Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2012
05/23/2012CN102468160A 利用应力记忆技术提高nfet窄沟道效应的方法 The use of technology to improve stress memorization method nfet narrow channel effect
05/23/2012CN102468159A Substrate processing apparatus and method of manufacturing a semiconductor device
05/23/2012CN102468158A 衬底处理设备和制造半导体器件的方法 A substrate processing apparatus and a method for manufacturing a semiconductor device
05/23/2012CN102468157A 一种高k栅介质的刻蚀方法 Etching a high-k gate dielectric
05/23/2012CN102468156A Verfahren zum herstellen eines halbleiterchips und ein halbleiterchip
05/23/2012CN102468155A 等离子体处理装置 The plasma processing apparatus
05/23/2012CN102468154A 基板处理方法 The substrate processing method
05/23/2012CN102468153A Manufacturing method of semiconductor device
05/23/2012CN102468152A 栅介质层和晶体管的制作方法 Gate dielectric layer and method of making the transistor
05/23/2012CN102468151A 金属栅电极的制作方法 The method of making a metal gate electrode,
05/23/2012CN102468150A 半导体器件的形成方法 The method for forming a semiconductor device
05/23/2012CN102468149A 金属栅电极的制作方法 The method of making a metal gate electrode,
05/23/2012CN102468148A Production method for dual gates
05/23/2012CN102468147A 一种半导体器件的栅极形成方法 The method for forming the gate electrode of a semiconductor device
05/23/2012CN102468146A 金属栅极的形成方法 Forming a metal gate
05/23/2012CN102468145A 金属栅极的形成方法 Forming a metal gate
05/23/2012CN102468144A 一种提高通孔中钛和氮化钛填充能力的方法 Method for improving the through-hole filling ability of titanium and titanium nitride Method
05/23/2012CN102468143A Plasma doping method and apparatus thereof
05/23/2012CN102468142A 一种外延片的形成方法及外延片 An epitaxial sheet forming method and epitaxial wafers
05/23/2012CN102468141A Vaporizing polymer spray deposition system
05/23/2012CN102468140A 压合装置及其压合方法 Apparatus and method of lamination nip
05/23/2012CN102468139A 制造半导体装置的方法 The method of manufacturing a semiconductor device
05/23/2012CN102468138A 基板处理方法、程序、计算机存储介质和基板处理装置 Substrate processing method, program, computer storage media and substrate processing apparatus
05/23/2012CN102468137A 制造半导体器件的方法 The method of manufacturing a semiconductor device
05/23/2012CN102468136A 双重图形化方法 Double patterning method
05/23/2012CN102468135A 一种芯片平坦化工艺方法 A chip process for planarization
05/23/2012CN102468134A 利用冗余图形填充来调整芯片图形密度的方法 The use of redundant graphics chip pattern density padding to adjust the way
05/23/2012CN102468133A 一种具有沟槽的半导体结构的形成方法 A method of forming a semiconductor structure having a trench
05/23/2012CN102468132A 一种半导体器件的制作方法及器件结构 Method of manufacturing a semiconductor device, and the device structure
05/23/2012CN102468131A 高k栅介质/金属栅叠层栅结构刻蚀后聚合物去除方法 High-k gate dielectric / metal gate stack gate structure after etch polymer removal method
05/23/2012CN102468130A Wet chemical cleaning method
05/23/2012CN102468129A 用于半导体制备中的表面平坦化的方法 Preparation of a semiconductor surface planarization method for
05/23/2012CN102468128A 深沟槽多晶硅形成方法 The method for forming a deep trench polysilicon
05/23/2012CN102468127A 一种双多晶电容工艺中清洗晶圆的方法 A double-crystal capacitive multi-process wafer cleaning method
05/23/2012CN102468126A 圆片清洗方法 Wafer cleaning method
05/23/2012CN102468125A 一种晶片的清洗方法 A wafer cleaning method
05/23/2012CN102468124A 一种利用Al插入层外延生长NiSiGe材料的方法 A method for inserting NiSiGe material layer is epitaxially grown using Al
05/23/2012CN102468123A 一种利用NiAl合金外延生长NiSiGe材料的方法 A use of NiAl alloy material epitaxial growth method NiSiGe
05/23/2012CN102468122A 半导体器件失效分析样品制作方法及分析方法 The semiconductor device failure analysis sample preparation method and analysis method
05/23/2012CN102468121A 一种鳍片的制备方法 Method for preparing the fin
05/23/2012CN102468120A Laser processing device and laser processing method using the same
05/23/2012CN102468119A 在晶圆上快速选取失效晶粒的薄膜及使用方法 Films and methods of use to quickly select a failure on the wafer grains
05/23/2012CN102468118A 治具及清洗机 Fixture and washing machine
05/23/2012CN102468117A Wafer cleaning apparatus
05/23/2012CN102468106A 等离子体处理装置 The plasma processing apparatus
05/23/2012CN102467977A 芯片固定基座和芯片固定连接方式 Fixed base chip and chip fixed connections
05/23/2012CN102466970A Method and photoresist with zipper mechanism
05/23/2012CN102466969A 双重图形化方法 Double patterning method
05/23/2012CN102466937A Tft-lcd、驱动器件及其制造方法 Tft-lcd, the driving device and its manufacturing method
05/23/2012CN102466936A Array substrate, liquid crystal display and manufacturing method of array substrate
05/23/2012CN102466934A High light transmittance in-plane switching liquid crystal display device and method for manufacturing the same
05/23/2012CN102466933A 液晶显示器的像素结构及其制作方法 Pixel structure of a liquid crystal display and manufacturing method thereof
05/23/2012CN102466932A Liquid crystal panel, TFT (Thin Film Transistor) array substrate and manufacturing method of TFT array substrate
05/23/2012CN102466931A 阵列基板及其制作方法、液晶显示面板 Array substrate and method of manufacturing the liquid crystal display panel
05/23/2012CN102466577A Preparation method of physical detection sample
05/23/2012CN102466467A 薄膜厚度的监控方法 A method of monitoring the film thickness
05/23/2012CN102465342A Method of manufacturing gan-based film
05/23/2012CN102465338A 一种感应加热非晶硅晶化方法 An induction heating amorphous silicon crystallization method
05/23/2012CN102465334A 一种氮化镓基led外延层的生长方法 A gallium nitride-based epitaxial layers grown led
05/23/2012CN102465248A Protective cover and surface treatment method thereof
05/23/2012CN102464946A 一种化学机械抛光液及其应用 A chemical mechanical polishing liquid and its application
05/23/2012CN102464944A 一种化学机械抛光液及其使用方法 A chemical mechanical polishing solution and method of use
05/23/2012CN102464278A Linear drive device and semiconductor processing device with linear drive device
05/23/2012CN102463653A Resin encapsulation molding method and apparatus for electrical circuit component
05/23/2012CN102463521A Polishing method and device
05/23/2012CN102142381B Automatic charging system of semiconductor packaging equipment
05/23/2012CN102135691B Array substrate, manufacturing method thereof and liquid crystal display
05/23/2012CN102110667B Device for wafer level electrical interconnection and extraction and processing method thereof
05/23/2012CN102097291B Repair regeneration method of reference piece for heavy metal pollution for silicon wafer and regeneration solution
05/23/2012CN102082178B Vertical thin film transistor (TFT) and manufacturing method thereof as well as display device and manufacturing method thereof
05/23/2012CN102074460B Method for cleaning surface after chemically mechanical polishing of tungsten-molybdenum alloy
05/23/2012CN102064169B Single-chip white-light LED and preparation method thereof
05/23/2012CN102054687B Removal method of surface oxide
05/23/2012CN102044421B Method for manufacturing metal gate
05/23/2012CN102044414B Semiconductor structure and manufacturing method thereof
05/23/2012CN102031554B Online monitoring method for electroplating process stability
05/23/2012CN102024725B Detection method and system in semiconductor process
05/23/2012CN102024707B Method for manufacturing GaAs-based metal oxide semiconductor (MOS) device
05/23/2012CN102021519B Preparation method of stannous oxide polycrystalline film
05/23/2012CN101998771B Manufacturing method of film with metal coating
05/23/2012CN101993033B Micro electro mechanical system structure and manufacturing method
05/23/2012CN101989544B Structure capable of reducing substrate back polymer
05/23/2012CN101976045B Panel quality virtual measurement method and system for TFT-LCD etching process
05/23/2012CN101971369B Compound semiconductor light-emitting element and illumination device using the same, and method for manufacturing compound semiconductor light-emitting element
05/23/2012CN101971321B Cam lock electrode clamp
05/23/2012CN101964364B Transistor device and manufacturing method thereof
05/23/2012CN101964353B Organic electro-luminescence display unit and manufacturing thereof
05/23/2012CN101964316B Wafer testing method
05/23/2012CN101958328B CMOS (Complementary Metal Oxide Semiconductor) device and manufacturing method thereof
05/23/2012CN101958310B Semiconductor device and formation method thereof
05/23/2012CN101958300B Double-sided graphic chip inversion module packaging structure and packaging method thereof
05/23/2012CN101958267B Shallow groove filling method
05/23/2012CN101958248B PN-junction diode, phase-change random access memory and manufacturing method thereof
05/23/2012CN101954621B Method for judging grinding terminal of chemical mechanical grinding process
05/23/2012CN101950726B First-coating last-etching single package method for positively packaging double-sided graphic chip
05/23/2012CN101950131B Photomask processor and device producing method
05/23/2012CN101930918B Semiconductor structure and lateral wall partitioning method
05/23/2012CN101930915B Preparation method for molybdenum-aluminum-nitrogen (MoAlN) metal gate
05/23/2012CN101930913B Generating method of metal gate electrode
05/23/2012CN101916773B Double-channel MOS-HEMT (Metal Oxide Semiconductor-High Electron Mobility Transistor) device and manufacturing method
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