| Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
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| 10/30/2008 | DE10134559B4 Verfahren zur Beschichtung von Bauteilen, mit dem Verfahren herstellbare Dispersionsschichten und Verwendung A method for coating components, can be produced by the method and use of dispersion coatings |
| 10/29/2008 | EP1984541A2 Method to electrodeposit metals using ionic liquids |
| 10/29/2008 | CN101294293A Electroplated aluminum liquid |
| 10/29/2008 | CN101294292A Electroplated aluminum liquid |
| 10/29/2008 | CN101293852A Metal plating compositions and methods |
| 10/28/2008 | US7442286 Articles with electroplated zinc-nickel ternary and higher alloys, electroplating baths, processes and systems for electroplating such alloys |
| 10/28/2008 | CA2492506C Case-hardening of stainless steel |
| 10/28/2008 | CA2450283C Electrochemically textured surface having controlled peak characteristics and the method of manufacture |
| 10/23/2008 | WO2008128102A1 Self-initiated alkaline metal ion free electroless deposition composition for thin co-based and ni-based alloys |
| 10/23/2008 | WO2008127112A2 Electrodeposition |
| 10/23/2008 | WO2008127110A1 Barrier layer and method for making the same |
| 10/23/2008 | WO2008126522A1 Copper electrolyte solution and two-layer flexible substrate obtained by using the same |
| 10/23/2008 | US20080260939 Sintered bodies based on niobium suboxide |
| 10/23/2008 | US20080257746 Method for Producing Metal Thin Body |
| 10/23/2008 | US20080257745 Excellent plating adhesion, disengaging force stability; blackish color tone without containing any controlled substances |
| 10/23/2008 | US20080257744 Method of making an integrated circuit including electrodeposition of aluminium |
| 10/23/2008 | DE102007018489A1 Aluminum-organic four-component electrolyte for separating out aluminum consists of mixture of KF complexes, AIR13 and aromatic hydrocarbon |
| 10/22/2008 | EP1983079A1 Barrier layer and method for making the same |
| 10/22/2008 | EP1983078A1 Electrodeposition |
| 10/22/2008 | EP1983077A1 Electrolyte and method for electrolytic deposition of gold-copper alloys |
| 10/22/2008 | EP1983076A2 Palladium-containing plating solution and its uses |
| 10/22/2008 | EP1711961A4 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures |
| 10/22/2008 | CN101289756A Electrolyte and method for electrolytic deposition of gold-copper alloys |
| 10/22/2008 | CN101289755A Process for modifying surface of PEMFC stainless steel bipolar plate |
| 10/22/2008 | CN100427647C Thin electroplating solution of metal indium chloride/1-methyl-3-ethyl imidazole chloride |
| 10/21/2008 | US7438794 Method of copper electroplating to improve gapfill |
| 10/16/2008 | US20080254311 Palladium-containing plating solution and its uses |
| 10/16/2008 | US20080251390 Acidic solution which contains platinum-based chloride and alloy chloride and ethylene glycol are introduced into reactor as electrodeposition solution; by applying external negative potential platinum or platinum alloy particles are deposited on substrate; increased dispersion |
| 10/16/2008 | US20080251389 Metal Laminate |
| 10/15/2008 | EP1979510A1 Method for producing an alloy having a predetermined composition with three or more components |
| 10/15/2008 | CN101287862A Process for producing composite-plated material |
| 10/15/2008 | CN101287354A Electro-magnetic shielding material of tin-nickel alloy and preparing method thereof |
| 10/15/2008 | CN101285203A Pd-containing plating solution and uses thereof |
| 10/15/2008 | CN101284438A High mesh size print cylinder mould production method |
| 10/14/2008 | US7435320 Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions |
| 10/09/2008 | WO2008029160A3 Liquid crystal templated deposition method |
| 10/09/2008 | US20080245670 Electrochemical Detection of Arsenic |
| 10/08/2008 | EP1978134A1 Metal plating compositions |
| 10/08/2008 | EP1978129A2 Method for forming corrosion-resistant film and high-temperature apparatus member |
| 10/08/2008 | EP1978051A1 Metal plating compositions and methods |
| 10/08/2008 | CN101280453A Preparation of anode with trivalent chromium chrome plating coating |
| 10/08/2008 | CN101280452A Nickel-nanodiamond composite plating solution and preparation thereof |
| 10/08/2008 | CN101280445A Electroplating process for surface of magnesium alloy motorcycle hub |
| 10/08/2008 | CN101280443A Preparation of secondary alloyed nickel-molybdenum-electroplated steel strip |
| 10/08/2008 | CN101280442A Preparation of one-dimensional Fe3O4 nano-needle material having modulated structure |
| 10/08/2008 | CN101280441A Nickel electroplating method for bonded Nd-Fe-B magnet |
| 10/08/2008 | CN101280440A Whole sulphate type trivalent chromium plating solution and electroplating method using the same |
| 10/08/2008 | CN101280439A Bright brush plating nano-chromium solution and preparation thereof |
| 10/08/2008 | CN100424232C Nickel electric plating liquid |
| 10/07/2008 | US7431817 Electroplating solution for gold-tin eutectic alloy |
| 10/07/2008 | US7431815 In an iron alloy electroplating process, applying a positive auxiliary potential between the working electrode and reference electrode for a certain period of time to cathodically reduce ferric ions to ferrous ions; auxiliary potential determines the certain number of Fe+3 ions converted to Fe+2 ions |
| 10/02/2008 | WO2008116545A1 Electrolyte and method for depositing decorative and technical layers of black ruthenium |
| 10/02/2008 | US20080241517 Aluminum-plated components of semiconductor material processing apparatuses and methods of manufacturing the components |
| 10/02/2008 | US20080241482 Rhodium electroplated structures and methods of making same |
| 10/02/2008 | US20080237053 Structure comprising a barrier layer of a tungsten alloy comprising cobalt and/or nickel |
| 10/02/2008 | US20080237051 Method and plating bath for depositing a magnetic film |
| 10/02/2008 | US20080237049 Ion-implanted electroformed structural material and method of producing the structural material |
| 10/02/2008 | US20080236441 Aqueous eletrodeposition of magnetic cobalt-samarium alloys |
| 10/01/2008 | EP1975282A1 Electrolyte and method for separating decorative and technical layers from black ruthenium |
| 10/01/2008 | EP1974065A1 Galvanized rolling-hardened cold-rolled flat product and process for producing it |
| 10/01/2008 | CN101275255A Maintenance method for alkaline non-cyanide plating copper |
| 10/01/2008 | CN101275254A High efficiency chromium electroplating method for low and middle continuous processing line |
| 10/01/2008 | CN100421787C Platinum icosahedron nano crystal catalyst, its preparing method and use |
| 09/30/2008 | US7429401 Two-step process involving immersion in a catalyst-containing solution, followed by electrolytic deposition in a second solution that need not contain catalyst; produces a a seam-free and void-free metal microelectronic conductor. |
| 09/25/2008 | WO2006110864A3 Method for improving surface roughness during electro-polishing |
| 09/25/2008 | US20080230394 Coating containing zirconium; acidity pH; corrosion resistance |
| 09/25/2008 | US20080230263 Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board |
| 09/24/2008 | CN101273157A Zinc-nickel alloy electroplating system |
| 09/24/2008 | CN101270492A Stannum copper alloy coating, plating solution prescription and electroplating method |
| 09/24/2008 | CN101270491A Galvano-chemistry preparation method for electrochromic magnesium-nickel alloy film |
| 09/24/2008 | CN101270490A Dissipated metal indium chloride/chloridization 1-methyl-3-butyl imidazole system plating solution |
| 09/24/2008 | CN101270480A Method for preparing metallic titanium or plated titanium by electrolyzing titanic chloride with ion liquid |
| 09/24/2008 | CN101269557A Composite binding course material and method for producing composite binding course by using combination of plating and electro beam physics vapour deposition |
| 09/23/2008 | US7427344 Methods for determining organic component concentrations in an electrolytic solution |
| 09/23/2008 | CA2342219C Aqueous alkaline cyanide-free bath for the galvanic deposition of zinc or zinc alloy coatings |
| 09/18/2008 | US20080227911 Cathodic electrodeposition coating compositions |
| 09/18/2008 | US20080226976 Alkaline Electrochemical Cell with Reduced Gassing |
| 09/18/2008 | US20080223726 Polyamine Brightening Agent |
| 09/17/2008 | EP1969161A2 High speed tin plating process |
| 09/17/2008 | EP1969160A1 Electrolyte and process for depositing a matt metal layer |
| 09/17/2008 | EP1969032A1 Crosslinked polymers, galvanization baths comprising them and use thereof |
| 09/17/2008 | CN201116310Y Single carbon block clamp |
| 09/17/2008 | CN101265601A Aluminium alloy surface electric plating iron machining process |
| 09/17/2008 | CN101265549A Foam iron-nickel composite metal material and preparation method thereof |
| 09/17/2008 | CN100419129C Electrolyte for copper plating |
| 09/16/2008 | US7425255 Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition |
| 09/12/2008 | WO2008108263A1 Screw joint for steel pipe |
| 09/11/2008 | US20080220241 With a nanoporous layer of platinum, palladium, gold, silver, nickel, cobalt, copper, iron, lead, tin or indium deposited on a porous support with a flat surface; regular pore structure and uniform pore size |
| 09/11/2008 | US20080217167 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 09/11/2008 | US20080217166 Apparatus and methods for electrochemical processsing of microelectronic workpieces |
| 09/11/2008 | US20080217165 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 09/10/2008 | CN101263247A Electroplating composition for coating a substrate surface with a metal |
| 09/10/2008 | CN101260559A Technique for purifying nickel-plating liquid by extracting sprinkling method |
| 09/10/2008 | CN101260553A Electroplating device for printed breadboard |
| 09/10/2008 | CN101260552A Surface reproducing method for root canal appliance |
| 09/10/2008 | CN101260551A Non-cyanide silver electroplating method |
| 09/10/2008 | CN101260549A Non-preplating type non-cyanide silver-plating electroplate liquid |
| 09/10/2008 | CN101259410A Method for preparing platinum catalyst by electrodeposition |
| 09/04/2008 | US20080210569 Polyvinylammonium Compound, Method of Manufacturing Same, Acidic Solution Containing Said Compound and Method of Electrolytically Depositing a Copper Deposit |
| 09/04/2008 | US20080210568 Electrolytic Copper Plating Method, Phosphorous Copper Anode for Electrolytic Copper Plating, and Semiconductor Wafer having Low Particle Adhesion Plated with said Method and Anode |