Patents for C25D 3 - Electroplating; Baths therefor (11,896)
05/2008
05/13/2008US7371426 lower growth environmental bond coating of an aluminum alloy applied to the remaining base metal substrate so that upon subsequent repair of the component, less of the remaining base metal substrate is removed because of less environmental coating growth into the substrate than prior bond coat
05/13/2008US7371311 Modified electroplating solution components in a low-acid electrolyte solution
05/08/2008WO2008054652A1 Nanostructured alloy coated threaded metal surfaces and methods of producing same
05/08/2008US20080107963 Case For Batteries And Preparation Method Thereof
05/08/2008US20080107805 Fine-Grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate
05/08/2008US20080105560 Dipping conductive substrate in electroplating solution containing metallic ions and performing electroplating process to reduce ions to nano metallic particles on conductive substrate; particles can be used as catalyst to perform chemical vapor deposition process to form carbon nanotubes on substrate
05/07/2008EP1918426A1 Cyanide free electrolyte composition und process for plating silver or alloys thereof on substrates
05/07/2008EP1918425A1 Greyish chromium surface
05/07/2008EP1918411A2 Coated turbine engine components and methods for making the same
05/07/2008EP1720842B1 Acidic bath for electrolytically depositing a copper deposit containing halogenated or pseudohalogenated monomeric phenazinium compounds
05/07/2008EP1680535A4 Electroplating compositions and methods for electroplating
05/07/2008CN100386825C Method for improving critical current density of Bi-2223 strip material
05/07/2008CN100386276C Process for manufacturing thin tempering glass of viewing window
05/06/2008US7368048 Crack-free thin film on surface having complicated shape; heat, corrosion, oxidation and shock resistance; deposition from bath containing ions of perrhenate, nickel, rron, cobalt or chromium III and lithium or sodium; (hydroxy)carboxylic acid or amino acid; sulfuric acid; pH control; jet engine blade
05/06/2008US7368046 Electrodeposition of an overlay of Cu, Ag and Bi on a bearing metal layer of a Cu or Al alloy covered by Ni intermediate layer from a solution containing methanesulfonates of Ag, Cu and Bi; methanesulfonic acid; nonionic wetting agent; grain refining agent; resorcinol; and thiourea; wear resistance
05/06/2008US7368043 Configurations and methods of electrochemical lead recovery from contaminated soil
05/02/2008WO2008051062A1 Nickel emboss roller and manufacturing method thereof
05/01/2008US20080102360 Alkaline Electrochemical Cell With Reduced Gassing
04/2008
04/30/2008EP1915473A2 Pretreatment of magnesium substrates for electroplating
04/24/2008WO2008023339A3 Method and composition for the deposition of palladium layers and palladium alloy layers
04/24/2008US20080096044 uniform copper plating layer on silver mesh by using a plating solution containing copper sulfate pentahydrate having a copper content of 150 to 300 g/l and can form a plating layer of satisfactory thickness by electroplating to accomplish an efficient plating job without relying on electroless plating
04/24/2008US20080093222 Molten Salt Bath, Deposit, and Method of Producing Metal Deposit
04/24/2008DE102006048909A1 Method for galvanically coating a component with a chromium layer used in vehicle construction comprises depositing chromium atoms onto the surface of the component during a cathodic current impulse and further processing
04/23/2008EP1606107A4 Composite article comprising a ceramic coating
04/23/2008CN101165220A A hard gold alloy plating bath
04/23/2008CN101165219A Method for control size of electroforming nickel crystal in nickel sulphate electroforming liquid
04/23/2008CN100383293C Iron-base molybdenum disulfide composite plating liquid for tank plating and producing process thereof
04/23/2008CN100383285C Electrode for water electrolysis and its making process
04/22/2008US7361594 Method of manufacturing a thin film transistor, thin film transistor, thin film transistor circuit, electronic device, and electronic apparatus
04/22/2008US7361262 Acid plating bath and method for the electrolytic deposition of satin nickel deposits
04/22/2008US7361261 Method of preparing a chiral substrate surface by electrodeposition
04/17/2008WO2008043528A2 Cyanide-free electrolyte composition, and method for the deposition of silver or silver alloy layers on substrates
04/17/2008US20080090429 Stress metal springs; contactors; electroplating
04/17/2008US20080090414 Manufacture of electroless cobalt deposition compositions for microelectronics applications
04/17/2008US20080090108 Separator for polymer electrolyte type fuel cells and its fabrication process
04/17/2008DE112006001385T5 Separator für Brennstoffzelle und Verfahren zu dessen Herstellung A separator for fuel cell and process for its preparation
04/16/2008CN101162778A Lithium ionic cell cathode ear pole material and method for producing the same
04/16/2008CN101162270A Manufacturing technology of colorful display screen glasses lens
04/15/2008US7357853 Electroplating composite substrates
04/15/2008US7357850 Electroplating apparatus with segmented anode array
04/10/2008WO2008041706A1 Method of preparing electrolytic copper solution acidified with sulfuric acid, sulfuric-acid-acidified electrolytic copper solution prepared by the preparation method, and electrodeposited copper film
04/10/2008WO2008040761A2 Electroforming method and part or layer obtained using said method
04/10/2008US20080086195 Precoating biodegradable iron, magnesium, or magnesium oxide; placing the device in an electrolyte solution possibly including a therapeutic agent; nitriding, carbiding, or boriding by plasma electrolytic saturation; catheters, guide wires, stents with controlled release coatings; side effect reduction
04/09/2008CN100380717C Nickel-rich and manganese-rich quaternary metallic oxide material used as battery cathode
04/08/2008USRE40218 Configuration and dimensions of the deposition cell and its components are designed to provide uniform current distribution across the semiconductor substrate; flow-through anode and a diaphragm unit that provide a combination of relatively uniform flow of particle-free electrolyte
04/03/2008US20080081214 Rhenium tungsten alloy C phase; gas turbine blade, a jet engine turbine blade, a combustor, a nozzle, a boiler heat transfer pipe, a waste disposal apparatus,
04/03/2008US20080081212 Metal surface treatment composition, metal surface treatment method, and metal material
04/03/2008US20080081157 Electronic device and production methods
04/02/2008EP1905871A1 Plating solution of palladium alloy and method for plating using the same
04/02/2008EP1904669A1 Tin electrodeposits having properties or characteristics that minimize tin whisker growth
04/02/2008CN101153984A Baffle-board for back light liquid crystal display
04/02/2008CN101153405A Composition for plating
04/01/2008US7351315 Chambers, systems, and methods for electrochemically processing microfeature workpieces
04/01/2008US7351314 Chambers, systems, and methods for electrochemically processing microfeature workpieces
03/2008
03/27/2008US20080076007 Catalyst and a Method for Manufacturing the Same
03/27/2008US20080075972 Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same
03/27/2008US20080073219 Electrolytes containing coppers for electrodeposition and adjuvants comprising polyglycerol polyglycidyl ethers condensed with amines, and sulfur compounds such as 3-mercaptopropanesulfonic acid sodium salt; sheets having tensile strength
03/27/2008US20080073218 Palladium/amino acid complex; hydrogen separation membranes
03/27/2008DE102006035871B3 Verfahren zur Abscheidung von Chromschichten als Hartverchromung, Galvanisierungsbad sowie hartverchromte Oberflächen und deren Verwendung Process for the deposition of chromium layers as hard chrome plating, electroplating and hard chromed surfaces and their use
03/26/2008CN101151401A Electroplating solution for gold-tin eutectic alloy
03/26/2008CN101149226A Sintering machine slide way with Ni base surface hard alloy layer
03/26/2008CN101148775A Explosion-resisting method and device for electro-galvanizing zinc dissolving station
03/26/2008CN100377429C Steel earthing pole and its chemical nickel-plating surface processing method
03/26/2008CN100376720C Diamond surface titanium coating nickel coating copper coating composite structure and its manufacturing method
03/26/2008CN100376719C Diamond surface titanium coating nickel coating silver coating composite structure and its manufacturing method
03/26/2008CA2604421A1 Plating solution of palladium alloy and method for plating using the same
03/21/2008CA2601993A1 Composition and method for alloy having improved stress relaxation resistance
03/20/2008US20080067076 addition of aerobic bacteria ( e.g.nitrifying, pseudomonas, arthobacter) to electroplating bath solution to consume oxygen and prevents oxygen micro-bubbles from forming in the solution and becoming trapped between solution and the surface of a metal seed layer on a substrate to block plating of metal
03/20/2008DE102006042076A1 Ein neues Additiv für Chromelektrolyte A new additive for Chrome plating
03/19/2008EP1899505A2 Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition, and articles incorporating such deposits
03/19/2008EP1899504A2 Eutectic mixtures based upon multivalent metal ions
03/19/2008CN101146934A Alkaline galvanizing bath comprising a filtration membrane
03/19/2008CN101144172A High corrosion resistance nano twin crystal nickel coating and preparation method thereof
03/18/2008US7344624 Reducing power consumption in electro-refining or electro-winning of metal
03/18/2008CA2411562C Method and apparatus for treating an aqueous electroplating bath solution
03/13/2008WO2008030857A2 Sports equipment comprising diffused titanium nitride
03/13/2008WO2008029376A2 Deposition of conductive polymer and metallization of non-conductive substrates
03/13/2008WO2008029160A2 Liquid crystal templated deposition method
03/13/2008WO2008028932A1 Additive for chromic acid applications
03/13/2008US20080063897 Nodular nickel boron coating
03/13/2008US20080060945 Chromic acid anhydride; sulfuric acid; aliphatic sulfonic acid is deposited on a workpiece from an electrolyte comprising
03/13/2008CA2662714A1 Liquid crystal templated deposition method
03/13/2008CA2662238A1 A novel additive for chromium electrolytes
03/12/2008EP1897975A1 Deposition of conductive polymer and metallization of non-conductive substrates
03/12/2008EP1897974A1 Deposition of conductive polymer and metallization of non-conductive substrates
03/12/2008EP1897973A1 Deposition of conductive polymer and metallization of non-conductive substrates
03/12/2008CN101142704A Non-aqueous electrolyte and secondary battery containing same
03/12/2008CN101139727A Method for D.C. electroplating iron-based diamond drill head
03/12/2008CN101139722A Method for preparing flexible winding absorbing membrane material
03/12/2008CN101139721A Ru-Ni-Al composite coating and method for making same
03/12/2008CN101138895A Surface-treated steel sheet
03/12/2008CN100375319C Method for preparing lithium ion battery negative electrode material
03/11/2008US7342063 Dispersion for electrodeposition which has excellent shelf life and can form thin, high dielectric constant films, as well as a high dielectric constant film formed from the aqueous dispersion and electronic parts provided with the high
03/11/2008US7341946 Methods for the electrochemical deposition of copper onto a barrier layer of a work piece
03/06/2008WO2008003011A3 Improved direct current chrome plating process and variant layered chrome product
03/06/2008US20080057336 Surface-Treated Metal Materials, Method of Treating the Surfaces Thereof, Resin-Coated Metal Materials, Cans and Can Lids
03/05/2008EP1894816A2 Pivot bearing for automobile front wheel suspension
03/05/2008CN101137680A Polyvinylammonium compound, method of manufacturing same, acidic solution containing said compound and method of electrolytically depositing a copper deposit
03/04/2008US7338585 Electroplating chemistries and methods of forming interconnections
02/2008
02/28/2008WO2008023339A2 Method and composition for the deposition of palladium layers and palladium alloy layers
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