Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2012
05/16/2012CN102460653A 成膜方法、前处理装置和处理系统 Film-forming method, the pretreatment device and processing system
05/16/2012CN102460652A Diffused junction termination structures for silicon carbide devices and methods of fabricating silicon carbide devices incorporating same
05/16/2012CN102460651A 移除基板与静电卡钳之间的电荷 Removing the substrate and the electrostatic charge between the caliper
05/16/2012CN102460650A Vacuum heating/cooling apparatus and method of producing magnetoresistive element
05/16/2012CN102460649A 经阳极处理的喷头 Sprinklers anodized
05/16/2012CN102460648A Roll-to-roll chemical vapor deposition system
05/16/2012CN102460647A 连续进给化学气相淀积系统 Continuous feeding chemical vapor deposition system
05/16/2012CN102460646A Method of providing flexible semiconductor device at high temperatures and flexible semiconductor device thereof
05/16/2012CN102460645A Half tone mask and manufacturing method of the same
05/16/2012CN102460644A Resin composition for nanoimprint, and method for forming structure
05/16/2012CN102460643A Substrate coating apparatus
05/16/2012CN102460642A 半导体衬底的再加工方法及soi衬底的制造方法 Reprocessing a semiconductor substrate and manufacturing method soi substrate
05/16/2012CN102460641A 用于改进颗粒间接触部位和填充半导体金属氧化物颗粒层中的间隙的热不稳定性前体化合物 For improving inter-particle contact area and thermal filler particles of the metal oxide layer in a semiconductor gap instability precursor compound
05/16/2012CN102460640A Fluid processing systems and methods
05/16/2012CN102460639A Thin-film led with p and n contacts electrically isolated from the substrate
05/16/2012CN102460638A 通过无定形碳(少量添加硅)的含氧掺杂改善氟碳化合物(CFx)膜的粘附性的技术 Improved fluorocarbon (CFx) film adhesion technique by amorphous carbon (a small amount of addition of silicon) doped with oxygen-containing
05/16/2012CN102460601A 亚临界剪切致稀的基于Ⅳ族的纳米颗粒流体 Subcritical shear thinning Ⅳ clan-based nanoparticle fluid
05/16/2012CN102460586A 半导体器件 Semiconductor devices
05/16/2012CN102460309A Alignment method, alignment device, and exposure device
05/16/2012CN102460206A Radar sensor with interference signal compensation
05/16/2012CN102460140A Integrated optoelectrochemical sensor for nitrogen oxides in gaseous samples
05/16/2012CN102460126A 使用非均匀光激发的材料或器件特征 Using non-uniform light excitation material or device features
05/16/2012CN102459717A Method and apparatus for electroplating
05/16/2012CN102459704A 用于蚀刻的方法和设备 Methods and apparatus for etching
05/16/2012CN102459693A 使用有机硅前体的pecvd涂层 Use pecvd coating organosilicon precursors
05/16/2012CN102459668A Copper alloy bonding wire for semiconductor
05/16/2012CN102459423A Product of polysiloxane condensation
05/16/2012CN102459415A Triazine ring-containing polymer and film-forming composition comprising same
05/16/2012CN102459122A 氧化物烧结体、其制造方法以及氧化物烧结体制造用原料粉末 The oxide sintered body, its manufacturing method, and an oxide raw material powder for producing a sintered body
05/16/2012CN102459092A Method for supplying hydroxyl radical-containing water and apparatus for supplying hydroxyl radical-containing water
05/16/2012CN102458800A Mold for imprinting, and method for manufacturing same
05/16/2012CN102458042A 线路基板制程、线路基板及半导体制程 Circuit board manufacturing process, circuit board and semiconductor manufacturing process
05/16/2012CN102457660A Assembling method of camera module
05/16/2012CN102456832A Phase change memory cell and forming method thereof
05/16/2012CN102456750A 用于提高电容器容量和兼容性的方法和装置 Method and apparatus to improve the capacity of the capacitor, and compatibility for
05/16/2012CN102456749A Mim电容结构及其制作方法 Mim capacitor structure and method of making
05/16/2012CN102456748A 一种肖特基二极管及其制造方法 One kind of the Schottky diode and its manufacturing method
05/16/2012CN102456746A 非挥发性半导体存储单元、器件及制备方法 Non-volatile semiconductor memory cell, the device and method of preparation
05/16/2012CN102456745A Flash memory as well as preparation method and operation method thereof
05/16/2012CN102456743A 薄膜晶体管及其制造方法 A thin film transistor and manufacturing method thereof
05/16/2012CN102456742A 半导体器件以及制造半导体器件的方法 A semiconductor device and a method of manufacturing a semiconductor device
05/16/2012CN102456740A P型场效应晶体管的应变结构 Strain P-type field effect transistor structure
05/16/2012CN102456739A Semiconductor structure and forming method thereof
05/16/2012CN102456737A 半导体结构及其制造方法 Semiconductor structure and manufacturing method
05/16/2012CN102456736A 一种沟槽式场效应管及其制备方法 One kind of trench FET and its preparation method
05/16/2012CN102456735A Semiconductor apparatus and manufacturing method for same
05/16/2012CN102456734A 半导体结构及其制作方法 The semiconductor structure and method of making
05/16/2012CN102456733A 晶体管及其制作方法 Transistor and its manufacturing method
05/16/2012CN102456732A Mos晶体管及其制造方法、cmos图像传感器 Mos transistor and its manufacturing method, cmos image sensor
05/16/2012CN102456731A 半导体结构及其制造方法 Semiconductor structure and manufacturing method
05/16/2012CN102456730A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/16/2012CN102456729A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/16/2012CN102456727A 低集电极/基极电容SiGe异质结双极晶体管结构及制造方法 Low collector / base capacitance SiGe heterojunction bipolar transistor structure and method of manufacture
05/16/2012CN102456726A 锗硅异质结双极晶体管 SiGe heterojunction bipolar transistor
05/16/2012CN102456725A 一种单晶高k栅介质材料及其制备方法 Single crystal high-k gate dielectric material and method
05/16/2012CN102456724A Grid structure and manufacturing method thereof
05/16/2012CN102456723A 半导体结构及其制造方法 Semiconductor structure and manufacturing method
05/16/2012CN102456722A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
05/16/2012CN102456721A 陶瓷衬底的氮化镓基芯片及制造方法 GaN-based chip and method of manufacturing the ceramic substrate
05/16/2012CN102456718A 绝缘栅双极晶体管器件用于提升器件性能的新型上部结构 New upper structure of the IGBT device performance of devices for lifting
05/16/2012CN102456717A 半导体器件和用于制造半导体器件的方法 A semiconductor device and a method for manufacturing a semiconductor device
05/16/2012CN102456715A 一种半导体器件结构及其制作方法 A semiconductor device structure and fabrication method thereof
05/16/2012CN102456713A 有机发光显示装置及其制造方法 The organic light emitting display device and manufacturing method thereof
05/16/2012CN102456709A OLED display and method of fabricating the same
05/16/2012CN102456706A Display apparatus and method of manufacturing the same
05/16/2012CN102456703A Organic light-emitting display equipment and manufacturing method thereof
05/16/2012CN102456696A Display device and method for manufacturing the same
05/16/2012CN102456692A 异质结1t-dram单元结构及其制备方法 Heterojunction 1t-dram cell structure and its preparation method
05/16/2012CN102456691A 半导体装置和半导体装置制造方法 Semiconductor device and manufacturing method of a semiconductor device
05/16/2012CN102456690A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/16/2012CN102456689A 一种衬底结构、半导体器件及其制造方法 A substrate structure, a semiconductor device and manufacturing method thereof
05/16/2012CN102456688A 具有不同器件外延层的集成电路技术 Integrated circuit technology has a different device epitaxial layer
05/16/2012CN102456679A High-efficiency power converters with integrated capacitors
05/16/2012CN102456677A Packaging structure for ball grid array and manufacturing method for same
05/16/2012CN102456674A Chip stacking structure and method
05/16/2012CN102456672A 提高dmos/ldmos器件esd性能的结构和方法 Improve dmos / structures and methods ldmos esd performance devices
05/16/2012CN102456669A Chip-grade electromagnetic interference shielding structure and manufacturing method thereof
05/16/2012CN102456666A 数字坐标轴及栅氧化膜可靠性测试方法 Digital axes and gate oxide film reliability test methods
05/16/2012CN102456665A 用于金属-氧化物-金属电容器的保护结构 For metal - oxide - metal capacitor protective structure
05/16/2012CN102456664A Centripetal layout for low stress chip package
05/16/2012CN102456663A Semiconductor devices and methods of fabricating the same
05/16/2012CN102456662A 高电压电阻器 High voltage resistors
05/16/2012CN102456661A 具有重布线路层的芯片结构及其制法 Jiqizhifa chip structure has heavy layers of cloth line
05/16/2012CN102456660A Stacked semiconductor package, semiconductor device including the stacked semiconductor package and method of manufacturing the stacked semiconductor package
05/16/2012CN102456659A Semiconductor chip having different pad width to ubm width ratios and method of manufacturing the same
05/16/2012CN102456658A Semiconductor package and method of forming the same
05/16/2012CN102456657A Semiconductor device having under-bump metallization (ubm) structure and method of forming the same
05/16/2012CN102456654A Substrateless power device packages
05/16/2012CN102456653A Under-bump metallization (ubm) structure and method of forming the same
05/16/2012CN102456651A Copper pillar bump with cobalt-containing sidewall protection
05/16/2012CN102456650A Conductive feature for semiconductor substrate and method of manufacture
05/16/2012CN102456649A Package substrate and fabrication method thereof
05/16/2012CN102456648A Packaging substrate and method of fabricating the same
05/16/2012CN102456647A Conductive pillar structure
05/16/2012CN102456646A Substrate structure having buried wiring and method for manufacturing the same
05/16/2012CN102456645A Thermal management system and method
05/16/2012CN102456639A Electronic apparatus, method of making the same, and transceiving device
05/16/2012CN102456636A Package of embedded chip and manufacturing method thereof
05/16/2012CN102456634A Submount and manufacturing method thereof
05/16/2012CN102456630A Method for preparing multi-component brazing filler metal coatings of microelectronic device salient points
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