Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2012
05/24/2012US20120129356 Method of fabricating semiconductor device
05/24/2012US20120129355 Method for texturing a surface of a semiconductor substrate and device for carrying out the method
05/24/2012US20120129354 Process for etching silicon with selectivity to silicon-germanium
05/24/2012US20120129353 Method for pattern formation, method and composition for resist underlayer film formation, and resist underlayer film
05/24/2012US20120129352 Silicon-containing film, resin composition, and pattern formation method
05/24/2012US20120129351 Composite removable hardmask
05/24/2012US20120129350 Method for reducing wordline bridge rate
05/24/2012US20120129349 Method of forming patterns for semiconductor device
05/24/2012US20120129348 Laser processing method
05/24/2012US20120129347 Apparatus and Method For Incorporating Composition Into Substrate Using Neutral Beams
05/24/2012US20120129346 Polishing agent, concentrated one-pack type polishing agent, two-pack type polishing agent and method for polishing substrate
05/24/2012US20120129345 Composition and method for cleaning semiconductor substrates
05/24/2012US20120129344 Process and apparatus for removal of contaminating material from substrates
05/24/2012US20120129343 Method of manufacturing semiconductor device
05/24/2012US20120129342 Method for fabricating a semiconductor substrate with a co-planar backside metallization structure
05/24/2012US20120129341 Method for fabricating via hole and through-silicon via
05/24/2012US20120129340 Antifuse structure for in line circuit modification
05/24/2012US20120129339 Method of manufacturing a semiconductor device having a contact plug
05/24/2012US20120129338 Method for manufacturing semiconductor device
05/24/2012US20120129337 Dual damascene process
05/24/2012US20120129336 Structures and methods for improving solder bump connections in semiconductor devices
05/24/2012US20120129335 Method of manufacturing semiconductor device
05/24/2012US20120129334 Semiconductor packages and methods of manufacturing the same
05/24/2012US20120129333 Method for manufacturing semiconductor package and semiconductor package manufactured using the same
05/24/2012US20120129332 Method for forming metal contacts
05/24/2012US20120129331 Methods of fabricating a semiconductor device including metal gate electrodes
05/24/2012US20120129330 Semiconductor devices employing high-k dielectric layers as a gate insulating layer and methods of fabricating the same
05/24/2012US20120129329 Manufacturing method for semiconductor device
05/24/2012US20120129328 Multiple layer barrier metal for device component formed in contact trench
05/24/2012US20120129327 Method of fabricating semiconductor device using a hard mask and diffusion
05/24/2012US20120129326 Method for manufacturing semiconductor device
05/24/2012US20120129325 Method for ion implant using grid assembly
05/24/2012US20120129324 Semiconductor structure made using improved multiple ion implantation process
05/24/2012US20120129323 Semiconductor thin film, thin film transistor, method for manufacturing same, and manufacturing equipment of semiconductor thin film
05/24/2012US20120129322 Composite material comprising nanoparticles and production of photoactive layers containing quaternary, pentanary and higher-order composite semiconductor nanoparticles
05/24/2012US20120129321 Apparatus for manufacturing semiconductor
05/24/2012US20120129320 Method of nisige epitaxial growth by introducing al interlayer
05/24/2012US20120129319 Electrical Antifuse, Method of Manufacture and Method of Programming
05/24/2012US20120129318 Atmospheric pressure plasma etching apparatus and method for manufacturing soi substrate
05/24/2012US20120129317 Method of manufacturing semiconductor integrated circuit device
05/24/2012US20120129316 Method for forming fine pattern of semiconductor device
05/24/2012US20120129315 Method for fabricating semiconductor package
05/24/2012US20120129314 Method and resulting structure for deep trench polysilicon hard mask removal
05/24/2012US20120129313 Thermally insulated phase material cells
05/24/2012US20120129312 Method of forming e-fuse in replacement metal gate manufacturing process
05/24/2012US20120129311 Method of manufacturing a transistor device having asymmetric embedded strain elements
05/24/2012US20120129310 Methods of fabricating a semiconductor device having a high-k gate dielectric layer and semiconductor devices fabricated thereby
05/24/2012US20120129309 Method for fabricating high-gain mosfets with asymmetric source/drain doping for analog and rf applications
05/24/2012US20120129308 Performance Enhancement in PMOS and NMOS Transistors on the Basis of Silicon/Carbon Material
05/24/2012US20120129307 Semiconductor device and manufacturing method of the same
05/24/2012US20120129306 Configuration and method to form mosfet devices with low resistance silicide gate and mesa contact regions
05/24/2012US20120129305 Method for manufacturing a mos-field effect transistor
05/24/2012US20120129304 Fin-type field effect transistor
05/24/2012US20120129303 Methods for manufacturing passivation layer and thin film transistor array substrate
05/24/2012US20120129302 Fabricating photonics devices fully integrated into a cmos manufacturing process
05/24/2012US20120129301 System comprising a semiconductor device and structure
05/24/2012US20120129300 Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
05/24/2012US20120129299 Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
05/24/2012US20120129298 Method of making stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
05/24/2012US20120129297 Method of manufacturing wafer level package
05/24/2012US20120129293 Methods of making an unsupported article of a semiconducting material using thermally active molds
05/24/2012US20120129292 Laminating assembly
05/24/2012US20120129291 Method for producing a micromechanical component
05/24/2012US20120129290 Method for forming semiconductor nano-micro rods and applications thereof
05/24/2012US20120129288 Display device and manufacturing method of the same
05/24/2012US20120129279 Imprinting method, imprinting apparatus and medium
05/24/2012US20120129278 Dry etching method
05/24/2012US20120129277 Methods and apparatuses for determining thickness of a conductive layer
05/24/2012US20120129276 4D Process and Structure
05/24/2012US20120129275 Dual-bulb lamphead control methodology
05/24/2012US20120129273 Photolithographically defined contacts to carbon nanostructures
05/24/2012US20120128915 GaAs Wafer And Method For Manufacturing The GaAs Wafer
05/24/2012US20120128452 Transport system and set-up method
05/24/2012US20120128450 Coaxial drive vacuum robot
05/24/2012US20120128019 Monolithically integrated multi-wavelength high-contrast grating vcsel array
05/24/2012US20120128014 Intra-cavity frequency doubled microchip laser operating in tem00 transverse mode
05/24/2012US20120127795 Non-volatile memory and manufacturing method thereof and operating method of memory cell
05/24/2012US20120127793 Memory arrays
05/24/2012US20120127789 Storage node, phase change memory device and methods of operating and fabricating the same
05/24/2012US20120127771 Multi-wafer 3d cam cell
05/24/2012US20120127689 Integrated package circuit with stiffener
05/24/2012US20120127473 Optically enhanced holographic interferometric testing methods for the development and evaluation of semiconductor devices, materials, wafers, and for monitoring all phases of development and manufacture
05/24/2012US20120126885 Double gated 4f2 dram chc cell and methods of fabricating the same
05/24/2012US20120126884 Double gated fin transistors and methods of fabricating and operating the same
05/24/2012US20120126883 Vertically stacked fin transistors and methods of fabricating and operating the same
05/24/2012US20120126880 Igbt device with buried emitter regions
05/24/2012US20120126844 Chip stack device testing method, chip stack device rearranging unit, and chip stack device testing apparatus
05/24/2012US20120126555 Endeffectors for handling semiconductor wafers
05/24/2012US20120126453 Pellet loader with pellet separator for molding ic devices
05/24/2012US20120126433 Methods and systems for fabrication of mems cmos devices in lower node designs
05/24/2012US20120126430 Apparatus and Methods for 3-D Stacking of Thinned Die
05/24/2012US20120126429 Semiconductor Device and Method of Forming Base Substrate with Recesses for Capturing Bumped Semiconductor Die
05/24/2012US20120126428 Integrated circuit packaging system with stack interconnect and method of manufacture thereof
05/24/2012US20120126427 Memory device, laminated semiconductor substrate and method of manufacturing the same
05/24/2012US20120126423 Semiconductor device manufacturing method and semiconductor device
05/24/2012US20120126420 Semiconductor device having conductive vias and semiconductor package having semiconductor device
05/24/2012US20120126419 Substrate Arrangement and a Method of Manufacturing a Substrate Arrangement
05/24/2012US20120126418 Integrated circuit device having die bonded to the polymer side of a polymer substrate
05/24/2012US20120126416 Semiconductor Device and Method of Forming Partially-Etched Conductive Layer Recessed Within Substrate for Bonding to Semiconductor Die
05/24/2012US20120126415 Filling Cavities in Semiconductor Structures
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