Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2012
05/23/2012CN102473738A 半导体装置 Semiconductor device
05/23/2012CN102473737A 发光显示装置及其制造方法 Light emitting display device and its manufacturing method
05/23/2012CN102473736A 半导体装置、有源矩阵基板以及显示装置 A semiconductor device, an active matrix substrate and a display device
05/23/2012CN102473735A Semiconductor device and method for manufacturing the same
05/23/2012CN102473733A Semiconductor device and method for manufacturing semiconductor device
05/23/2012CN102473732A Interconnection structure and display device including interconnection structure
05/23/2012CN102473731A 制造半导体器件的方法 The method of manufacturing a semiconductor device
05/23/2012CN102473730A 布线构造及其制造方法、以及具备布线构造的显示装置 Wiring structure and its manufacturing method, and a display device provided with a wiring structure
05/23/2012CN102473729A Method for manufacturing semiconductor device
05/23/2012CN102473728A Method for manufacturing semiconductor device
05/23/2012CN102473723A 功率用半导体装置及其制造方法 Power semiconductor device and manufacturing method used
05/23/2012CN102473722A Multiple orientation nanowires with gate stack stressors
05/23/2012CN102473712A Method for manufacturing optical matrix device
05/23/2012CN102473710A 叉指状竖直平行电容器 Interdigitated capacitor in parallel vertical
05/23/2012CN102473709A 形成具有带内陷电极的电容器的存储器设备的方法 The method of forming a memory device having an electrode with retraction of the capacitor
05/23/2012CN102473705A 半导体装置 Semiconductor device
05/23/2012CN102473699A 具有降低的编程电压的鳍片反熔丝 Fin with reduced programming voltage antifuse
05/23/2012CN102473698A Method of operating a clamping system of a wire bonding machine
05/23/2012CN102473684A System-in packages
05/23/2012CN102473683A Semiconductor-on-insulator with backside heat dissipation
05/23/2012CN102473682A Nonvolatile semiconductor memory
05/23/2012CN102473681A 形成电容器的方法 The method of forming a capacitor
05/23/2012CN102473680A Memory cells, and methods of forming memory cells
05/23/2012CN102473679A Semiconductor device and method for manufacturing same
05/23/2012CN102473678A Semiconductor integrated circuit
05/23/2012CN102473677A Circuit structure and method for programming and re-programming a low power, multiple states, electronic fuse(e-fuse)
05/23/2012CN102473676A 反熔丝元件 Antifuse element
05/23/2012CN102473675A Anti-Fuse Element
05/23/2012CN102473674A Anti-fuse element
05/23/2012CN102473673A 尤其是在集成电路中用于产生金属结晶区域的方法 In particular, a metal in an integrated circuit for generating a crystalline region
05/23/2012CN102473672A 静电夹头中的点火防止 The electrostatic chuck to prevent the ignition
05/23/2012CN102473671A 用于衬底处理系统的损坏衬底处置设备及方法 Damage to the substrate, the substrate processing system and method for the disposal of the device
05/23/2012CN102473670A 处理装置及其动作方法 Apparatus and method for processing the operation
05/23/2012CN102473669A 图像补偿可寻址的静电卡盘系统 Image compensation addressable electrostatic chuck system
05/23/2012CN102473668A 静电吸附构造体及其制造方法 Electrostatic adsorption structure and manufacturing method
05/23/2012CN102473667A 面板平行度调整装置及具备该装置的面板附着装置 The parallelism adjusting device and the panel having a panel attachment means of the apparatus
05/23/2012CN102473666A 晶片输送方法和晶片输送装置 Wafer transport method and the wafer transport apparatus
05/23/2012CN102473665A 重新粘贴装置以及分类重新粘贴方法 Paste the device and re-re-paste method of classification
05/23/2012CN102473664A 基板收纳容器 Substrate storage container
05/23/2012CN102473663A 用环形照射的暗场检查系统 Irradiated with an annular dark field inspection system
05/23/2012CN102473662A 探针卡 Probe Card
05/23/2012CN102473661A 不产生等离子体确定等离子体处理系统的准备状态 Does not produce a plasma preparation to determine the state of a plasma processing system
05/23/2012CN102473660A 等离子加工系统自动瑕疵检测和分类及其方法 Plasma processing system and automatic defect detection and classification method
05/23/2012CN102473659A Active pin connection monitoring system and method
05/23/2012CN102473658A Ultrasonic transducers for wire bonding and methods for forming wire bonds using ultrasonic transducers
05/23/2012CN102473657A 部件压接装置及部件压接方法 Parts and components crimping means crimping method
05/23/2012CN102473656A Light emitting device
05/23/2012CN102473655A Method for manufacturing electronic component and electronic component
05/23/2012CN102473654A Tape applying apparatus
05/23/2012CN102473653A Semiconductor device production method and semiconductor device
05/23/2012CN102473652A Apparatus and method for mounting electronic component
05/23/2012CN102473651A Method for manufacturing semiconductor device
05/23/2012CN102473650A Connecting material, semiconductor device and method for manufacturing semiconductor device
05/23/2012CN102473649A 亚光刻间距结构与光刻间距结构之间的互连 Sublithographic interconnection structure and lithographic pitch spacing between the structure
05/23/2012CN102473648A Surface treatment of silicon
05/23/2012CN102473647A 氮化物半导体装置及其制造方法 The nitride semiconductor device and its manufacturing method
05/23/2012CN102473646A Field effect transistor
05/23/2012CN102473645A 半导体元件、半导体装置以及功率变换器 A semiconductor element, a semiconductor device and power converter
05/23/2012CN102473644A Semiconductor device, method for manufacturing semiconductor device, and display device
05/23/2012CN102473643A Semiconductor device and manufacturing method therefor
05/23/2012CN102473642A 半导体装置及其制造方法 Semiconductor device and manufacturing method
05/23/2012CN102473641A 热处理设备以及半导体装置制造方法 Heat treatment equipment and a method of manufacturing a semiconductor device
05/23/2012CN102473640A Semiconductor device and process for production thereof
05/23/2012CN102473639A Process for production of semiconductor device, and semiconductor device
05/23/2012CN102473638A Post ion implant stripper for advanced semiconductor application
05/23/2012CN102473637A Method of removing photoresist and etch-residues from vias
05/23/2012CN102473636A 微细加工处理剂以及使用其的微细加工处理方法 Micro-processing agent and the use of a fine processing method which
05/23/2012CN102473635A 半导体装置的制造方法 The method of manufacturing a semiconductor device
05/23/2012CN102473634A 等离子体处理装置和等离子体处理方法 The plasma processing apparatus and plasma processing method
05/23/2012CN102473633A 蚀刻方法 Etching method
05/23/2012CN102473632A 电极板的通气孔形成方法 The method for forming the electrode plate vent
05/23/2012CN102473631A 用于等离子体处理工具原位工艺监控和控制的方法和装置 The plasma processing tool situ process monitoring and control methods and apparatus for
05/23/2012CN102473630A 等离子蚀刻法 Plasma etching
05/23/2012CN102473629A 通过重力引起的气体扩散分离(gigds)技术来控制等离子体产生 Diffusion Separation (gigds) technology due to gravity by the gas plasma is generated to control the
05/23/2012CN102473628A Wet etching methods for copper removal and planarization in semiconductor processing
05/23/2012CN102473627A 湿蚀刻装置和湿蚀刻方法 Wet etching apparatus and wet etching method
05/23/2012CN102473626A 湿式处理装置以及湿式处理方法 A wet processing apparatus, and a wet processing method
05/23/2012CN102473625A Csd涂布膜除去用液及使用其的csd涂布膜除去方法以及铁电体薄膜及其制造方法 Csd coating film removing solution and the use thereof csd coating film removing method, and a ferroelectric film and its manufacturing method
05/23/2012CN102473624A Double side polishing apparatus and carrier therefor
05/23/2012CN102473623A Sheet for processing semiconductor
05/23/2012CN102473622A Polishing agent, concentrated one-pack type polishing agent, two-pack type polishing agent and method for polishing sustrate
05/23/2012CN102473621A Cmp polishing liquid, method of polishing substrate, and electronic component
05/23/2012CN102473620A Method for drying a semiconductor wafer
05/23/2012CN102473619A Film for semiconductor and semiconductor device manufacturing method
05/23/2012CN102473618A Film for semiconductor and semiconductor device manufacturing method
05/23/2012CN102473617A Wafer-pasting adhesive sheet and wafer processing method using the same
05/23/2012CN102473616A 成膜方法 Film forming method
05/23/2012CN102473615A 激光退火处理装置、激光退火处理体的制造方法及激光退火处理程序 Laser annealing apparatus, method of manufacturing the body of the laser annealing process and the laser annealing processing program
05/23/2012CN102473614A 硅晶片的热处理方法 Heat treatment of the silicon wafer
05/23/2012CN102473613A Diffusion agent composition, method of forming impurity diffusion layer, and solar cell
05/23/2012CN102473612A Plasma CVD apparatus, plasma electrode, and method for manufacturing semiconductor film
05/23/2012CN102473611A 气相生长装置 Vapor phase growth apparatus
05/23/2012CN102473610A Substrate-processing apparatus and substrate-processing method for selectively inserting diffusion plates
05/23/2012CN102473609A 成膜装置 Film forming apparatus
05/23/2012CN102473608A 成膜装置 Film forming apparatus
05/23/2012CN102473607A 膜沉积装置 The film deposition apparatus
05/23/2012CN102473606A Method for manufacturing crystalline semiconductor film and apparatus for manufacturing crystalline semiconductor film
05/23/2012CN102473605A 制造碳化硅单晶的方法和碳化硅衬底 The method of producing a silicon carbide single crystal and the silicon carbide substrate
05/23/2012CN102473604A Silicon carbide substrate, substrate having epitaxial layer attached thereto, semiconductor device, and process for production of silicon carbide substrate
05/23/2012CN102473603A 原子层沉积用高浓度水脉冲 Atomic Layer Deposition pulses with a high concentration of water
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