Composite tunneling dielectric layer and manufacturing method thereof and non-volatile memory
05/09/2012CN102446962A MOSFET (Metal Oxide Semiconductor Field Effect Transistor) gate membrane structure compatible with self-aligned hole and pattern manufacturing method
05/09/2012CN102446961A Semiconductor device containing power device and preparation method thereof
05/09/2012CN102446960A 1T-DRAM (one transistor dynamic random access memory) unit structure and preparation method thereof
05/09/2012CN102446959A Buried layer N-type well-based heterojunction 1T-DRAM (one transistor dynamic random access memory) and preparation method thereof
05/09/2012CN102446958A Carbon silicon-germanium silicon heterojunction 1T-DRAM (Single Transistor Dynamic Random Access Memory) structure on insulator and forming method thereof
05/09/2012CN102446957A Structure of heterojunction field effect transistor and a fabrication method thereof
05/09/2012CN102446956A Semiconductor high-power device and manufacturing method thereof
05/09/2012CN102446955A High voltage MOS device and method for making the same
05/09/2012CN102446954A Integrated circuit device and manufacturing method thereof
05/09/2012CN102446953A Semiconductor structure and making method thereof
05/09/2012CN102446952A Semiconductor structure and formation method thereof
05/09/2012CN102446951A Semiconductor structure and forming method thereof
05/09/2012CN102446950A Fluorescent display tube and manufacturing method thereof
05/09/2012CN102446929A SOI (silicon on insulator) silicon slice and manufacturing method thereof as well as floating body effect memory device
05/09/2012CN102446928A Floating body dynamic random access memory unit capable of increasing writing speed and manufacturing method thereof
05/09/2012CN102446927A Floating body dynamic random access memory unit capable of increasing writing speed and manufacturing method thereof
05/09/2012CN102446926A Flexible display panel and assembling method thereof
05/09/2012CN102446925A Array base plate, liquid crystal display and manufacturing method for array base plate
05/09/2012CN102446924A Nonvolatile memory unit structure and forming method thereof
05/09/2012CN102446922A Nonvolatile memory device, nonvolatile memory device group, and manufacturing method thereof
05/09/2012CN102446921A Nonvolatile memory device and method of manufacturing the same
05/09/2012CN102446920A Semiconductor device with vertical channel transistor and method of fabricating the same
05/09/2012CN102446919A Semiconductor memory device with vertical channel transistor and method of fabricating same
05/09/2012CN102446918A Structure for preventing etch stop layer from cracking and method for forming structure
05/09/2012CN102446917A Multilayer MOM capacitor and manufacturing method thereof
05/09/2012CN102446916A Integrated circuits with magnetic core inductors and methods of fabrications thereof
05/09/2012CN102446915A Novel metal-insulator-metal (MIM) capacitor structure and manufacturing method thereof
05/09/2012CN102446914A Semiconductor module with extra capacitance structure and production method thereof
05/09/2012CN102446913A Array baseplate and manufacturing method thereof and liquid crystal display
05/09/2012CN102446912A Metal oxide semiconductor transistor ESD (Electrostatic Discharge) protection structure and making method thereof
05/09/2012CN102446907A Three-dimensional packaging structure and making method thereof
05/09/2012CN102446906A Integrated circuit device and method for manufacturing same
05/09/2012CN102446902A Graphic structure integrating dimensional measurement and overlay accuracy detection and method thereof
05/09/2012CN102446901A Failure analysis structure, formation method of failure analysis structure and failure analysis method
05/09/2012CN102446900A Electromigration reliability test structure and making method for multilayer of metal interconnected metal wires
05/09/2012CN102446895A High performance metal-oxide-metal capacitor and manufacturing method thereof
05/09/2012CN102446894A High-performance metal-oxide-metal capacitor and manufacturing method thereof
05/09/2012CN102446893A High-performance metal-oxide-metal capacitor and manufacturing method thereof
05/09/2012CN102446892A High-performance metal-oxide-metal capacitor and manufacturing method thereof
05/09/2012CN102446891A High-performance metal-oxide-metal capacitor and manufacturing method thereof
05/09/2012CN102446890A Semiconductor device, method of manufacturing same and adsorption site blocking atomic layer deposition method
05/09/2012CN102446889A Transformer arrangement
05/09/2012CN102446888A Semiconductor device having multilayer wiring structure and manufacturing method of the same
05/09/2012CN102446886A 3D (three-dimensional) integrated circuit structure and forming method thereof
05/09/2012CN102446885A Semiconductor power module and method of manufacturing same
05/09/2012CN102446884A Package unit and stacking structure thereof and method for manufacturing package unit
05/09/2012CN102446883A Universal package substrate, package structure and package method
05/09/2012CN102446882A Semiconductor PiP (package in package) system structure and manufacturing method thereof
05/09/2012CN102446881A Universal packaging substrate and packaging method thereof
05/09/2012CN102446880A Semiconductor module comprising insert and method for producing semiconductor module comprising insert
05/09/2012CN102446874A Material mixing prevention structure for heat-conducting element, jig thereof and method for preventing material mixing thereof
05/09/2012CN102446868A Novel dual-interface smart card module and implementation method thereof
05/09/2012CN102446865A Crack stop barrier and method of manufacturing thereof
05/09/2012CN102446864A Power module and method for manufacturing same
05/09/2012CN102446863A Semiconductor package member and method of manufacturing same
05/09/2012CN102446862A Novel double-bit line SONOS (silicon oxide nitride oxide silicon) unit structure and manufacturing method thereof
05/09/2012CN102446861A Method for increasing erasing and writing speed of SONOS (silicon oxide nitride oxide semiconductor) with utilization of selective silicon carbide epitaxy
05/09/2012CN102446860A 1T-DRAM (one transistor dynamic random access memory) structure based on SON (silicon on nothing) and preparation method thereof
05/09/2012CN102446859A Method for making floating dynamic random access memory unit capable of increasing writing speed
05/09/2012CN102446858A Gate oxide precleaning method used for improving performance of floating body dynamic random access memory unit
05/09/2012CN102446857A Silicide mask etching method for enhancing performances of semiconductor device
05/09/2012CN102446856A Semiconductor device and method of manufacturing semiconductor device
05/09/2012CN102446855A Method of manufacturing semiconductor device
05/09/2012CN102446854A Manufacturing method for CMOS (Complementary Metal Oxide Semiconductor) transistor
05/09/2012CN102446853A Strain semiconductor channel forming method and semiconductor apparatus
05/09/2012CN102446852A Method used for integrating deep junction depth device and shallow junction depth device
05/09/2012CN102446851A Method for embedding high-voltage device in silicon oxide-nitride-oxide semiconductor (SONOS) nonvolatile memory process
05/09/2012CN102446850A Method for embedding high-voltage apparatus in SONOS (silicon oxide nitride oxide semiconductor) nonvolatile memory technology
05/09/2012CN102446849A Method for forming single Damascus of thick metal
05/09/2012CN102446848A Single Damascus method used for reducing square resistance of copper interconnection
05/09/2012CN102446847A Full photoresistance dual damascene method capable of reducing sheet resistance of copper interconnection
05/09/2012CN102446846A Method for achieving high-performance copper interconnection by utilizing upper mask
05/09/2012CN102446845A Method for improving warpage deformation of diamond wafer induced by ultra-thick top metal
05/09/2012CN102446844A Method for filling silicon through hole with conductive polymer gel
05/09/2012CN102446843A Method for achieving high-performance copper interconnection by utilizing upper mask
05/09/2012CN102446842A Method for reducing interlayer capacitance of metal wiring layer in dual damascene technology
05/09/2012CN102446841A Preparation method for low-stress metal hard mask layer
05/09/2012CN102446840A Method for increasing breakdown voltage of double-Damascus structure dielectric barrier layer film
05/09/2012CN102446839A Method for depositing front metal dielectric layer