Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2012
05/23/2012CN101916751B Packaging structure and manufacture method thereof
05/23/2012CN101916719B Method for adjusting Schottky contact barrier height of metal and N-type germanium
05/23/2012CN101911252B Placing table apparatus, processing apparatus and temperature control method
05/23/2012CN101908495B System and method for implementing a virtual metrology advanced process control platform
05/23/2012CN101908486B Novel process for applying neutron transmutation doping transverse magnetic field czochralski silicon to high-power semiconductor device
05/23/2012CN101901832B Controlled silicon punchthrough structure formed by gallium diffusion and production method thereof
05/23/2012CN101901758B MOCVD growth method of non-polar m-surface GaN film based on m-surface SiC substrate
05/23/2012CN101901753B Method for preparing thick-film material with insulating embedded layer
05/23/2012CN101897013B An interconnect structure and a method of fabricating the same
05/23/2012CN101896985B Method for fabricating thin-film laminated capacitor
05/23/2012CN101894885B Automatic chip loading and unloading system and method for use in solar cell production process
05/23/2012CN101894851B Addressable gallium nitride-based LED display microarray and preparation method thereof
05/23/2012CN101894785B Diode pin clamping mold
05/23/2012CN101894772B Method for enhancing reliability of chip welding spot, printed circuit board and electronic device
05/23/2012CN101894766B Method for manufacturing solder lug
05/23/2012CN101882580B Strip with reduced low-K dielectric damage
05/23/2012CN101882564B Guide pin trimming device and module
05/23/2012CN101878521B Methods of etching trenches into silicon of a semiconductor subtrate, methods of forming trench isolation in silicon of a semiconductor substrate, and methods of forming a plurality of diodes
05/23/2012CN101877321B Apparatus, system and method of in-situ identification
05/23/2012CN101872800B Treatment method of semiconductor substrate
05/23/2012CN101872769B Ferroelectric dynamic random access memory based on atomic layer deposited isolating layer and preparation method
05/23/2012CN101868116B Circuit board and manufacturing method thereof
05/23/2012CN101866860B Preparation method of ZnO thin film field-effect transistor
05/23/2012CN101866837B Method for ion diffusion and semiconductor device formation
05/23/2012CN101866083B Micro mirror layer, liquid crystal on silicon (LCOS) display device and manufacturing method thereof
05/23/2012CN101865972B Detector
05/23/2012CN101859736B Semiconductor packaging semi-finished product and semiconductor packaging process
05/23/2012CN101853804B Method for manufacturing semiconductor device
05/23/2012CN101853780B Ion radiation damage prediction method, ion radiation damage simulator, ion radiation apparatus and ion radiation method
05/23/2012CN101849279B Exhaust unit, exhaust method using the exhaust unit, and substrate processing apparatus including the exhaust unit
05/23/2012CN101847636B Semiconductor device and manufacturing method thereof
05/23/2012CN101847583B Method for preparing spherical cadmium sulfide (CdS) semiconductor film
05/23/2012CN101842878B Semiconductor device and method for manufacturing the same
05/23/2012CN101840903B Packaging substrate and chip packaging structure
05/23/2012CN101840858B Method for removing anti-reflective coating in top-level metallic dielectric layer groove etching process
05/23/2012CN101840121B Array substrate and manufacturing method thereof
05/23/2012CN101828249B Method and system for forming an air gap structure
05/23/2012CN101826560B Metal-insulator-metal structure for system-on-chip technology
05/23/2012CN101826524B NOR type flash memory structure with highly doped drain region and manufacturing method thereof
05/23/2012CN101826487B Manufacturing method of flash memory component
05/23/2012CN101826481B Substrate supporting apparatus, substrate processing apparatus and substrate supporting method
05/23/2012CN101814503B Complementary grid-controlled PNPN field effect transistor and preparation method thereof
05/23/2012CN101807568B New multichip LED encapsulation structure and processing method thereof
05/23/2012CN101807525B Manufacturing method of semiconductor device and substrate processing device
05/23/2012CN101803023B Semiconductor device
05/23/2012CN101802982B Liquid treatment apparatus and liquid treatment method
05/23/2012CN101802976B Substrate placing mechanism, substrate processing apparatus, method for suppressing film deposition on substrate placing mechanism
05/23/2012CN101800166B Method for manufacturing liquid repellent retaining wall
05/23/2012CN101796645B Method for manufacturing semiconductor device and semiconductor device
05/23/2012CN101794717B Stacked integrated chips and methods of fabrication thereof
05/23/2012CN101790783B Stage apparatus
05/23/2012CN101783342B BGA (ball grid array) integrated resistor as well as manufacturing method and equipment thereof
05/23/2012CN101771020B Through-silicon via with scalloped sidewalls
05/23/2012CN101771018B Through-silicon via with air gap
05/23/2012CN101770966B Test structure of transistor in static random access memory
05/23/2012CN101767295B Chemical mechanical polishing composition and methods relating thereto
05/23/2012CN101764158B Body contacted hybrid surface semiconductor-on-insulator devices and methods
05/23/2012CN101764111B Axial type surface contact type glass packaging rectifier tube and manufacture method
05/23/2012CN101764101B BCD integration process
05/23/2012CN101764059B Dual-damascene structure forming method and groove forming method
05/23/2012CN101752336B 半导体装置及其制造方法 Semiconductor device and manufacturing method
05/23/2012CN101751013B Auxiliary distribution system and auxiliary distribution method for semiconductor manufacturing production
05/23/2012CN101750819B Array substrate for transflective liquid crystal display device and manufacturing method thereof
05/23/2012CN101743617B Evaporation apparatus
05/23/2012CN101740552B Multi-chip packaging structure and manufacturing method thereof
05/23/2012CN101740366B Method for eliminating aluminum tip cut of bipolar NPN transistor
05/23/2012CN101740351B Dicing die-bonding film and process for producing semiconductor device
05/23/2012CN101736375B Plating method
05/23/2012CN101728227B Method for picking model type crystal particle
05/23/2012CN101728224B Equipment and method for manufacturing semiconductor
05/23/2012CN101724877B Electroplating method
05/23/2012CN101722476B Chemically mechanical polishing and cleaning machine
05/23/2012CN101720508B Memory cell that employs a selectively grown reversible resistance-switching element and methods of forming the same
05/23/2012CN101711424B Plasma processing system ESC high voltage control
05/23/2012CN101692440B Mixed crystal orientation strain silicon substrate and method for preparing same
05/23/2012CN101692422B Display panel and reworking method of gate insulation layer of thin film transistor
05/23/2012CN101689582B Thin-film solar cell manufacturing system and common substrate storage rack
05/23/2012CN101689479B Semiconductor device and its manufacturing method
05/23/2012CN101683000B Method of bonding core wires to electrodes and electronic unit formed by bonding electrodes and core wires
05/23/2012CN101681882B Thin film capacitor, and display and memory cell employing the film capacitor, and mehtods for fabricating the thin film capacitor, the display and the memory cell
05/23/2012CN101681866B Wafer chucking apparatus for plasma process
05/23/2012CN101681823B Method for grinding semiconductor wafer, and resin composition and protective sheet used for the method
05/23/2012CN101680930B Plunger for holding and moving electronic components in particular ic's with a heat conducting body
05/23/2012CN101669195B Polishing pad manufacturing method
05/23/2012CN101667561B Silicon-based vapor-liquid phase separating heat radiation chip and preparation method thereof
05/23/2012CN101651132B Defect test structure of semiconductor device, defect test method and defect test structure of before-metal medium layer
05/23/2012CN101647103B Vacuum processing apparatus
05/23/2012CN101647089B Method of coating application
05/23/2012CN101643149B Conveyor with heating function
05/23/2012CN101641777B Semiconductor device and bias generating circuit
05/23/2012CN101640210B Solid-state imaging device, method for manufacturing solid-state imaging device, and imaging apparatus
05/23/2012CN101633441B Substrate processing system and substrate carrying device thereof
05/23/2012CN101630659B Method for forming CMOS image sensor by using tri-gate process and structure of CMOS image sensor using tri-gate process
05/23/2012CN101617121B Electric compressor with integral inverter
05/23/2012CN101617069B Systems and methods for processing a film, and thin films
05/23/2012CN101611659B Circuit connecting adhesive film, connecting structure and method for manufacturing the connecting structure
05/23/2012CN101609867B Nitride semiconductor light-emitting diode and method of manufacturing the same
05/23/2012CN101606238B Method and apparatus for applying liquid material
05/23/2012CN101604627B Laser irradiation method and method for manufacturing semiconductor device using the same
05/23/2012CN101599471B Cooling structure of power device and manufacturing method thereof
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