Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2012
05/23/2012CN102468272A 用于多晶硅栅耗尽测试的mos结构及制造方法 Polysilicon gate depletion test structure and method for manufacturing mos
05/23/2012CN102468271A 一种半导体工艺的测试结构及其制造方法 Test structure and manufacturing method of a semiconductor process
05/23/2012CN102468268A Memory device and method of fabricating the same
05/23/2012CN102468267A 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing
05/23/2012CN102468266A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/23/2012CN102468265A 连接插塞及其制作方法 Connector plug and its production method
05/23/2012CN102468264A Bump structure and semiconductor package having the bump structure
05/23/2012CN102468259A Semiconductor packages and methods for the same
05/23/2012CN102468258A Semiconductor device with connecting points nested in rows
05/23/2012CN102468257A Wafer level semiconductor package and manufacturing methods thereof
05/23/2012CN102468250A Heat-radiating substrate and method for manufacturing the same
05/23/2012CN102468249A Power package module and method for fabricating the same
05/23/2012CN102468248A Protecting flip-chip package using pre-applied fillet
05/23/2012CN102468247A Seal ring structure with polyimide layer adhesion
05/23/2012CN102468246A Semiconductor device and manufacturing method thereof
05/23/2012CN102468245A Semiconductor device and method of manufacturing the same
05/23/2012CN102468244A Passivation layer structure of semiconductor module and method for forming passivation layer structure
05/23/2012CN102468243A Tft阵列基板、制造方法及液晶显示装置 Tft array substrate, a liquid crystal display device manufacturing method and
05/23/2012CN102468242A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/23/2012CN102468241A Method of fabricating a nonvolatile memory device
05/23/2012CN102468240A 集成电路及其制造方法 And a method of manufacturing an integrated circuit
05/23/2012CN102468239A 半导体器件的制作方法 Method of manufacturing a semiconductor device
05/23/2012CN102468238A 具有金属栅极的半导体元件及其制作方法 A semiconductor device and method of making the metal gate
05/23/2012CN102468237A 半导体器件的制造方法 The method of manufacturing a semiconductor device
05/23/2012CN102468236A 金属氧化物半导体器件的形成方法 The method for forming a metal oxide semiconductor device
05/23/2012CN102468235A 鳍片场效应晶体管(finfet)器件及其制造方法 A fin field effect transistor (finfet) device and manufacturing method
05/23/2012CN102468234A 在指定区域形成侧墙的方法 The method of forming a side wall in the designated area
05/23/2012CN102468233A Fabrication method for dicing of semiconductor wafers using laser cutting techniques
05/23/2012CN102468232A Method of fabricating array substrate
05/23/2012CN102468231A Array substrate, manufacturing method thereof, and active display
05/23/2012CN102468230A 制造半导体器件的方法 The method of manufacturing a semiconductor device
05/23/2012CN102468229A 集成电路结构及其制备方法 Integrated circuit structure and preparation method
05/23/2012CN102468228A 半导体结构及其形成方法 And a method for forming a semiconductor structure
05/23/2012CN102468227A 半导体结构的制造方法 The method of manufacturing a semiconductor structure
05/23/2012CN102468226A Semiconductor structure and making method thereof
05/23/2012CN102468225A 熔丝结构及其制作方法 Fuse structure and manufacturing method thereof
05/23/2012CN102468224A 半导体互连结构的制作方法 The method of making a semiconductor interconnect structure
05/23/2012CN102468223A 接触孔的形成方法 The method of forming a contact hole
05/23/2012CN102468222A 射频ldmos器件中源衬接触柱的实现方法 Implementation of RF ldmos source device columns lining contact
05/23/2012CN102468221A Method for processing contact holes in complementary metal oxide semiconductor (CMOS) device by gate-last process
05/23/2012CN102468220A 一种金属互连结构及其形成方法 One metal interconnect structure and method of forming
05/23/2012CN102468219A 互连结构的制造方法 The method of manufacturing an interconnect structure
05/23/2012CN102468218A 形成双镶嵌结构的方法、半导体器件 The method of forming a dual damascene structure, a semiconductor device
05/23/2012CN102468217A 接触孔的形成方法 The method of forming a contact hole
05/23/2012CN102468216A 半导体装置及其制造方法 Semiconductor device and manufacturing method
05/23/2012CN102468215A 沟槽隔离结构及其形成方法 Trench isolation structure and method of forming
05/23/2012CN102468214A 浅沟槽隔离结构及其形成方法 Shallow trench isolation structure and method of forming
05/23/2012CN102468213A 沟槽隔离结构及其形成方法 Trench isolation structure and method of forming
05/23/2012CN102468212A 浅沟槽隔离结构形成方法 The method for forming a shallow trench isolation structure
05/23/2012CN102468211A 浅沟槽隔离结构形成方法 The method for forming a shallow trench isolation structure
05/23/2012CN102468210A 一种隔离结构及制造方法、以及具有该结构的半导体器件 An isolation structure and manufacturing method, and a semiconductor device having the structure
05/23/2012CN102468209A 锗硅hbt的埋层形成方法 SiGe hbt method for forming a buried layer
05/23/2012CN102468208A 卡盘和半导体处理装置 Chuck and semiconductor processing equipment
05/23/2012CN102468207A 晶片支承板及晶片支承板的使用方法 The use of the wafer support plate and wafer support plate
05/23/2012CN102468206A 晶圆基座及其使用、清洗方法 And the base wafer using the cleaning method
05/23/2012CN102468205A Tray and wafer processing equipment with same
05/23/2012CN102468204A Board conveying hand and board conveying device provided with the same
05/23/2012CN102468203A 一种配置有可充气支撑件模块的前开式晶片盒 An arrangement with an inflatable support module front opening of the wafer cassette
05/23/2012CN102468202A 用于高温处理的托盘 The tray for heat treatment
05/23/2012CN102468201A 衬底接合设备及使用衬底接合设备的衬底接合方法 A substrate joining method and a substrate joining apparatus using a substrate bonding device
05/23/2012CN102468200A 加热处理装置 Heat treatment device
05/23/2012CN102468199A 一种检测掩膜版雾状缺陷的方法 A method for detecting defects in reticle haze
05/23/2012CN102468198A Detection method and system for etching residue and building method and system for spectral line model
05/23/2012CN102468197A Semiconductor device and method of forming flipchip interconnect structure
05/23/2012CN102468196A Discrete circuit component having copper block electrodes and method of fabrication
05/23/2012CN102468195A High-reliability semiconductor plastic packaging body and method for welding bonding wire of high-reliability semiconductor plastic packaging body
05/23/2012CN102468194A Semiconductor device packaging method and semiconductor device package
05/23/2012CN102468193A High-voltage packaged device
05/23/2012CN102468192A Method of manufacturing semiconductor device
05/23/2012CN102468191A 密封装置的基板交接机构及密封装置的基板交接方法 A substrate transfer method for a substrate transfer mechanism and the sealing means of the sealing device
05/23/2012CN102468190A Packaging mould and semiconductor packaging process using same
05/23/2012CN102468189A Semiconductor packages and methods of packaging semiconductor devices
05/23/2012CN102468188A 一种半导体蚀刻方法 A semiconductor etching method
05/23/2012CN102468187A Chip packaging structure and chip packaging method
05/23/2012CN102468186A Substrate manufacturing method and semiconductor chip packaging method
05/23/2012CN102468185A Die bond film, dicing die bond film, method of manufacturing die bond film, and semiconductor device having die bond film
05/23/2012CN102468184A 配线板的制造方法 The method of manufacturing a wiring board
05/23/2012CN102468183A 制造复合基板的方法 The method of manufacturing a composite substrate,
05/23/2012CN102468182A Method and device for increasing fin device density for unaligned fins
05/23/2012CN102468181A 具有埋入式结的垂直晶体管及其制造方法 The method of manufacturing a vertical transistor and buried junction,
05/23/2012CN102468180A 金属栅极晶体管、集成电路、系统及其制造方法 Metal gate transistors, integrated circuits, the system and method of manufacturing
05/23/2012CN102468179A semiconductor device and method thereof
05/23/2012CN102468178A 晶体管的制作方法 Production methods transistor
05/23/2012CN102468177A P-type doubled diffusion metal-oxide-semiconductor (DMOS) device and making method thereof
05/23/2012CN102468176A 超级结器件制造纵向区的方法 Super-junction device manufacturing method longitudinal zones
05/23/2012CN102468175A 晶体管的制作方法 Production methods transistor
05/23/2012CN102468174A 一种半导体器件及其形成方法 A semiconductor device and method of forming
05/23/2012CN102468173A 晶体管的制作方法 Production methods transistor
05/23/2012CN102468172A 半导体器件制造方法 The semiconductor device manufacturing method
05/23/2012CN102468171A 一种改善应力层应力作用的方法 One way to improve the stress level stress
05/23/2012CN102468170A 一种改善nfet性能的应力层的形成方法 A method of improving the performance of a method of forming a stress layer nfet
05/23/2012CN102468169A Umos晶体管及其形成方法 Umos transistor and method of forming
05/23/2012CN102468168A Mos晶体管的形成方法 Mos transistor forming method
05/23/2012CN102468167A Mos晶体管及其制作方法 Mos transistor and manufacturing method thereof
05/23/2012CN102468166A Transistor and manufacturing method thereof
05/23/2012CN102468165A Transistor and manufacture method thereof
05/23/2012CN102468164A Transistor and manufacture method thereof
05/23/2012CN102468163A Nmos晶体管的制造方法 Nmos transistor manufacturing method
05/23/2012CN102468162A Nmos晶体管的制作方法 Nmos transistor manufacturing method
05/23/2012CN102468161A 一种场效应晶体管的制备方法 Preparation method of a field effect transistor,
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