| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 07/18/2002 | WO2002004702A3 Electroless platinum-rhodium alloy plating |
| 07/18/2002 | WO2001077409A3 Method for the selective, metal-based activation of substrate surfaces for the wet-chemical metal deposition without external current and a means therefore |
| 07/18/2002 | US20020094449 Laminated structure for electronic equipment and method of electroless gold plating |
| 07/18/2002 | US20020094433 Electrically conductive foam and method of preparation thereof |
| 07/18/2002 | US20020094372 Applying a first sol for forming the piezoelectric film on a substrate having the lower electrode, to form a lower film, applying second sol having greater lead content than first sol to form upper film, heat treating the films |
| 07/18/2002 | US20020092472 Method of liquid deposition by selection of liquid viscosity and other precursor properties |
| 07/17/2002 | EP1223232A1 Process for depositing a metal coating containing nickel and boron |
| 07/17/2002 | CN1359429A 涂敷方法 Coating method |
| 07/16/2002 | US6420437 Titanium oxide colloidal sol and process for the preparation thereof |
| 07/16/2002 | US6419748 Continuous ceramic composite plating method and apparatus for long doctor base materials |
| 07/11/2002 | WO2002053801A2 Electroless copper plating of ferrous metal substrates |
| 07/11/2002 | US20020090506 EMI protective venting element for electronic housings |
| 07/11/2002 | US20020090458 Process for depositing a film on a nanometer structure |
| 07/11/2002 | DE10064057A1 Riemenscheibe mit mikroprofilierter Oberfläche Pulley with micro-profiled surface |
| 07/10/2002 | CN1358244A Article of clothing having antibacterial, antifungal, and antiyeast properties |
| 07/10/2002 | CN1358238A Corrosion resistant component of semiconductor processing equipment and method of manufacturing thereof |
| 07/10/2002 | CN1357647A Wiring substrate and its making process and chemical copper plating solution therein |
| 07/09/2002 | US6417062 Method of forming ruthenium oxide films |
| 07/09/2002 | US6416812 Electroless plating bath using source of cupric ions, reducing agent and complexing agent in basic solution |
| 07/04/2002 | WO2002052063A1 Coating compositions containing nickel and boron and particles |
| 07/04/2002 | US20020086102 Pre-heating the workpiece, prior to immersion thereof in electroless plating solution, to temperature approximately equal to or above operating temperature of electroless plating bath |
| 07/04/2002 | US20020084193 Contacting a metal seed layer with a copper colloid composition including a minor amount of ionizable palladium compound |
| 07/03/2002 | EP1218315A2 Process for making chemically bonded sol-gel ceramics |
| 07/03/2002 | CN1356336A Selectively coating metal to nucleic acid by nano metal particles generated in-situ |
| 07/02/2002 | US6413883 Method of liquid deposition by selection of liquid viscosity and other precursor properties |
| 07/02/2002 | US6413578 Applying ceramic paste; heating |
| 07/02/2002 | US6412966 Article having at least a portion of the outer surface thereof coated with a metallic mirror surface |
| 06/27/2002 | WO2002050330A2 Method for improving metal surfaces to prevent thermal tarnishing |
| 06/27/2002 | WO2001077410A3 Activator metals that are encapsulated in vesicles or metal clusters that adhere to vesicles and a method for producing same |
| 06/27/2002 | US20020081843 Semicoductor device and method of manufacturing of the same |
| 06/27/2002 | US20020080588 Probe card assembly and kit, and methods of making same |
| 06/27/2002 | US20020079226 Plating method and plating bath precursor used therefor |
| 06/27/2002 | DE10064134A1 Verfahren zum Veredeln von metallischen Oberflächen zur Vermeidung von thermischen Anlauf-Farben A method for refining metal surfaces to avoid thermal run-colors |
| 06/26/2002 | EP1217260A1 Pulley with micro-profiled surface |
| 06/26/2002 | EP1216486A1 Methods and apparatus for treating seed layer in copper interconnections |
| 06/26/2002 | EP0894156A4 Removal of orthophosphite ions from electroless nickel plating baths |
| 06/25/2002 | US6410985 Silver metallization by damascene method |
| 06/25/2002 | US6410098 Process for preparing copper-film-plated steel cord for vehicle tire |
| 06/25/2002 | US6409849 Method of producing hydrogen-absorbing alloy for nickel-hydrogen alkaline storage cell |
| 06/25/2002 | CA2065626C Corrosion resistant zn or part-zn plated steel sheet and method of producing the same |
| 06/20/2002 | WO2002026400A8 Method and apparatus for applying controlled succession of thermal spikes or shockwaves through a medium |
| 06/20/2002 | US20020077520 Device and method for dilating and irradiating a vascular segment or body passageway |
| 06/20/2002 | US20020076926 Method of manufacturing chip type electronic parts |
| 06/20/2002 | US20020076497 Method of forming selective electroless plating on polymer surfaces |
| 06/20/2002 | DE10159569A1 Kompressoren Compressors |
| 06/20/2002 | DE10058822A1 Process for treating a carrier film made from a plastic or polymer comprises applying a functional layer as conducting path on the film so that material parts enter recesses of the functional layer to anchor the layer in the foil |
| 06/19/2002 | EP1214739A2 Copper deposit process |
| 06/19/2002 | CN1354278A Temperature-controlled stirring equipment for chemical plating bath |
| 06/18/2002 | US6406750 Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide film |
| 06/18/2002 | US6406743 Integrated circuits |
| 06/13/2002 | WO2002047446A2 Process for selectively plating areas of a substrate |
| 06/13/2002 | WO2002047139A2 Methode of forming a copper film on a substrate |
| 06/13/2002 | WO2002046493A1 Method for producing noble metal thin film electrode for usli |
| 06/13/2002 | WO2002046492A1 Process for producing plating solution for electroless platinum plating, plating solution for electroless platinum plating, and method of electroless platinum plating |
| 06/13/2002 | WO2002046281A1 Resin composite material and method of forming the same |
| 06/13/2002 | WO2002023962A3 Method for the formation of a pattern on an insulating substrate |
| 06/13/2002 | US20020071961 Material for electronic components, method of connecting material for electronic components, ball grid array type electronic components and method of connecting ball grid array type electronic components |
| 06/13/2002 | US20020069788 Plating catalysts and electronic packaging substrates plated therewith |
| 06/12/2002 | EP0870075B1 Film or coating deposition and powder formation |
| 06/11/2002 | US6403168 Electronics |
| 06/11/2002 | US6403161 Process for depositing layers of zirconium oxide using soluble powders |
| 06/06/2002 | WO2002045155A2 ELECTROLESS METHOD OF SEED LAYER DEPOSITION, REPAIR, AND FABRICATION OF Cu INTERCONNECTS |
| 06/06/2002 | WO2002036273A8 Catalyst solutions useful in activating substrates for subsequent plating |
| 06/06/2002 | US20020068188 Method for depositing metal and metal oxide films and patterned films |
| 06/06/2002 | US20020068127 Process for selectively plating areas of a substrate |
| 06/06/2002 | US20020067181 Probe card assembly and kit, and methods of making same |
| 06/06/2002 | US20020066671 Seed layer deposition |
| 06/06/2002 | US20020066665 Cup - type plating apparatus |
| 06/05/2002 | EP1211334A2 Electroless Ni-B plating liquid, electronic device and method for manufacturing the same |
| 06/05/2002 | EP1210732A1 Reduced electromigration and stress induced migration of cu wires by surface coating |
| 06/04/2002 | US6399154 Laminate article |
| 06/04/2002 | US6398936 Cleaning and drying; wetting with an aqueous solution of cupric sulfate and glacial acetic acid; dripping on a rotating zinc disk, to conduct a displacement reaction without requiring heat treatment by high-temperature hydrogen |
| 06/04/2002 | US6398935 Method for manufacturing pcb's |
| 06/04/2002 | US6398856 Alkylenediamine or polyamine, hydrazine or hypophosphite reducing agent, and gold cyanide; direct thin film deposition on nickel metal or alloy solder ball; minimized drop of shear strength resulting from heat history |
| 06/04/2002 | US6398855 Method for depositing copper or a copper alloy |
| 06/04/2002 | US6398854 Chemical solution for forming silver film and process for forming silver film using same |
| 05/30/2002 | WO2002043131A1 Tantalum oxide film, use thereof, and method and composition for forming the same |
| 05/30/2002 | WO2002042514A1 Method for treating carrier films by means of heavy ion irradiation |
| 05/30/2002 | WO2002042214A1 Ferrite thin film for high frequency and method for preparation thereof |
| 05/30/2002 | WO2001032951A9 Chemical fluid deposition for the formation of metal and metal alloy films on patterned and unpatterned substrates |
| 05/30/2002 | US20020065242 Selective metallisation of nucleic acids via metal nanoparticles produced in-situ |
| 05/30/2002 | US20020064947 Wiring substrate and manufacturing method of the same along with electroless copper plating solution used therefor |
| 05/30/2002 | US20020064676 Copper circuitry, and a finish coating of tin, and an alloy cap layer of at least two immersion-platable metals (tin and silver for example); solderable for at least a year |
| 05/30/2002 | US20020064592 Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects |
| 05/30/2002 | US20020063062 Depositing a copper seed layer over dielectric layer and into etched features of dielectric layer having a barrier layer; treating copper seed layer to remove oxidized layer from over copper seed layer; electroplating copper fill layer |
| 05/30/2002 | US20020062760 Useful in metallizing printed circuit boards |
| 05/29/2002 | EP1209958A2 Laminated structure for electronic equipment and method of electroless gold plating |
| 05/29/2002 | EP1209695A1 Selective metallisation of nucleic acids via metal nanoparticles produced in-situ |
| 05/29/2002 | EP1208262A1 An article of clothing having antibacterial, antifungal, and antiyeast properties |
| 05/29/2002 | DE10053681A1 EMI abschirmendes Belüftungselement EMI shielding ventilation element |
| 05/29/2002 | CN1351359A Electronic element and manufacture thereof |
| 05/28/2002 | US6395402 Activation; electroless plating of metal |
| 05/28/2002 | US6395329 Printed circuit board manufacture |
| 05/28/2002 | US6395164 Copper seed layer repair technique using electroless touch-up |
| 05/28/2002 | US6394618 Coating process for forming a metallic mirror surface on a receiving surface |
| 05/23/2002 | US20020061403 Method of gilding quartz or high aluminum-oxide-containing tube durable under high temperature and high voltage, and gilded quartz or high aluminum-oxide-containing tube applied in ozone generator |
| 05/23/2002 | US20020061363 Method of making nanoshells |
| 05/22/2002 | EP1055015B1 Method for producing a micromechanical device |
| 05/22/2002 | CN1350071A Wet chemical prepn process of leadless functional barium titanate ceramic film |
| 05/21/2002 | US6391770 Method of manufacturing semiconductor device |