Patents for C25D 3 - Electroplating; Baths therefor (11,896)
02/2008
02/28/2008WO2007144336A3 Cr(vi)-free black chroming
02/27/2008EP1892322A1 Copper/niobium composite piping material produced by copper electroforming, process for producing the same and superconducting acceleration cavity produced from the composite piping material
02/27/2008EP1892321A2 A Hard Gold Alloy Plating Bath
02/27/2008EP1892320A1 Electrolyte composition and method for the electrolytic deposition of layers containing palladium
02/27/2008CN101133190A Producing a stable catalyst for nanotube growth
02/27/2008CN101133178A Method for producing a steel sheet protected against corrosion
02/27/2008CN101130837A Method for producing magnesium alloy containing lithium in atmospheric environment
02/27/2008CN100371502C Electrochemical electroplating electrolyte and method for electroplating surface of metal
02/26/2008US7335288 Exposing noble metal layer to electrodeposition composition comprising a copper salt, a suppressor, an accelerator and an electrolyte, initiating electrodeposition of copper on a surface of the noble metal layer by application of a predetermined current density
02/21/2008WO2008021657A1 Electrolytic looping for forming layering in the deposit of a coating
02/21/2008US20080041728 Electrolytic looping for forming layering in the deposit of a coating
02/20/2008CN101128623A Method for making ceramic electronic part, and plating bath
02/20/2008CN101126169A Thin belt continuous casting crystal roller surface electroplating method and electroplate liquid thereof
02/20/2008CN101126168A Surface treatment electrolysis copper foil, method for manufacturing the same , and circuit board
02/20/2008CN100370062C Composition for plating pure tin and electronic component employing the same
02/19/2008US7332066 Coating or coppering substrates such as semiconductor wafers in electrolytic cells to form electroconductive layers that are readily annealed at low temperatures; electrical and electronic apparatus
02/19/2008CA2396946C Method for the deposition of a chromium alloy
02/14/2008US20080038574 Electronic Component Having Tin Rich Deposit Layer and the Process for Depositing the Same
02/14/2008US20080035489 Plating process
02/14/2008US20080035486 of platinum and/or palladium; uniform thickness; aluminizing; in first stage a current magnitude is increased continuously or step-wise beginning from an initial value up to a maximum value; in second stage current magnitude is maintained constant at the maximum value; corrosion resistant; turbine blade
02/13/2008EP1576208A4 Brightener for zinc-nickel plating bath
02/13/2008CN101122038A Electro chemical machining nano Ni-Fe alloy coat and its electroplate liquid, preparation method and use
02/13/2008CN101122037A Pyrophosphate copper plating used as grounding electroplate liquid for cyanogen-free copper plating
02/13/2008CN101122036A High-strength high-plasticity nano nickel and its plating solvent and preparation method
02/13/2008CN101122022A Method for preparing Fe-6.5Wt%Si magnetically soft steel sheet
02/13/2008CN100368924C Negative magnetic permeability material in aperiodic infrared band
02/13/2008CN100368574C Porous foam nickel base alloy and its preparation method
02/07/2008WO2008016541A1 Constituent maintenance of a copper sulfate bath through chemical dissolution of copper metal
02/07/2008WO2008015051A1 Process for phosphating a metal layer
02/07/2008WO2008014987A2 Method for deposition of chromium layers as hard- chrome plating, electroplating bath and hard- chrome surfaces
02/07/2008US20080029403 Aluminum reduction cell fuse technology
02/07/2008US20080028976 Electroplated Coating of Zinc Alloy with Excellent Corrosion Resistance and Plated Metal Material Having Same
02/06/2008CN101120119A Use of nonionic surfactants in extractive metallurgy by electrolysis
02/06/2008CN101117718A Fire-resistant oxidation resistant material and preparation method thereof
02/06/2008CN100366801C Surface treatment method for environment-friendly chromium-free zirconium-containing electro-galvanized fingerprint resistant steel sheet
02/06/2008CN100366583C Method for preparing diamond film surface metal patternization
02/05/2008US7326327 Rhodium electroplated structures and methods of making same
01/2008
01/31/2008US20080023337 Metal membrane filter, and method and apparatus for the production thereof
01/31/2008US20080023218 Electrolytic plating method
01/30/2008CN201012939Y Copper and copper alloy material
01/30/2008CN101113568A Ferrous metal electromagnetic screen fabric and method for making same
01/29/2008US7323097 Electroplating method for a semiconductor device
01/24/2008WO2008011627A2 Method and device for controlling the results of deposition on substrate surfaces
01/24/2008WO2006036252A3 Controlling the hardness of electrodeposited copper coatings by variation of current profile
01/24/2008US20080017503 Electroplating apparatus
01/23/2008EP1881090A1 Electrolyte composition und process for the deposition of a zinc-nickel alloy layer on a cast iron or steel substrate
01/23/2008EP1651801B1 Aqueous, acidic solution and method for electrolytically depositing copper coatings as well as use of said solution
01/23/2008CN101109093A Method for electrodepositing nanocrystalline chromium-nickel alloy coating with carboxylic acid or its salt -urea impulse
01/23/2008CN101109085A Method for plating three-part alloy on semisteel concentric transmission line outer conductor
01/23/2008CN101108546A Flexible material and method of manufacturing the same and use thereof
01/23/2008CN101108436A Product used for fluxless brazing and its preparing method
01/16/2008CN101104369A Vacuum coating image-forming method, special-purpose equipment and product
01/16/2008CN100362141C Propanetriol non-cyanide bright copper plating liquid
01/15/2008US7318963 Composite chromium plating film and sliding member having the same and method for manufacture thereof
01/10/2008US20080008870 Fibrous nanocarbon and metal composite and a method of manufacturing the same
01/09/2008EP1876268A1 Black chromium process free of Cr-VI
01/09/2008EP1876267A2 Silver layer formed by electrosilvering substrate material
01/09/2008EP1876266A1 Electrolytic copper foil and process for producing electrolytic copper foil, surface treated elctrolytic copper foil using said electrolytic copper foil, and copper-clad laminate plate and printed wiring board using said surface treated electrolytic copper foil
01/09/2008EP1874982A1 Method for electrodeposition of bronzes
01/09/2008CN101100762A Regeneration treating agent for chloride zinc coating solution and solution regeneration treating method
01/09/2008CN101100753A Pre-processing method for aluminum product hard soldering surface and brush plating liquid used for the same
01/09/2008CN100360716C Method for producing plated molded product
01/09/2008CN100360713C Anti-corrosion heat-resistant zine diffusion alloy claddiy material
01/08/2008US7316772 Immersing substrate into an electroplating bath including ionic copper and defect reducing agent; electroplating copper deposit from bath onto substrate to fill submicron-sized reliefs whereby occurrence of protrusion defects are reduced
01/08/2008CA2428119C Brazing product having a low melting point
01/03/2008WO2008003011A2 Improved direct current chrome plating process and variant layered chrome product
01/03/2008WO2008001717A1 Aluminum deposit formed by plating, metallic member, and process for producing the same
01/03/2008CA2691344A1 Improved direct current chrome plating process and variant layered chrome product
01/02/2008EP1499451A4 Minimizing whisker growth in tin electrodeposits
01/02/2008CN101098771A Method of electroplating and pre-treating aluminium workpieces
01/02/2008CN100359994C Chip-on-film use copper foil
01/02/2008CN100359680C Lead frame and method for manufacturing the same
01/02/2008CN100359048C Conductor roll restoring method
01/01/2008US7314543 Tin deposition
01/01/2008US7314509 Gas liquid phase separator with improved pressure control
12/2007
12/27/2007WO2007147605A2 Tripyridinium compounds used as additives in aqueous alkaline baths, devoid of cyanide, for the deposition of electroplated zinc and zinc alloy coatings
12/27/2007WO2007147604A2 Aqueous, alkaline bath, devoid of cyanide, for depositing electroplated zinc alloy coatings
12/27/2007WO2007147603A2 Aqueous alkaline bath, devoid of cyanide, for the deposition of electroplated zinc and zinc alloy coatings
12/27/2007US20070297937 Method of Forming Sn-Ag-Cu Ternary Alloy Thin-Film on Base Material
12/27/2007US20070295608 Electrolytic Method For Phosphating Metallic Surfaces And Metall Layer Phosphated Thereby
12/26/2007EP1870495A1 Aqueous alkaline, cyanide-free, bath for the galvanic deposition of Zinc and Zinc alloy layers
12/26/2007CN101092731A Anodic oxidation method for raising rigidity and corrosion resistance of plated aluminum on surface of metal base
12/26/2007CN101092725A Gold plating solution, and method for plating gold
12/26/2007CN101092724A Non-cyanogen type electroplating solution for plating silver
12/26/2007CN101092723A Electroplating solution without cyanogen for plating silver
12/26/2007CN101092722A Planet gear shaft and process method
12/26/2007CN101092721A Solution in use for plating trivalent chromium, and plating method for using the plating solution
12/26/2007CN101092247A Method for preparing non-crystalline Nano composite material of Nano titania of nickel, phosphor, chrome
12/26/2007CN100357497C Preparation of microcapsule-metal composite cladding
12/25/2007US7312149 Copper plating of semiconductor devices using single intermediate low power immersion step
12/21/2007WO2007145164A1 Rolled copper or copper alloy foil with roughened surface and method of roughening rolled copper or copper alloy foil
12/21/2007WO2007144336A2 Cr(vi)-free black chroming
12/21/2007WO2007126453A3 Process for electrolytically plating copper
12/21/2007WO2007050114A3 A substantially continuous layer of embedded transient protection for printed circuit boards
12/20/2007US20070292710 Method for repairing components using environmental bond coatings and resultant repaired components
12/20/2007US20070289875 Utilizing suppressor comprising one or more ethylene oxide-propylene oxide copolymers bonded to nitrogen containing species; smoothness; preventing voids and defects
12/19/2007EP1485522A4 High speed acid copper plating
12/19/2007EP1483430A4 Non-cyanide copper plating process for zinc and zinc alloys
12/19/2007EP0857402B1 High performance flexible laminate
12/19/2007CN101088781A Process of making glass etching and silver plating ornament picture
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