| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 03/15/2007 | US20070057258 Display device and method for manufacturing the same |
| 03/14/2007 | EP1762641A2 Metal duplex and method |
| 03/14/2007 | EP1762640A2 Metal duplex and method |
| 03/14/2007 | EP1601821A4 Electroplating pcb components |
| 03/14/2007 | CN1930637A Process for preparing a non-conductive substrate for electroplating |
| 03/14/2007 | CN1930326A Electrical potential-assisted assembly of molecular devices |
| 03/14/2007 | CN1930323A Metal surface treating agent |
| 03/14/2007 | CN1928160A Method for electrically plating Ti-Cu-Zn three alloys meeting three-prevention demand |
| 03/14/2007 | CN1305132C Lead frame and its electroplating method |
| 03/14/2007 | CN1304643C Method of plating and pretreating aluminium workpieces |
| 03/13/2007 | US7190057 Packaging component and semiconductor package |
| 03/13/2007 | US7189647 Sequential station tool for wet processing of semiconductor wafers |
| 03/13/2007 | US7189630 Layer sequence for producing a composite material for electromechanical components |
| 03/13/2007 | US7189318 Automatic process control, more particularly, controlling a material deposition process; electroplating; constructing a Jacobian sensitivity matrix of the effects on plated material thickness at each of a plurality of workpiece position |
| 03/13/2007 | US7189317 Semiconductor manufacturing system for forming metallization layer |
| 03/13/2007 | US7189302 Multi-layer printed circuit board and fabricating method thereof |
| 03/08/2007 | WO2007026970A1 Threaded joint for steel pipes |
| 03/08/2007 | WO2007026562A2 Metal film and its production method, and multilayer electronic component production method and multilayer electronic component |
| 03/08/2007 | WO2007025723A1 Method for producing a composite body with an electrodeposited coating under internal compressive stress |
| 03/08/2007 | US20070051636 Process for producing metal foams having uniform cell structure |
| 03/08/2007 | US20070051632 Polishing method, polishing apparatus, plating method, and plating apparatus |
| 03/08/2007 | US20070051049 abrasive grain electrodeposition step of immersing base, with plating surface pointed upward, in plating solution, in which abrasive grains having larger specific gravity than plating solution are dispersed, to deposit abrasive grains on plating surface, hollow particle electrodeposition step |
| 03/08/2007 | DE102006008465A1 Drehbare Maschine und Teile derselben Rotating machine and parts thereof |
| 03/08/2007 | CA2621180A1 Method and apparatus for treating biologically contaminated air |
| 03/07/2007 | EP1759039A2 Process for preparing a non-conductive substrate for electroplating |
| 03/07/2007 | EP1257695B1 Biomolecules having multiple attachment moieties for binding to a substrate surface |
| 03/07/2007 | CN2876106Y Brush plating cover head |
| 03/07/2007 | CN1924111A Two-way modulation pulse electrochemical deposition apparatus |
| 03/07/2007 | CN1924110A Metal based nano composite electric plating method for Nd-Fe-B material antisepsis |
| 03/06/2007 | US7186923 Printed wiring boards and methods for making them |
| 03/06/2007 | US7186327 Method and apparatus for scaling control and in-situ cathodic protection |
| 03/06/2007 | US7186326 No cell cleaning and rinsing between the analyses; reduces the analysis time, consumption of expensive chemicals, and quantity of hazardous waste generated |
| 03/01/2007 | WO2005110287A3 Electroplating solution for gold-tin eutectic alloy |
| 03/01/2007 | US20070046313 Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology |
| 03/01/2007 | US20070045123 Methods of forming integrated circuit devices having metal interconnect layers therein |
| 03/01/2007 | US20070045122 Building up a three-dimensional structure from a number of adhered layers by depositing a first material onto a substrate; selectively etching to a desired depth; depositing a second material at least into the voids created; at least one of the deposition processes is an electrodeposition process |
| 03/01/2007 | US20070045121 Depositing portion of a layer onto the substrate; forming a plurality of layers such that each successive layer is formed adjacent to and adhered to a previously deposited layer; packaging; hermetic sealing |
| 03/01/2007 | US20070045120 Methods and apparatus for filling features in microfeature workpieces |
| 03/01/2007 | DE19728183B4 Herstellungsverfahren für leitende Drähte eines Halbleitergehäuses in Chipgrösse Manufacturing method for conductive wires of a semiconductor package in chip size |
| 03/01/2007 | DE112005000842T5 Verfahren zum Verleihen von Widerstand gegenüber Wasserstoff für Artikel A method of imparting resistance to hydrogen for products |
| 03/01/2007 | DE10229005B4 Vorrichtung und Verfahren zur elektrochemischen Metallabscheidung Apparatus and method for electro-chemical metal deposition |
| 03/01/2007 | DE102005041375A1 Method of producing decorative surface structures or patterns on objects of decorative layer on sanitary involves metal layer, partial removal of this, e.g. by electromagnetic radiation, and deposition toned down surface structure |
| 03/01/2007 | DE102005041078A1 Composite article with electrodeposited coating, e.g. of hard chromium, has the coating loaded with compressive internal stress by mechanically induced plastic deformation to inhibit cracking |
| 02/28/2007 | EP1757715A2 Aqueous solution for surface treatment of tin films and method for preventing discoloration of a tin film surface |
| 02/28/2007 | EP1755813A1 Tool holder with vibration damping means and a method for manufacturing the same |
| 02/28/2007 | EP1560949A4 Integrated plating and planarization process and apparatus therefor |
| 02/28/2007 | EP1407810B1 Vibratingly stirring apparatus, and device and method for processing using the stirring apparatus |
| 02/28/2007 | CN2873802Y Improved structure for electroplating device |
| 02/28/2007 | CN1922947A Copper foil having blackened surface or layer |
| 02/28/2007 | CN1922723A Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures |
| 02/28/2007 | CN1922340A Method of electroplating on aluminum |
| 02/28/2007 | CN1920105A Method and apparatus for fluid processing a workpiece |
| 02/28/2007 | CN1302155C Method and device for electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 02/27/2007 | US7182995 Plated-polyester article and production process thereof |
| 02/22/2007 | WO2007021358A1 Method of patterning ultra-small structures |
| 02/22/2007 | WO2007021327A2 Pretreatment of magnesium substrates for electroplating |
| 02/22/2007 | WO2007020908A1 Environment-friendly surface treated steel sheet for electronic part excelling in solder wettability, whisker resistance and appearance aging stability and process for producing the same |
| 02/22/2007 | WO2006011922A3 Pulse reverse electrolysis of acidic copper electroplating solutions |
| 02/22/2007 | US20070042217 for modular rotary tool; wear resistance, fracture toughness, tensile strength, corrosion resistance, coefficient of thermal expansion, and coefficient of thermal conductivity |
| 02/22/2007 | US20070042200 Reflective or semi-reflective metal alloy coatings |
| 02/22/2007 | US20070039829 electrolysis; depositing adherent zinc coating onto zinc-containing magnesium alloy substrate to render surface suitable for electroplating; coatings applied from pyrophosphate-based zinc electrolyte solution containing fluoride ions; corrosion resistance; etching free |
| 02/22/2007 | US20070039828 Mesoscale and microscale device fabrication methods using split structures and alignment elements |
| 02/21/2007 | EP1753896A1 Method and system for selectively coating or etching surfaces |
| 02/21/2007 | EP1347070B1 Steel sheet for porcelain enameling and method for production thereof, and enameled product and method for production thereof |
| 02/21/2007 | CN1918328A Improved metal strip electroplating |
| 02/21/2007 | CN1917099A Method of manufacturing alloyed copper wire/rod |
| 02/20/2007 | US7179541 Achieving optimal embrittlement of grain boundaries; controlled temperature heating |
| 02/20/2007 | US7179361 Method of forming a mass over a semiconductor substrate |
| 02/20/2007 | US7179360 Electrodeposition; plating; alloy |
| 02/15/2007 | WO2007017493A1 Electrode grid |
| 02/15/2007 | US20070037007 Multilayer getter structures and methods for making same |
| 02/15/2007 | US20070034519 Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the same |
| 02/15/2007 | US20070034518 Method of patterning ultra-small structures |
| 02/15/2007 | US20070034517 Interconnect structure for semiconductor devices |
| 02/15/2007 | US20070034516 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 02/15/2007 | DE10229001B4 Verfahren und System zum Steuern der Ionenverteilung während des galvanischen Auftragens eines Metalls auf eine Werkstückoberfläche A method and system for controlling the distribution of ions during the galvanic depositing a metal on a workpiece surface |
| 02/14/2007 | EP1751328A2 Selective catalytic activation of non-conductive substrates |
| 02/14/2007 | CN1914359A Sealing agent, method of sealing and printed circuit board treated with the sealing agent |
| 02/14/2007 | CN1914358A Electroplating solution composition for organic polymer-zinc alloy composite plating and plated metal material using such composition |
| 02/14/2007 | CN1914357A Electroplated coating of zinc alloy with excellent corrosion resistance and plated metal material having same |
| 02/14/2007 | CN1301046C Flexible printed wiring board for chip-on-film |
| 02/13/2007 | US7175920 Copper foil for high-density ultra-fine printed wiring board |
| 02/13/2007 | CA2186482C Palladium colloid solution and its utilisation |
| 02/08/2007 | WO2006099506A3 Method of producing superconducting wire and articles produced thereby |
| 02/08/2007 | US20070029204 Manufacturing process of emboss type flexible or rigid printed circuit board |
| 02/08/2007 | DE102005014748B4 Technik zum elektrochemischen Abscheiden einer Legierung mit chemischer Ordnung Technology for the electrochemical deposition of an alloy with chemical ordering |
| 02/07/2007 | EP1750491A2 System and method for manufacturing flexible copper clad laminate film |
| 02/07/2007 | EP1749122A2 Surface enhanced spectroscopy-active composite nanoparticles |
| 02/07/2007 | EP1444386A4 Elemental silicon nanoparticle plating and method for the same |
| 02/07/2007 | EP1231300B1 Plating method and device, and plating system |
| 02/07/2007 | CN1908241A Electroplating method for negative pole case of mercury-free alkaline battery |
| 02/07/2007 | CN1299548C Method for metal coating of substrates |
| 02/07/2007 | CN1299544C Nickel coated copper as electrodes for embedded passive devices |
| 02/07/2007 | CN1299135C Process for preparation of optical element, electrolytic solution used for the same and apparatus for preparation of optical element |
| 02/07/2007 | CN1298490C Product and method for low temperature fluxless brazing |
| 02/07/2007 | CN1298489C Fluxless brazing method and compositions of layered material systems for brazing aluminum or dissimilar metals |
| 02/06/2007 | US7172786 Methods for improving positioning performance of electron beam lithography on magnetic wafers |
| 02/06/2007 | US7172684 Performing extrusion via depositions through anodeless conformable contact masks that are initially pressed against substrates that are then progressively pulled away or separated as the depositions thicken; pattern of deposition may vary over the course of deposition by including relative motion |
| 02/01/2007 | US20070026253 High-carbon steel wire with nickel sub coating |
| 02/01/2007 | US20070023070 Meniscus, vacuum, IPA vapor, drying manifold |