Patents for C25D 3 - Electroplating; Baths therefor (11,896)
09/2008
09/04/2008US20080210567 Using titanium compound comprising titanyl sulfate and/or titanyl oxalate, a complexing agent selected from, for example, citric acid, citrates, tartaric acid, tartrates, lactic acid, lactates, gluconic acid, gluconates, polyhydroxy-polycarbonic acids, an accelerator, water, solvents, buffers
09/04/2008US20080210566 Electrochemical Deposition of Selenium in Ionic Liquids
09/03/2008EP1963548A2 Method for production of foamed metal
09/03/2008EP1167580B1 Electrolytic copper foil
09/03/2008CN101258269A Nanocarbon/aluminum composite material, process for producing the same, and plating liquid for use in said process
09/03/2008CN101256903A Silver-graphitic electrical contact composite plating layer and method of preparing the same
09/03/2008CN101255592A Chromium/diamond composite deposite and preparation method thereof
09/03/2008CN101255590A Method for preparing carbon nano-tube/nano-platinum composite film
09/03/2008CN101255585A Novel surface metallization method for carbon-fibre reinforced epoxy resin composite material
09/03/2008CN101255583A Sn crystal flower induced electrodeposition plaque-imitating copper crystal flower surface finishing process
09/03/2008CN101255582A Plaque copper electroplating process
09/03/2008CN101255581A Alkaline chloride galvanizing additive and preparation method thereof
09/03/2008CN101255580A Nd-added nd-fe-b permanent-magnetic material electroplating fluid and method of use thereof
09/03/2008CN101254687A Composite metal round net for printing and dyeing and method of preparing the same
09/03/2008CN101254686A Three layers composite metal round net for printing and dyeing and method of preparing the same
09/03/2008CN101254685A Five layers composite metal round net for printing and dyeing and method of preparing the same
09/03/2008CN101254497A Surface treating technique of zinc alloy handle
09/03/2008CN100416883C Thin film transistor, method for its manufacture, and circuit or electronic device/apparatus comprising it
09/03/2008CN100416777C Reducing defect in electrodeposited copper used in semiconductor
09/03/2008CN100415942C Production method of nanometer crystal zinc plating
09/02/2008US7419926 Sintered bodies based on niobium suboxide
09/02/2008US7419546 Gas diffusion electrodes, membrane-electrode assemblies and method for the production thereof
08/2008
08/28/2008WO2008102580A1 Electrolytic gold plating solution and gold film produced by using the same
08/28/2008US20080206567 Plastic Conductive Particles and Manufacturing Method Thereof
08/28/2008US20080202938 rotatable gears on supports and connected electroconductive conductors, used for electrodeposition of metal coatings on the surfaces of turbine engine blades or vanes
08/27/2008EP1961840A1 Copper-tin electrolyte and method for depositing bronze layers
08/27/2008EP1709215A4 Chromium-free antitarnish adhesion promoting treatment composition
08/27/2008CN101250735A Apparatus and method for continuously composite plating metallic and nano particle on carbon fiber surface
08/27/2008CN101250732A Method for manufacturing high anti-corrosion nanometer composite plating coat
08/27/2008CN101250731A Method for preparing compact cuprum indium selenium film on flexible substrate
08/27/2008CN101250730A Lemon acid gold salt for gold plating and manufacture method thereof
08/27/2008CN101250729A Nickeling liquid and nickeling method for metal-matrix composite
08/27/2008CN101250728A Method for manufacturing silicon carbide nanometer fibre/carbon fibre composite felt body
08/27/2008CN101250727A Multifunctional composite electrochemical deposition liquid and method of use thereof
08/27/2008CN101250725A Method for manufacturing large area evenly distributed cuprum octahedron nanometer particle
08/27/2008CN101250719A Method for one-step synthesing and assembling cuprum nanometer particle
08/27/2008CN101250705A Method for manufacturing nickel-cuprum metallic baseband layer of highly oriented double-shaft texture
08/21/2008WO2008100648A1 High speed tin plating process
08/21/2008WO2008098666A1 Copper-tin electrolyte and method for depositing bronze layers
08/20/2008CN101245480A Method for producing nickel coating on metal surface
08/20/2008CN101245479A Cyanideless electro-coppering method for magnesium alloy casting parts
08/20/2008CN100412541C Reference electrode calibration for voltammetric plating bath analysis
08/20/2008CN100412236C Gold plating solution and gold plating method
08/14/2008WO2008096855A1 ELECTRIC Al-Zr ALLOY PLATING BATH USING ROOM TEMPERATURE MOLTEN SALT BATH AND PLATING METHOD USING THE SAME
08/14/2008WO2008029376A3 Deposition of conductive polymer and metallization of non-conductive substrates
08/14/2008US20080190757 Electro-chemical processor with wafer retainer
08/14/2008US20080190310 Method for coating a printing press cylinder
08/14/2008DE102007008183A1 Galvanische Abscheidung von Gold und Goldlegierungen Electrodeposition of gold and gold alloys
08/13/2008EP1956118A2 Method of forming bond coating for a thermal barrier coating
08/13/2008EP1956117A1 Galvanic filtering of gold or gold alloys
08/13/2008EP1781421A4 Silver plating in electronics manufacture
08/13/2008CN101243210A Tin electrodeposits having properties or characteristics that minimize tin whisker growth
08/13/2008CN101240437A Method for plating zinc-nickel alloy in alkaline electroplate liquid
08/13/2008CN101240436A Gold electroforming technique
08/13/2008CN100411064C Preparation method of copper covered steel woven wire special for communication cable shielding layer
08/13/2008CN100410424C Method for coating Ni-P layer in same liquid by chemically plating and electrobath
08/07/2008WO2008092265A1 AMORPHOUS Fe100-a-bPaMb ALLOY FOIL AND METHOD FOR ITS PREPARATION
08/07/2008US20080187675 Mixture of liposome with other material such as diamonds; plating; abrasives, cosmetics, medical uses
08/07/2008US20080185292 Electrode molded of metal, or compound thereof, powder having controlled particle size; controlling width of current pulse of electric discharges
08/07/2008DE102007005299A1 Everyday objects with anti-microbial action, contacted by individuals including those with immunity deficiencies, are electroplated or painted with colloidal silver
08/07/2008CA2675987A1 Amorphous fe100-a-bpamb alloy foil and method for its preparation
08/06/2008EP1951934A1 Electrochemical deposition of selenium in ionic liquids
08/06/2008CN101238243A Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition, and articles incorporating such deposits
08/06/2008CN101237038A A tin nickel alloy negative material of lithium ion battery and its making method
08/06/2008CN101235526A Plating liquor for electroplating low-antimony-lead alloy and preparation method thereof
08/06/2008CN101235525A Plating liquor for electroplating zinc-antimony alloy and preparation method thereof
08/06/2008CN101235524A Non-cyanide electrolysis gold plating bath for gold bump and gold wiring
08/06/2008CN101235523A Ultrasonic cyanogen-free fast silver coating method
08/06/2008CN101235522A Method for preparing carbon fiber surface zinc coat
08/06/2008CN101235091A Methylcellulose-nano diamond derivatives, preparation method and use thereof
08/06/2008CN100408713C Binary NiP amorphous alloy bulk and method for preparing same
08/05/2008US7407569 Gold plating solution and gold plating method
08/02/2008CA2576752A1 Amorpheous fe100-a-bpamb foil, method for its preparation and use
07/2008
07/31/2008US20080182100 Magnetic anodized aluminium oxide with high oxidation resistance and method for its fabrication
07/31/2008US20080179193 Manufacturing method of coating target
07/31/2008US20080179192 Anodes, each with different types of soluble metals, avoiding the need for periodic plating bath replacement, allowing the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals
07/29/2008US7405007 Semiconductor having a substantially uniform layer of electroplated metal
07/24/2008US20080173550 plating a tin alloy under layer from divalent tin compound ( tin methanesulfonate, sncl2) and a metal compound of Ag, Bi, Sb, Zn, In, Pd from low temp. plating bath, plating upper layer from high temp. bath; continous or interminttent additon of thiourea and alloying metal for controlling performance
07/24/2008US20080173549 Direct current chrome plating process and variant layered chrome product
07/24/2008US20080173216 Generation of gas pinholes reduced; excellent film without specific resin as binder; zinc oxide pigment; amine modified epoxy resin; blocked isocyanate curing agent; aromatic polyisocyanate, glycol, lactam blocking agent; improve storage stability of pigment dispersed paste
07/24/2008CA2618205A1 Method for improving the performance of nickel electrodes
07/23/2008EP1946362A2 Tin-silver solder bumping in electronics manufacture
07/23/2008EP1945835A2 Platinum electrode surface coating and method for manufacturing the same
07/23/2008EP1185152B1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same
07/23/2008EP1185150B1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same
07/23/2008CN101225536A Gold-silver alloy electroplating solution
07/23/2008CN101225535A Thin-layer nickel plating technique without damaging invar steel low expansion character
07/23/2008CN100404463C Sintered bodies based on niobium suboxide
07/22/2008US7402232 Cyanide as a silver source; compound of arsenic, thallium, selenium, or tellurium as a brightener; and an adjuster for suppression of brightness that has a benzothiazole or benzoxazolidine skeleton; may also contain a nonionic or fluorine-based surfactant and citrate, phosphate, tartarate, or succinate
07/17/2008US20080169334 Copper welding solid wire with good arc stability
07/17/2008US20080169199 Trivalent chromium electroplating solution and an electroplating process with the solution
07/17/2008DE102007002321A1 High strength vehicle spring, has electroplated anti-corrosion coating applied using a membrane technology, in addition to external powder coating
07/16/2008EP1185151B1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same
07/16/2008CN201087220Y Environment-protection electroplating apparatus
07/16/2008CN101220425A High-strength nano-level crystal nickel material and method of manufacturing the same
07/16/2008CN101219589A Stainless steel base self-lubricating composite material and production method
07/16/2008CN101219372A Method for processing foamed aluminium load nano-titanium dioxide photocatalysis body
07/16/2008CN100402707C Alkaline Sn-Ag alloy plating solution and its plating method
07/10/2008WO2008082192A1 Sn-b plating solution and plating method using it
07/10/2008WO2008014987A3 Method for deposition of chromium layers as hard- chrome plating, electroplating bath and hard- chrome surfaces
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