Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2012
05/17/2012US20120118505 Plasma processing apparatus and cooling device for plasma processing apparatus
05/17/2012US20120118477 Stacking apparatus and method for stacking integrated circuit elements
05/17/2012US20120118375 Semiconductor electrode, solar cell in which semiconductor electrode is used and semiconductor electrode manufacturing method
05/17/2012US20120118346 Thermoelectric Apparatus and Method of Fabricating the Same
05/17/2012US20120118225 Epitaxial growth temperature control in led manufacture
05/17/2012US20120118068 Semiconductor Pressure Sensor, Pressure Sensor Apparatus, Electronic Equipment, and Method of Manufacturing Semiconductor Pressure Sensor
05/16/2012EP2453481A2 Amorphous oxide and field effect transistor
05/16/2012EP2453480A2 Amorphous oxide and field effect transistor
05/16/2012EP2453475A1 Anti-fuse element
05/16/2012EP2453474A1 Semiconductor device packaging method and semiconductor device package
05/16/2012EP2453473A1 Substrate-storing container
05/16/2012EP2453472A1 Pallet For High Temperature Processing
05/16/2012EP2453471A2 Method for electrodeposition of an elctrode on a dielectric substrate
05/16/2012EP2453470A1 Method for forming a multi-layer structure
05/16/2012EP2453469A1 Film for semiconductor and semiconductor device manufacturing method
05/16/2012EP2453468A1 Film for semiconductor and semiconductor device manufacturing method
05/16/2012EP2453467A1 Film for semiconductor and semiconductor device manufacturing method
05/16/2012EP2453466A1 Vacuum processing apparatus
05/16/2012EP2453465A2 Exposure method, exposure apparatus, and method for producing a device
05/16/2012EP2453464A1 Euv-lithography reflection-type mask blank
05/16/2012EP2453310A2 System for purging reticle storage
05/16/2012EP2452964A1 Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these
05/16/2012EP2452362A1 Method for manufacturing semiconductor device
05/16/2012EP2452359A1 Method for producing an integrated circuit and resulting foil chip
05/16/2012EP2452358A1 Damaged substrate handling apparatus and method for substrate processing systems
05/16/2012EP2452357A1 Aluminum porous media
05/16/2012EP2452356A2 Method and device for treating substrates
05/16/2012EP2451613A1 Dispersion comprising cerium oxide and silicon dioxide
05/16/2012EP2254164B1 Compound semiconductor light-emitting element and illumination device using the same, and method for manufacturing compound semiconductor light-emitting element
05/16/2012EP2215203B1 High negative zeta potential polyhedral silsesquioxane composition and method for damage free semiconductor wet clean
05/16/2012EP1935024B1 A method for fabricating a high performance pin focal plane structure using three handle wafers
05/16/2012EP1774579B1 Method for producing a multilayer structure comprising a separating layer
05/16/2012DE112009002638T5 Strukturmessgerät und Strukturmessverfahren Structure gauge and structure measurement method
05/16/2012DE112009000924T9 Oberflächenaufrauungsverfahren für ein Substrat und Herstellungsverfahren für eine Fotovoltaische Vorrichtung Surface roughening a substrate and manufacturing method of a photovoltaic device
05/16/2012DE10393870B4 Verfahren zum Reduzieren von Kontaktdefekten in Halbleiterzellen A method for reducing defects in contact semiconductor cells
05/16/2012DE10236239B4 Koordinaten-Messtisch Coordinate measuring table
05/16/2012DE102011117903A1 Verbund aus hohlem polymerem Material und Silikat Composite of hollow polymeric material and silicate
05/16/2012DE102011086304A1 Verbundsubstrat und verfahren zur herstellung eines verbundsubstrats Composite substrate and method of manufacturing a composite substrate
05/16/2012DE102011084603A1 Dreidimensionales Halbleiterbauelement Three-dimensional semiconductor device
05/16/2012DE102011055255A1 Arrangement i.e. turning device, for transporting and turning wafers to manufacture e.g. solar cell, has detour elements arranged at preset distance from shafts, where one shaft is connected with drive arranged outside device
05/16/2012DE102011055224A1 Verfahren zum Herstellen eines Halbleiterchips und ein Halbleiterchip A method of manufacturing a semiconductor chip and a semiconductor chip
05/16/2012DE102010063392A1 Mikroskop mit Sensorbildschirm Microscope with touch screen
05/16/2012DE102010060517A1 Method for handling flat object e.g. semiconductor wafer, involves fixing object placed in receiving unit by negative pressure while rotating receiving unit
05/16/2012DE102010044014A1 Crystallization process for forming semiconductor material-containing crystalline layer for absorber layer of silicon solar cell, involves coating amorphous coating on substrate, depositing metallic solvent on amorphous layer and heating
05/16/2012DE102010043811A1 Gel passivated electrical component, has passivation layer comprising components, which are selected from groups comprising silver-and/or copper salts, and another passivation layer comprising organic connection with multiple bonds
05/16/2012DE102009046261B4 Verfahren zur Herstellung von Transistoren mit Metallgateelektrodenstrukturen mit großem ε, die vor den Drain/Source-Gebieten auf der Grundlage eines Opferkohlenstoffabstandshalters hergestellt werden A process for the fabrication of transistors with metal gate electrode structures with large ε, which are manufactured before the drain / source regions on the basis of a sacrificial carbon spacer
05/16/2012DE102006062831B9 Verfahren zum Herstellen eines Drain-Extended-MOS-Feldeffekttransistors und Drain-Extended-MOS-Feldeffekttransistor sowie elektronische Bauelement-Anordnung parallel geschalteter Drain-Extended-MOS-Feldeffekttransistoren A method for producing a drain-extended MOS field effect transistor and the drain-extended MOS field effect transistor as well as electronic component arrangement of parallel-connected drain-extended MOS field-effect transistors
05/16/2012CN202221754U Laminated type graphite boat used for post-processing of CdTe polycrystalline film
05/16/2012CN202221753U Adjustable thimble seat used for chip mounter
05/16/2012CN202221752U Extended electrode and plasma inclined plane etching device having the same
05/16/2012CN202221303U Scanning working platform structure
05/16/2012CN202221232U Cantilever quartz furnace
05/16/2012CN202219569U Vacuumizing device for plastic packaging molds
05/16/2012CN202219366U Apparatus for producing large power tube chips
05/16/2012CN1865386B Buffing slurry
05/16/2012CN1849378B Chemical-mechanical polishing composition and method for using the same
05/16/2012CN1802755B LED fabrication via ion implant isolation
05/16/2012CN1744277B Method for forming holes in semiconcuctor crystal round piece
05/16/2012CN1607873B Electroluminescent display unit and electronic device
05/16/2012CN1599960B Strain balanced nitride heterojunction transistors and methods of fabricating strain balanced nitride heterojunction transistors
05/16/2012CN1545142B Integrated circuit power supply network transient analytical solving method based on multi-layer equivalent circuit model
05/16/2012CN1540762B Flash memory possessing groove type selection grid and manufacturing method
05/16/2012CN102461349A 电极连接方法、电极连接结构、用于电极连接的导电粘合剂、以及电子装置 Electrode connection method, the electrode connection structure, electrically connected to the conductive adhesive, and an electronic device for
05/16/2012CN102460713A Method for manufacturing semiconductor device
05/16/2012CN102460712A 薄膜晶体管以及薄膜晶体管的制造方法 The method of manufacturing a thin film transistor and the thin film transistor
05/16/2012CN102460711A 半导体装置 Semiconductor device
05/16/2012CN102460710A 高电压Ⅲ族氮化物半导体器件 High voltage Ⅲ nitride semiconductor device
05/16/2012CN102460697A High speed low power magnetic devices based on current induced spin-momentum transfer
05/16/2012CN102460686A Semiconductor device, mounted substrate to be used in semiconductor device, and manufacturing method of mounted substrate
05/16/2012CN102460684A Encapsulated phase change cell structures and methods
05/16/2012CN102460683A 包含金属栅极与形成于绝缘结构上的含硅电阻器的半导体装置 A metal gate semiconductor device comprising a resistor formed in silicon on insulator structure of
05/16/2012CN102460682A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/16/2012CN102460681A 稳定栅极介电层前藉由扩散栅极介电覆盖层调整复杂晶体管的阈值电压 Former stable gate dielectric layer by diffusion gate dielectric capping layer to adjust the threshold voltage of the transistor complex
05/16/2012CN102460680A 电子装置 Electronic devices
05/16/2012CN102460679A 硼膜界面工程 Boron film interface engineering
05/16/2012CN102460678A Wafer manufacturing cleaning apparatus, process and method of use
05/16/2012CN102460677A Improved apparatus for temporary wafer bonding and debonding
05/16/2012CN102460676A 搬运模块 Handling module
05/16/2012CN102460675A 与基片容器存储系统交接的集成系统 Integrated system and the substrate container storage system handover
05/16/2012CN102460674A 基板传输装置 Substrate transfer device
05/16/2012CN102460673A 具有无限驱动介质的搬送系统及其中的物品的交接方法 Transport system and handover method in an article having a medium Infinity Drive
05/16/2012CN102460672A 用于直接地测量在晶片上的高高宽比蚀刻部件的深度的系统 The system for directly measuring the depth of the wafer etching high aspect ratio member
05/16/2012CN102460671A 自对准局部互连工艺中对于栅极的选择性局部互连 Self-aligned local interconnect local interconnection process for selective gate
05/16/2012CN102460670A Semiconductor device, method for manufacturing semiconductor device, and circuit device using semiconductor device
05/16/2012CN102460669A Insulating resin film, bonded body using insulating resin film, and method for manufacturing bonded body
05/16/2012CN102460668A Semiconductor chip and structure for mounting same
05/16/2012CN102460667A Method of producing electronic component mounting structure, and electronic component mounting structure
05/16/2012CN102460666A Method of producing electronic module, and electronic module
05/16/2012CN102460665A Ge-Sb-Te膜的成膜方法和存储介质 Film-forming method and the storage medium Ge-Sb-Te film
05/16/2012CN102460664A 电子器件用外延衬底及其制造方法 An epitaxial substrate for electronic devices and manufacturing method
05/16/2012CN102460663A 用于处理半导体晶片的方法 The method for processing a semiconductor wafer
05/16/2012CN102460662A 用于处理半导体晶片的方法 The method for processing a semiconductor wafer
05/16/2012CN102460661A 具有引发应力的源极/漏极形成用间隔件的鳍式场效晶体管结构及用以制造该鳍式场效晶体管结构的方法 Source having induced stress / drain forming method fin field-effect transistor structure and for the manufacture of the spacer fin field effect transistor structure
05/16/2012CN102460660A 半导体装置的制造方法 The method of manufacturing a semiconductor device
05/16/2012CN102460659A 具有改善的局部匹配与端末电阻的rx基电阻器的半导体装置 The semiconductor device substrate resistor rx partial match with improved resistance Duanmo
05/16/2012CN102460658A 硅晶片及硅晶片的热处理方法 Heat treatment process for a silicon wafer and the silicon wafer
05/16/2012CN102460657A Porous lift-off layer for selective removal of deposited films
05/16/2012CN102460656A Method for manufacturing semiconductor device, printed circuit board, and method for manufacturing the printed circuit board
05/16/2012CN102460655A Wafer processing sheet
05/16/2012CN102460654A 细长太阳能电池和边缘接触 An elongate solar cells and edge contact
1 ... 1017 1018 1019 1020 1021 1022 1023 1024 1025 1026 1027 1028 1029 1030 1031 1032 1033 1034 1035 1036 1037 ... 6590