Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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05/31/2007 | WO2007059730A2 Method for the pre-treatment of titanium components for the subsequent coating thereof |
05/31/2007 | WO2007059545A1 Tool with electrochemically deposited antiabrasive layer |
05/31/2007 | US20070122553 forming a frame having an undercut near the bottom on an electrode film, forming the patterned thin film by plating through the use of the frame; patterned thin film includes linear portions disposed side by side, and each linear portions has a portion having greater width, close to the electrode film |
05/31/2007 | DE202004021264U1 Korrosionsschicht und gehärtetes Stahlbauteil Corrosion layer and hardened steel component |
05/31/2007 | CA2628623A1 Method for the pre-treatment of titanium components for the subsequent coating thereof |
05/30/2007 | EP1313895B1 Method for metal coating the surface of high temperature superconductors |
05/30/2007 | CN1970819A Binary NiP amorphous alloy bulk and method for preparing same |
05/30/2007 | CN1319145C Apparatus and method of substrate surface treatment of integrated circuit |
05/30/2007 | CN1318650C Method for working rotary axle holder |
05/29/2007 | US7223690 Substrate processing method |
05/29/2007 | US7223329 Exterior sketon; coil spring; shape memory alloy; elastic deformation |
05/29/2007 | US7223328 A polycrystalline tin oxide film produced by electrolytic deposition of a tin film on a dielectric support in an electrochemical cell, followed by oxidation; fine grains with good adhesion; improved sensitivity |
05/24/2007 | WO2007058605A1 Master electrode and method of forming it |
05/24/2007 | WO2007058604A1 Master electrode and method of forming the master electrode |
05/24/2007 | WO2007058603A1 Method of forming a multilayer structure |
05/24/2007 | WO2007057528A1 Method for producing a non-developable surface printed circuit and the thus obtained printed circuit |
05/24/2007 | WO2007056992A1 Method and agent for the electrolytic cleaning and descaling of a metallic workpiece |
05/24/2007 | WO2006067337A3 Method for electroplating a metal to obtain cells with electrodes-solid polymer electrolyte |
05/24/2007 | US20070117365 Plating method and apparatus |
05/24/2007 | US20070114133 Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
05/24/2007 | US20070114132 Device and method for separating metals and/or metal alloys from metallo-organic electrolytes |
05/24/2007 | DE102005055303A1 Multi-stage surface etching process to manufacture high-temperature metal titanium components for gas turbine engine |
05/24/2007 | DE102005054944A1 Surface treating valve rocker of electromagnetic valve used in water-conveying household appliance, e.g. dishwasher, comprises applying first layer of nickel followed by second layer which covers first layer |
05/24/2007 | DE102005041078B4 Verfahren zur Herstellung eines Verbundkörpers mit einer druckeigenspannungsbelasteten galvanischen Beschichtung A process for producing a composite body having a compressive residual stress loaded galvanic coating |
05/23/2007 | EP1788585A1 Conductive material for connecting part and method for manufacturing the conductive material |
05/23/2007 | EP1786622A1 Method and structure for arresting/preventing fires in titanium clad compositions |
05/23/2007 | EP1526943B1 Brazing product and method of manufacturing a brazing product with use of a plating bath |
05/23/2007 | CN1969064A Tin-based plating film and method for forming the same |
05/23/2007 | CN1966779A Process for making Ni-Cu-Ag multilayer film |
05/22/2007 | US7220370 Plating and production methods for producing a fine metal component using a conductive paste |
05/22/2007 | US7220347 Electrolytic copper plating bath and plating process therewith |
05/22/2007 | US7220346 Electrodepositing metal oxide at step edge. reducing in hydrogen gas, embedding in polymer film and removing; forming such as molybdenum in polystyrene |
05/18/2007 | WO2007055223A1 Method for forming metal film and method for forming metal pattern |
05/18/2007 | WO2006047501A3 Anodized coating over aluminum and aluminum alloy coated substrates and coated articles |
05/17/2007 | US20070111491 Process for electroplating metal layer without plating lines after the solder mask process |
05/17/2007 | US20070108060 Pretreating the alloy with a solution to form a film and electroplating copper from a solution containing copper cyanide and copper pyrophosphate and/or copper sulfate; if copper layer is removed by force, the plating layer exhibits coarse grains contained in the pretreatment layer |
05/17/2007 | US20070108059 Composite layer including metal and inorganic powders and method for manufacturing the same |
05/17/2007 | US20070107756 Meniscus proximity system for cleaning semiconductor substrate surfaces |
05/16/2007 | CN1965110A Method of barrier layer surface treatment to enable direct copper plating on barrier metal |
05/16/2007 | CN1965109A Method for imparting resistance to hydrogen to article |
05/16/2007 | CN1962962A Plating tank |
05/16/2007 | CN1962957A Method for ultrasonic electroplating of diamond drilling bit |
05/16/2007 | CN1962956A System and method for electrolytic plating |
05/16/2007 | CN1962944A Gray surface treatment process for electrolytic copper foil |
05/16/2007 | CN1962239A Acrylic rubber and cast iron direct joint method |
05/16/2007 | CN1316570C Planar metal electroprocessing |
05/16/2007 | CN1316066C Surface treatment copper foil for low dielectric substrate, copper clad laminate including the same and printed wiring board |
05/15/2007 | US7217353 Pretreatment; removal bubbles adsorbed on substrate; rotation, immersion in plating solution |
05/10/2007 | WO2007051708A1 Device for the surface treatment of workpieces |
05/10/2007 | WO2005109972A3 Design and method for plating pci express (pcie) edge connector |
05/10/2007 | US20070104624 Microreactor including magnetic barrier |
05/10/2007 | US20070102301 One-point recalibration method for reducing error in concentration measurements for an electrolytic solution |
05/10/2007 | US20070102300 Method for ceramic electroplating a cylinder assembly of an internal combustion engine |
05/10/2007 | US20070102299 Multi-cell masks and methods and apparatus for using such masks to form three-dimensional structures |
05/10/2007 | DE102005051632A1 Verfahren zum Beizen von nicht leitenden Substratoberflächen A method for pickling non-conductive substrate surfaces |
05/09/2007 | EP1784064A1 Flexible printed wiring board terminal part or flexible flat cable terminal part |
05/09/2007 | EP1781841A1 Surface comprising a microstructure that reduces adhesion and associated production method |
05/09/2007 | EP1781421A1 Silver plating in electronics manufacture |
05/09/2007 | EP1664387A4 Deposition method for nanostructure materials |
05/09/2007 | CN1961099A Chambers, systems, and methods for electrochemically processing microfeature workpieces |
05/09/2007 | CN1959879A Superfine magnetic elements, and electrochemical manufacturing method |
05/09/2007 | CN1958873A Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product |
05/09/2007 | CN1958871A Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product |
05/09/2007 | CN1958867A Post-processing technique for chrome plated parts locally |
05/09/2007 | CN1958865A Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product |
05/09/2007 | CN1958861A Method for fabricating artificial headdress |
05/09/2007 | CN1958844A Method for etching non-conductive substrate surfaces |
05/09/2007 | CN1315158C Method for selective electroplating of semiconductor device i/o pads |
05/09/2007 | CN1314839C Copper bath capable of depositing lackluster copper coat and method thereof |
05/08/2007 | US7214440 Metallic separator for fuel cell and production method for the same |
05/08/2007 | US7214305 forming concave zone in substrate surface; forming an electroconductive seed layer; electrolytic plating |
05/08/2007 | US7214304 Process for preparing a non-conductive substrate for electroplating |
05/08/2007 | US7214297 Substrate support element for an electrochemical plating cell |
05/03/2007 | WO2007050210A1 Electrode surface coating and method for manufacturing the same |
05/03/2007 | WO2007048883A1 Method of producing a part with very high mechanical properties from a rolled coated sheet |
05/03/2007 | US20070099020 Metal foam |
05/03/2007 | US20070095657 Metal oxide supercapacitor having metal oxide electrode coated onto titanium dioxide ultrafine fiber and method for preparing the same |
05/03/2007 | DE102004045451B4 Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper |
05/02/2007 | EP1780311A1 Manufacturing process for satin-matt surface |
05/02/2007 | EP1778896A1 Method of barrier layer surface treatment to enable direct copper plating on barrier metal |
05/02/2007 | EP1778895A1 A process for manufacturing micro- and nano-devices |
05/02/2007 | EP1778888A1 Chromium plating |
05/02/2007 | EP1702018A4 Chambers, systems, and methods for electrochemically processing microfeature workpieces |
05/02/2007 | EP1691662A4 Structures and devices for parenteral drug delivery and diagnostic sampling |
05/02/2007 | EP1595001B1 Surface-coating method |
05/02/2007 | CN1955343A Electroplating method of alluminium alloy surface |
05/02/2007 | CN1955342A Method for electroplating double-layer admiro film on Nd-Fe-B magnetic surface |
04/26/2007 | WO2007047392A2 Planar multi-electrode array sensor for localized electrochemical corrosion detection |
04/26/2007 | WO2007045688A1 Production of silky matter of metal surfaces |
04/26/2007 | WO2007003572A3 Method for deposition of a material in a hole in an electrically conducting workpiece |
04/26/2007 | WO2006047526A8 Article of manufacturing and process for anodically coating aluminum and/or titanium with ceramic oxides |
04/26/2007 | US20070089993 Electrochemical printer head for use in electrolytically depositing material onto substrate, the printing head comprising a plurality of electrodes, a lead connector, an electric power source, and a high electrical resistance means for controlling distribution of electrolyte to electrode channels |
04/26/2007 | US20070089991 Automatic process control; facility for automatically selecting and refining electrical parameters for processing a microelectronic workpiece |
04/25/2007 | CN2892894Y Barrel plating machine |
04/25/2007 | CN1952218A Process for obtaining coating with different surface roughness |
04/25/2007 | CN1951673A Method for direct joint of ethylen-propylene rubber and cast iron |
04/24/2007 | US7208349 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
04/24/2007 | US7208074 Substrate processing apparatus and substrate plating apparatus |
04/24/2007 | US7208073 Media for use in plating electronic components |
04/19/2007 | WO2007044232A2 Pre-treatment to eliminate the defects formed during electrochemical plating |