Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2012
05/24/2012DE10327360B4 Verfahren zum Herstellen eines Keramik-Metall-Substrates A method of manufacturing a ceramic-metal substrate
05/24/2012DE10237149B4 Schalt-Vorrichtung eines Röntgenstrahl-Sensors und Verfahren zum Herstellen derselben Switching device of an X-ray sensor and method for manufacturing the same
05/24/2012DE102011119158A1 Focal Plane Array in Form eines Wafer Level Package Focal Plane Array in the form of a wafer level package
05/24/2012DE102011086473A1 Halbleiterpackung und -modul, Herstellungsverfahren und elektronisches Bauelement Semiconductor package and modulus, manufacturing processes and electronic component
05/24/2012DE102011086171A1 3D-Halbleiterspeicherbauelement und Halbleiterbauelementherstellungsverfahren 3D semiconductor memory device and semiconductor device manufacturing method
05/24/2012DE102011078811B3 Leistungselektronisches System mit einer Kühleinrichtung Power electronic system with a cooling device
05/24/2012DE102011077757A1 Verfahren zur Aushärtung eines elektrisch leitfähigen Klebstoffs und Kontaktstelle zwischen zwei Fügepartnern A method for curing an electrically conductive adhesive and contact point between two joining partners
05/24/2012DE102011055618A1 Verfahren zur Herstellung einer Cadmiumsulfidschicht A method of manufacturing a cadmium sulphide layer
05/24/2012DE102011055354A1 Integrierte Induktionsspule und Verfahren zum Herstellen einer integrierten Induktionsspule Integrated induction coil and method of fabricating an integrated inductor
05/24/2012DE102011055185A1 Integrierte Schaltung mit Feldeffekttransistor Integrated circuit with field effect transistor
05/24/2012DE102011055091A1 Materialstruktur in einer Ritzlinie und Verfahren zum Trennen von Chips Structure material in a scribe line, and method for separating chips
05/24/2012DE102011054757A1 Verfahren zum Herstellen einer Halbleitervorrichtung, die Metall-Gate-Elektroden aufweist Includes method for producing a semiconductor device, the metal gate electrode
05/24/2012DE102010061773A1 Semiconductor-based power switch for controlling electric motor of e.g. electric power steering apparatus of motor vehicle, has electrical heating element arranged in area of bond connection for thermally releasing bond connection
05/24/2012DE102010061770A1 Verfahren zur Herstellung von Halbleiter-Chips, Montageverfahren und Halbleiter-Chip für senkrechte Montage auf Schaltungsträger A process for producing semiconductor chips, and semiconductor chip mounting method for vertical mounting on the circuit carrier
05/24/2012DE102010060695A1 Method of forming marking in semiconductor wafer used in manufacture of solar cell, involves irradiating laser beam in region of wafer surface portions arranged in cutting block, at acute angle to form marking
05/24/2012DE102010052033A1 Verfahren zur Herstellung von metallischen Strukturen A process for the production of metallic structures
05/24/2012DE102010052032A1 Verfahren zur Herstellung von metallischen Strukturen A process for the production of metallic structures
05/24/2012DE102010040066B4 Verfahren zur Herstellung von Gateelektroden eines Halbleiterbauelements, die durch eine Hartmaske und Doppelbelichtung in Verbindung mit einem Größenreduzierungsabstandshalter hergestellt sind Process for the preparation of gate electrode of a semiconductor device made by a hard mask and double exposure in connection with a reduction in size spacer
05/24/2012DE102008049303B4 Verfahren zur Herstellung eines Silizium-Wafers und Siliziumwafer für Solarzellen A process for producing a silicon wafer and silicon wafers for solar cells
05/24/2012DE102006062034B4 Teststruktur mit erhöhter Robustheit im Hinblick auf Barrieredefekte in Kontaktlochöffnungen beim Abschätzen von Elektromigrationseffekten sowie dazugehöriges Herstellungsverfahren Test structure with increased robustness with respect to barrier defects in via openings in estimating electromigration effects and belonging to manufacturing process
05/24/2012DE102006054311B4 Verfahren zur Herstellung einer Halbleitervorrichtung und mit diesem herstellbare Halbleitervorrichtung A process for producing a semiconductor device and semiconductor device can be produced with this
05/24/2012DE102006026226B4 Arraysubstrat für ein Flüssigkristalldisplay sowie Herstellverfahren für dieses Array substrate for a liquid crystal display and manufacturing method of this
05/24/2012CA2818368A1 Arrays of long nanostructures in semiconductor materials and methods thereof
05/24/2012CA2787098A1 Silicon carbide semiconductor device
05/23/2012EP2456026A1 Group iii nitride semiconductor optical element and epitaxial substrate
05/23/2012EP2456025A1 Group-iii nitride semiconductor element, epitaxial substrate, and method for fabricating a group-iii nitride semiconductor element
05/23/2012EP2455975A2 Amorphous oxide and field effect transistor
05/23/2012EP2455974A1 Semiconductor device, active matrix substrate, and display device
05/23/2012EP2455968A1 Batch fabricated 3d interconnect
05/23/2012EP2455967A1 A method for forming a buried dielectric layer underneath a semiconductor fin
05/23/2012EP2455966A1 Light emitting device
05/23/2012EP2455965A1 Method for manufacturing electronic component and electronic component
05/23/2012EP2455964A1 Epitaxial substrate for electronic device using transverse direction as direction of current conduction and manufacturing method therefor
05/23/2012EP2455512A1 Masking jig, substrate heating apparatus, and film formation method
05/23/2012EP2455331A2 Systems and methods for a three-layer chip-scale MEMS device
05/23/2012EP2455330A2 Systems and methods for a four-layer chip-scale MEMS device
05/23/2012EP2455329A2 Vibration isolation interposer die
05/23/2012EP2454752A1 Semiconductor-on-insulator with backside heat dissipation
05/23/2012EP2454751A1 High-gain wide bandgap darlington transistors and related methods of fabrication
05/23/2012EP2454750A2 Method for drying a semiconductor wafer
05/23/2012EP2454583A1 Inspection system
05/23/2012EP2454397A1 Electroless deposition solutions and process control
05/23/2012EP2045836B1 Method for producing semiconductor substrate
05/23/2012EP1981076B1 Method for manufacturing silicon carbide semiconductor device
05/23/2012EP1979999B1 Monitoring photodetector for integrated photonic devices
05/23/2012EP1706894B1 Integrated photonic devices
05/23/2012EP1636833B1 Method of joining silicon parts with plasma spraying ; corresponding structure
05/23/2012EP1594140B1 Semiconductor device and method for controlling semiconductor device
05/23/2012EP1591504B1 Pressure-sensitive adhesive tape for pasting wafer thereto
05/23/2012EP1546028B8 Method for selectively covering a micro machined surface
05/23/2012EP1189267B1 Method for preparing porous sio2 film
05/23/2012EP1081749B1 Protective member for inner surface of chamber and plasma processing apparatus
05/23/2012CN202231940U Plasma reactor capable of improving uniformity of plasma reaction
05/23/2012CN202230998U Locking device for wafer ring
05/23/2012CN202230997U Small-scale chip suction nozzle
05/23/2012CN202230996U Electrostatic chuck capable of carrying out regional temperature control
05/23/2012CN202230995U Vertical quartz boat
05/23/2012CN202230994U Vacuum welding device for semiconductor
05/23/2012CN202230993U Quartz hook used in semiconductor diffusion furnace
05/23/2012CN202230992U Air inlet passage device of DCE purging by diffusion furnace tube
05/23/2012CN202230991U Probe positioning device of solar battery sheet defect detector
05/23/2012CN202230990U UV pre-treatment test system of a solar photovoltaic assembly
05/23/2012CN202230989U DIP packaging die box used for integrated circuit continuous filling
05/23/2012CN202230988U Water drainage structure with slanted tank bottom
05/23/2012CN202230987U Cleaning annealing apparatus for soft copper bonding wire
05/23/2012CN202230986U Split transmission structure for six substrate boxes
05/23/2012CN202230985U Four-film-magazine single transmission structure
05/23/2012CN202230984U Base pin reshaping device of MOS tube
05/23/2012CN202229496U 冷却装置 Cooling device
05/23/2012CN202228590U Main transmission shaft structure provided with double support seats
05/23/2012CN202226922U Water dropping system
05/23/2012CN202226134U Turnover pallet for solar cell strings
05/23/2012CN202224393U Device for cleaning back surface of wafer
05/23/2012CN1987645B Imprint lithography
05/23/2012CN1987457B Method of estimating water quality, estimation apparatus and preparation system of ultra-pure water using the same
05/23/2012CN1971870B Unloading method of object, and mounting mechanism
05/23/2012CN1967384B Stamp and fabricating method thereof, thin film transistor using the stamp, and liquid crystal display device having the thin film transistor
05/23/2012CN1956210B Display device and method of manufacturing the same
05/23/2012CN1945822B Semiconductor device, semiconductor module and semiconductor module producing method
05/23/2012CN1862821B Semiconductor device
05/23/2012CN1839465B Masking methods
05/23/2012CN1754087B Method for determining the temperature of a semiconductor wafer in a rapid thermal processing system
05/23/2012CN1733856B Slurry, chemical mechanical polishing method using the slurry, and method of forming metal wiring using the slurry
05/23/2012CN1722388B Method for forming a bottom gate thin film transistor using a blend solution to form a semiconducting layer and an insulating layer
05/23/2012CN1714402B Magnetic storage unit using ferromagnetic tunnel junction element
05/23/2012CN1655366B Thin film transistor having ldd structure
05/23/2012CN102475001A Electronic component mounting device, and electronic component mounting method
05/23/2012CN102474988A 电子元件单元和加强粘合剂 The electronic element unit and the strengthening adhesive
05/23/2012CN102474974A Electromagnetic-radiation power-supply mechanism and microwave introduction mechanism
05/23/2012CN102474972A 用于等离子体电弧检测、隔离和预防的系统和方法 System and method for a plasma arc detection, isolation and prevention
05/23/2012CN102474971A Pulse modulated RF power control method and pulse modulated RF power supply device
05/23/2012CN102474076A Group III nitride semiconductor optical element and epitaxial substrate
05/23/2012CN102474075A Group-III nitride semiconductor element, epitaxial substrate, and method for fabricating a group-III nitride semiconductor element
05/23/2012CN102474025A Circuit connecting adhesion film and circuit connecting structure
05/23/2012CN102473809A 发光二极管 Led
05/23/2012CN102473808A 发光二极管 Led
05/23/2012CN102473789A Silicon wafer based structure for heterostructure solar cells
05/23/2012CN102473759A Photoelectric converter and method for producing same
05/23/2012CN102473757A Process for production of photoelectric conversion device
05/23/2012CN102473749A 太阳能电池的制造方法和制造装置 Solar cell manufacturing method and a manufacturing apparatus
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