Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2012
05/30/2012CN102479700A 双重图形化方法、形成互连结构的方法 Double patterning method, a method of forming an interconnect structure
05/30/2012CN102479699A 超级结半导体器件结构的制作方法 Super junction structure of a semiconductor device manufacturing method
05/30/2012CN102479698A Compositions and methods for texturing of silicon wafers
05/30/2012CN102479697A 光器件晶片的加工方法 The optical device wafer processing method
05/30/2012CN102479696A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/30/2012CN102479695A 提高金属栅化学机械平坦化工艺均匀性的方法 Improved uniformity of planarization process a metal gate chemical mechanical
05/30/2012CN102479694A Formation method of metal gate and MOS transistor
05/30/2012CN102479693A 形成栅极的方法 Forming a gate way
05/30/2012CN102479692A 形成栅极的方法 Forming a gate way
05/30/2012CN102479691A 金属栅极及mos晶体管的形成方法 The method of forming a metal gate, and mos transistor
05/30/2012CN102479690A 提高晶圆上源漏极退火时工作电流均匀性的方法 Increase when annealed wafers on the source-drain current uniformity of approach to work
05/30/2012CN102479689A System and method for processing substrate
05/30/2012CN102479688A 晶圆表面光阻去边的方法 Method to the side of the wafer surface resist
05/30/2012CN102479687A 提高后层曝光工艺宽容度的方法 Methods to improve the layer after exposure process latitude
05/30/2012CN102479686A Method of processing a substrate
05/30/2012CN102479685A 集成电感器及制造集成电感器的方法 Integrated inductor and a method of manufacturing an integrated inductor
05/30/2012CN102479684A Thin film resistors and methods of manufacture
05/30/2012CN102479683A 通过高热膨胀系数(cte)层降低晶圆变形 By the coefficient of thermal expansion (cte) layer to reduce deformation of the wafer
05/30/2012CN102479682A Method of lift off and manufacturing method of TFT array substrate
05/30/2012CN102479681A 半导体制造工艺中芯片回流的方法 A semiconductor chip manufacturing process refluxing
05/30/2012CN102479680A 半导体器件的制造方法 The method of manufacturing a semiconductor device
05/30/2012CN102479679A 硅外延片背面硅渣的处理方法 Silicon wafer backside processing methods silicon slag
05/30/2012CN102479678A 芯片薄膜的生成方法及生成芯片薄膜的载体 Vector generation method and generation chip film chip film
05/30/2012CN102479677A Semiconductor device and manufacture method thereof
05/30/2012CN102479676A 深沟槽刻蚀方法 Deep trench etching
05/30/2012CN102479675A 单晶片加工方法及单晶片 Single wafer processing method and single chip
05/30/2012CN102479674A 一种晶圆制造方法 One kind of wafer manufacturing method
05/30/2012CN102479673A 硅化钛阻挡层的制作方法 The method of making the titanium silicide barrier layer
05/30/2012CN102479672A 形成氮氧化硅层的方法 The method of forming a silicon oxynitride layer,
05/30/2012CN102479671A 基板处理装置和基板处理方法 The substrate processing apparatus and a substrate processing method
05/30/2012CN102479670A 一种半导体装置及使用方法 A semiconductor device and method of use
05/30/2012CN102479669A 晶片毛刷清洗装置及晶片毛刷清洗方法 Device and chip wafers brush cleaning brush cleaning method
05/30/2012CN102479279A Method for metal correlated via split for double patterning
05/30/2012CN102478842A Measurement process optimization method and device
05/30/2012CN102478764A 双重图形化方法 Double patterning method
05/30/2012CN102478763A 光刻方法 Photolithographic method
05/30/2012CN102478762A 光刻方法 Photolithographic method
05/30/2012CN102478737A Liquid crystal display device and method for manufacturing the same
05/30/2012CN102478347A 一种风刀及具有所述风刀的硅片上料装置 An air knife and wafers having the wind knife on feeding device
05/30/2012CN102477585A 电浆蚀刻设备、晶圆治具及设置晶圆的方法 Plasma etching equipment, wafer fixture and method for setting the wafer
05/30/2012CN102477583A 一种对晶硅薄膜掺杂制备超浅结的方法 A crystalline silicon thin films for ultra-shallow junction doping method
05/30/2012CN102477578A 图案化金属层的方法以及利用其的半导体器件制造方法 A patterned metal layer and a method of manufacturing a semiconductor device using the method thereof
05/30/2012CN102477359A 一种化学机械抛光清洗液 A chemical mechanical polishing cleaning fluid
05/30/2012CN102476089A 芯片焊接机用点胶装置 Chip welding machine dispensing device
05/30/2012CN102168314B Internal gettering process of Czochralski silicon wafer
05/30/2012CN102157518B Novel double-surge protection device with single-chip integration and manufacturing method thereof
05/30/2012CN102157372B Plasma processing apparatus and method
05/30/2012CN102157354B Method for preparing polymer-sylvine composite material with high dielectric constant
05/30/2012CN102154690B Method and device for forming tray in planetary epitaxial growth equipment
05/30/2012CN102148179B Using method of bonding film
05/30/2012CN102142391B Crystal taking manipulator of solid crystal processing machine
05/30/2012CN102142359B Outer gettering method for silicon wafer
05/30/2012CN102136418B Method for grid etching
05/30/2012CN102110624B Method for detecting nickel and platinum removing device
05/30/2012CN102110586B Method for monitoring silicon damage in semiconductor substrate
05/30/2012CN102104048B MOS (Metal Oxide Semiconductor) type ESD (Electro-Static Discharge) protection structure for silicon on insulator technology and manufacturing method thereof
05/30/2012CN102082105B Thermal wind sensor based on anodic bonding technology and preparation method thereof
05/30/2012CN102081300B Photoetching method of round-hole pattern
05/30/2012CN102054816B Fusing method for fuse wire
05/30/2012CN102054721B Method and device for detecting coating condition of semiconductor wafer surface coating
05/30/2012CN102054698B Method for improving threshold voltage of semiconductor device
05/30/2012CN102054685B Passivation layer dry etching method
05/30/2012CN102054679B Method for etching interpoly dielectric
05/30/2012CN102041547B Method for preparing phosphor-doped zinc oxide nanowires
05/30/2012CN102034816B Plasma induced damage test device and method for producing test device
05/30/2012CN102034807B Method and device for protecting grid electrode
05/30/2012CN102034724B Method for determining dielectric constant value of fluoride silicon glass in actual process
05/30/2012CN102031524B Aluminium etching method
05/30/2012CN102029572B Control method of CMP (chemical mechanical polishing) time
05/30/2012CN102024731B Slice-bearing table device with internal hoistable support column
05/30/2012CN102020783B Selection method of fillers for advanced encapsulating material
05/30/2012CN102005375B Method for constructing floating gate
05/30/2012CN102005362B Calibration system and calibration method for dual-Faraday cup measuring ratios of ion implantation machine
05/30/2012CN102001044B System for supplying grinding fluid by chemically mechanical polishing (CMP)
05/30/2012CN101996910B Method for detecting testing structure of semiconductor device
05/30/2012CN101995774B Method for monitoring performance of DMR
05/30/2012CN101976647B Method for controlling thickness of silica in crystalline silicon solar cell
05/30/2012CN101971296B Post-deposition cleaning methods and formulations for substrates with cap layers
05/30/2012CN101971295B Methods of configuring a proximity head that provides uniform fluid flow relative to a wafer
05/30/2012CN101965244B Method of manufacturing a heat exchanger
05/30/2012CN101963723B TFT-LCD (Thin Film Transistor Liquid Crystal Display) array substrate and manufacturing method thereof
05/30/2012CN101958268B Method for producing isolating structure
05/30/2012CN101958265B Sheet heating and conveying device
05/30/2012CN101952963B Semiconductor constructions, and methods of forming semiconductor constructions
05/30/2012CN101931002B Reverse blocking diode thyristor
05/30/2012CN101929846B Method for scanning wafer surface image
05/30/2012CN101929560B Two-way valve and semiconductor processing system applying industrial gas
05/30/2012CN101927977B Fabrication method of cmos microelectromechanical system (mems) device
05/30/2012CN101924139B Strain channel field-effect transistor and preparation method thereof
05/30/2012CN101916728B Manufacture technology of superstructure LDMOS structure on SOI capable of completely eliminating substrate-assisted depletion effect
05/30/2012CN101911271B Electronic component
05/30/2012CN101911261B Cyclic nucleation process
05/30/2012CN101906274B Adhesive, method of connecting wiring terminals and wiring structure
05/30/2012CN101905388B Method for manufacturing semiconductor device
05/30/2012CN101903985B Materials for particle removal by single-phase and two-phase media
05/30/2012CN101901784B Surface cleaning method in chemical-mechanical polishing process of tantalum
05/30/2012CN101901783B Method for cleaning chip surface after polishing aluminum wire in super large scale integrated circuit
05/30/2012CN101899706B Method for preparing nonpolar GaN-based dilute magnetic semiconductor material by adopting MOCVD
05/30/2012CN101896995B Thermal reactor with improved gas flow distribution
05/30/2012CN101882608B Bump pad structure and method for manufacturing the same
1 ... 999 1000 1001 1002 1003 1004 1005 1006 1007 1008 1009 1010 1011 1012 1013 1014 1015 1016 1017 1018 1019 ... 6590